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A modified model of conductor roughness for manufacturing copper lines of printedcircuit board

Chong Wang, Yingjie Wang, Kegu Adi, Yunzhong Huang, Yuanming Chen, Shouxu Wang, Wei He, Yao Tang, Yukai Sun, Weihua Zhang, Chenggang Xu, Xuemei He

Circuit World

ISSN: 0305-6120

Article publication date: 12 August 2021

Issue publication date: 24 November 2022

186

Abstract

Purpose

The purpose of this paper is to establish an accurate model to quantify the effect of conductor roughness on insertion loss (IL) and provide improved measurements and suggestions for manufacturing good conductive copper lines of printed circuit board.

Design/methodology/approach

To practically investigates the modified model of conductor roughness, three different kinds of alternate oxidation treatments were used to provide transmission lines with different roughness. The IL results were measured by a vector net analyzer for comparisons with the modified model results.

Findings

An accurate model, with only a 1.8% deviation on average from the measured values, is established. Compared with other models, the modified model is more reliable in industrial manufacturing.

Originality/value

This paper introduces the influence of tiny roughness structures on IL. Besides, this paper discusses the effect of current distribution on IL.

Keywords

Acknowledgements

The authors gratefully acknowledge the support of the National Natural Science Foundation of China (Nos 51801018 and 61974020). This work is also supported by the Innovation Team Project of Zhuhai City (No. ZH0405190005PWC) and the projects of Sci and Tech planning of Guangdong Province (No. 2019B090910003) and Zhuhai City (No. ZH01084702180040HJL).

Citation

Wang, C., Wang, Y., Adi, K., Huang, Y., Chen, Y., Wang, S., He, W., Tang, Y., Sun, Y., Zhang, W., Xu, C. and He, X. (2022), "A modified model of conductor roughness for manufacturing copper lines of printedcircuit board", Circuit World, Vol. 48 No. 4, pp. 493-501. https://doi.org/10.1108/CW-10-2019-0144

Publisher

:

Emerald Publishing Limited

Copyright © 2021, Emerald Publishing Limited

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