– The purpose of this paper is to look at innovation and the tension which arises between proprietorship and standardization.
Abstract
Purpose
The purpose of this paper is to look at innovation and the tension which arises between proprietorship and standardization.
Design/methodology/approach
The paper presents an analysis of the learning curve theory in relation to the printed circuit board industry.
Findings
The measurable impact of the learning curve will be different depending on a number of factors commonly found in the printed circuit industry – degree of process maturity/automation, run lengths, and presence of customized elements requiring modifications to process flow, materials, or procedures.
Originality/value
There is no escape from continuing and inexorable downward price pressure from entrenched expectations and trends. A clear understanding of how these work will confer a competitive advantage to the strategist concerned with bringing innovative technologies to the marketplace.
Details
Keywords
William Burr, Nick Pearne and Francesca Stern
The purpose of this paper is to a provide short introductory overview of metal in board (MiB) circuit technologies for use in thermal management applications.
Abstract
Purpose
The purpose of this paper is to a provide short introductory overview of metal in board (MiB) circuit technologies for use in thermal management applications.
Design/methodology/approach
The paper details the types of metal in printed circuit boards (PCBs) that are possible and the mix of key features each exhibits. These combinations offer a mix of capabilities in thermal management, current conduction, interconnect density, material usage and cost that can be chosen to suit a specific application. Examples of these board types and their uses are considered.
Findings
Metal core and insulated metal substrate (IMS) PCBs are categories of PCB technologies which provide enhanced thermal management and current carrying capability. MiB technologies are based on conventional printed circuit materials and processes. This gives MiB a range of thermal and current handling characteristics which are particularly suited to a number of key existing and emerging applications.
Research limitations/implications
Further research and development in materials, processes and designs will help broaden the applicability of these types of boards, enabling them to encompass even more thermal management applications.
Originality/value
The paper shows that with 15 different types of metal core and metal backed PCB technologies available to handle thermal dissipation in power electronics, there is one to suit almost every application. This current and emerging portfolio of MiB types offers solutions which can handle thermal loads associated with power densities from about 0.25 W/cm2 to 10‐15 W/cm2 and currents from 20 A up to approximately 1000 A.
Details
Keywords
A one‐day Technical Symposium on Printed Circuits will be held at the Swan Diplomat Hotel at Streatley on Thames, Berkshire, on Thursday 29 March 1990.
A Workshop sponsored by the EIPC in an attempt to provide insight into data transfer technology and its use for the printed circuit board industry was held in Berlin on 11–12 May…
Abstract
A Workshop sponsored by the EIPC in an attempt to provide insight into data transfer technology and its use for the printed circuit board industry was held in Berlin on 11–12 May. Course notes on the EIPC Electronic Data Transfer Committee (EDT Committee) and its activities were provided and the electronic host system, ECIS (EIPC Communication and Information System), was explained in detail.
OK, listen up. Here's how to win the 500‐meter freestyle swimming event at the next Olympics: Swim faster than your competitors do. Simple, absolutely true, but not easy advice to…
Abstract
OK, listen up. Here's how to win the 500‐meter freestyle swimming event at the next Olympics: Swim faster than your competitors do. Simple, absolutely true, but not easy advice to work with. You'll find the same sort of advice in the books in this issue's Stack.
It's not enough to simply acquire alternative and small‐press materials. They must also be made easily accessible to library users by means of accurate, intelligible, and thorough…
Mark Pearcy and Michael Dotson
“Affairs of honor,” which were contests between gentlemen of the 18th and 19th centuries, often ended with physical violence in the form of dueling. Such was the case in the…
Abstract
“Affairs of honor,” which were contests between gentlemen of the 18th and 19th centuries, often ended with physical violence in the form of dueling. Such was the case in the notable showdown between Alexander Hamilton and Aaron Burr in 1801. These affairs were products of the code di duello, an intricate series of social rules and expectations through which adversaries negotiated their dispute. In this article, we examine the similarities between such “affairs” and the modern issue of “cyberbullying.” We compare disputes conducted under the code di duello to those which regularly occur in modern adolescents’ on-line lives while also considering the relevance of studying this topic in social studies classrooms.