Search results

1 – 10 of over 2000
Per page
102050
Citations:
Loading...
Access Restricted. View access options
Article
Publication date: 16 January 2018

Peng Yao, Xiaoyan Li, Fengyang Jin and Yang Li

This paper aims to analyze the morphology transformation on the Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging.

313

Abstract

Purpose

This paper aims to analyze the morphology transformation on the Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging.

Design/methodology/approach

Because of the infeasibility of analyzing the morphology transformation intuitively, a novel equivalent method is used. The morphology transformation on the Cu3Sn grains, during the formation of full Cu3Sn solder joints, is regarded as equivalent to the morphology transformation on the Cu3Sn grains derived from the Cu/Sn structures with different Sn thickness.

Findings

During soldering, the Cu3Sn grains first grew in the fine equiaxial shape in a ripening process until the critical size. Under the critical size, the Cu3Sn grains were changed from the equiaxial shape to the columnar shape. Moreover, the columnar Cu3Sn grains could be divided into different clusters with different growth directions. With the proceeding of soldering, the columnar Cu3Sn grains continued to grow in a feather of the width growing at a greater extent than the length. With the growth of the columnar Cu3Sn grains, adjacent Cu3Sn grains, within each cluster, merged with each other. Next, the merged columnar Cu3Sn grains, within each cluster, continued to merge with each other. Finally, the columnar Cu3Sn grains, within each cluster, merged into one coarse columnar Cu3Sn grain with the formation of full Cu3Sn solder joints. The detailed mechanism, for the very interesting morphology transformation, has been proposed.

Originality/value

Few researchers focused on the morphology transformation of interfacial phases during the formation of full intermetallic compounds joints. To bridge the research gap, the morphology transformation on the Cu3Sn grains during the formation of full Cu3Sn solder joints has been studied for the first time.

Details

Soldering & Surface Mount Technology, vol. 30 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Access Restricted. View access options
Article
Publication date: 18 February 2019

Peng Yao, Xiaoyan Li, Xu Han and Liufeng Xu

This study aims to analyze the shear strength and fracture mechanism of full Cu-Sn IMCs joints with different Cu3Sn proportion and joints with the conventional interfacial…

647

Abstract

Purpose

This study aims to analyze the shear strength and fracture mechanism of full Cu-Sn IMCs joints with different Cu3Sn proportion and joints with the conventional interfacial structure in electronic packaging.

Design/methodology/approach

The Cu-Sn IMCs joints with different Cu3Sn proportion were fabricated through soldering Cu-6 μm Sn-Cu sandwich structure under the extended soldering time and suitable pressure. The joints of conventional interfacial structure were fabricated through soldering Cu-100 μm Sn-Cu sandwich structure. After the shear test was conducted, the fracture mechanism of different joints was studied through observing the cross-sectional fracture morphology and top-view fracture morphology of sheared joints.

Findings

The strength of joints with the conventional interfacial structure was 26.6 MPa, while the strength of full Cu-Sn IMCs joints with 46.7, 60.6, 76.7 and 100 per cent Cu3Sn was, respectively, 33.5, 39.7, 45.7 and 57.9 MPa. The detailed reason for the strength of joints showing such regularity was proposed. For the joint of conventional interfacial structure, the microvoids accumulation fracture happened within the Sn solder. However, for the full Cu-Sn IMCs joint with 46.7 per cent Cu3Sn, the cleavage fracture happened within the Cu6Sn5. As the Cu3Sn proportion increased to 60.6 per cent, the inter-granular fracture, which resulted in the interfacial delamination of Cu3Sn and Cu6Sn5, occurred along the Cu3Sn/Cu6Sn5 interface, while the cleavage fracture happened within the Cu6Sn5. Then, with the Cu3Sn proportion increasing to 76.7 per cent, the cleavage fracture happened within the Cu6Sn5, while the transgranular fracture happened within the Cu3Sn. The inter-granular fracture, which led to the interfacial delamination of Cu3Sn and Cu, happened along the Cu/Cu3Sn interface. For the full Cu3Sn joint, the cleavage fracture happened within the Cu3Sn.

Originality/value

The shear strength and fracture mechanism of full Cu-Sn IMCs joints was systematically studied. A direct comparison regarding the shear strength and fracture mechanism between the full Cu-Sn IMCs joints and joints with the conventional interfacial structure was conducted.

Details

Soldering & Surface Mount Technology, vol. 31 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Access Restricted. View access options
Article
Publication date: 20 October 2020

Izzy Yi Jian, Edwin H.W. Chan and Terry Ye Peng Yao

POSPD, as supplementation of public open spaces (POS), has become a common policy to moderate the intensification of urbanization. However, some access restrictions, both physical…

309

Abstract

Purpose

POSPD, as supplementation of public open spaces (POS), has become a common policy to moderate the intensification of urbanization. However, some access restrictions, both physical and information-wise, were deliberately designed by private developers to reserve the POSPD for their own gains, which further hampers POSPD’s publicness and leads to their failure to bear social responsibilities.

Design/methodology/approach

By analyzing the current situation of the availability of public open space in private developments (POSPD) from the perspective of information justice, this research aims at proposing a policy framework for an “accessible and interactive platform” which advocates promoting informational justice by integrating public participation into the establishment of an interaction loop to promote the revitalization of POSPD. The methodology includes the review of previous solutions and platforms, the establishment of a POSPD database and geographic information system (GIS) analysis.

Findings

The POSPD in Hong Kong are unevenly distributed physically while the information about them is injustice and inadequate. Understanding the existing informational injustice associated with POSPD and revitalizing the stock spaces is timely and vital. Using the user-generated data from volunteers as the information flow, the proposed responsive POSPD platform will provide continuous positive feedback for policy improvement to help realize the collaborative management and sustainable development of the POS.

Originality/value

Making use of information and communication technology (ICT) to extend the “public” to the “internet-based”, the proposed framework regards the exploitation of ICT to enhance information justice as a novel way to revitalize POSPD. It involves collaborative operation among citizen participation and official POS management.

Access Restricted. View access options
Article
Publication date: 22 August 2023

Michael Yao Ping Peng, Meng-Hsiu Lee and Ya-Hui Huang

The purpose of this study is to examine the relationship between positive emotion, self-efficacy, job satisfaction and turnover intention in the context of resource building…

206

Abstract

Purpose

The purpose of this study is to examine the relationship between positive emotion, self-efficacy, job satisfaction and turnover intention in the context of resource building during the socialization process of new faculty members, particularly in the context of the coronavirus disease 2019 (COVID-19) pandemic.

Design/methodology/approach

The study utilizes a quantitative research design and employs purposive sampling to obtain 554 valid questionnaires. The study analyzes the relationship between positive emotion, self-efficacy, job satisfaction and turnover intention and examines the influence of strategic human resource management (SHRM) on these variables.

Findings

The results of the study reveal that SHRM positively influences positive emotion and self-efficacy, which, in turn, positively impact job satisfaction. However, positive emotion is negatively related to turnover intention.

Originality/value

This study contributes to the existing literature on human resource management (HRM) by examining the impact of strategic HRM on the socialization process of new faculty members. The findings of the study have significant practical implications for the implementation of HRM in research-oriented universities.

Access Restricted. View access options
Article
Publication date: 1 November 2018

Peng Yao and Xinxin Wang

Nowadays, many weak brands have acquired strong international brands to accelerate their internationalization. However, “the weakers acquire the strongers” model of M&A leads to…

1010

Abstract

Purpose

Nowadays, many weak brands have acquired strong international brands to accelerate their internationalization. However, “the weakers acquire the strongers” model of M&A leads to many consumers’ loss. The purpose of this paper is to explore the relationships between the brand strategy after the M&A, brand authenticity and consumer purchase intention through two experiments.

Design/methodology/approach

Building on an extensive literature review, the authors identify four hypotheses. Hypotheses were tested on data collected across 190 Chinese consumers.

Findings

The results show that the decline of consumer purchase intention was mainly caused by the falling consumer assesses on brand authenticity; the different post-merger brand strategies have significant difference on brand authenticity and consumer purchase intention, and self-brand connection played a moderate role between brand authenticity and consumer purchase intention.

Originality/value

The research reveals the reasons for consumer loss after mergers and acquisitions and provides empirical insights into how post-merger brand strategies can be manifested to convey brand authenticity as well as to build consumers’ purchase intention. In addition, the findings confirm the role of self-brand connection.

Details

Journal of Contemporary Marketing Science, vol. 1 no. 1
Type: Research Article
ISSN: 2516-7480

Keywords

Access Restricted. View access options
Article
Publication date: 18 December 2024

Hao Li and Yao Peng

Empirical evidence indicates that cross-industry cooperation is a popular promotional format in which retailers can engage in market resource sharing and exchange. Although many…

18

Abstract

Purpose

Empirical evidence indicates that cross-industry cooperation is a popular promotional format in which retailers can engage in market resource sharing and exchange. Although many retailers participate in cross-industry joint promotion by issuing coupons to each other, the degree of correlation between cross-industry products and the consumer switching behavior can significantly impact the promotional effect of these coupons. The purpose of this paper is to investigate the effectiveness of the cross-industry joint promotion and the optimal coupon distribution strategy of retailers based on these two factors.

Design/methodology/approach

This paper analyzes the four cases of no cross-industry joint promotion, unilateral issuance of coupons and bilateral issuance of coupons, and discusses the best coupon distribution strategy for retailers based on the degree of product correlation and consumer switching costs. Furthermore, the applicability of the coupon distribution strategy is enhanced by incorporating numerical analysis.

Findings

The results show that the retailers can improve their income level by implementing cross-industry joint promotion. The retailers always price higher when only their promotional partners distribute coupons. When the degree of product correlation and consumer switching costs are high, the retailers issuing cross-industry coupons bilaterally is the optimal joint promotion strategy. When the degree of product correlation or consumer switching costs are low, the low-value retailer issuing coupons can achieve a win-win situation for retailers.

Originality/value

This paper addresses an interesting and practical issue related to the coupon distribution strategies based on the product correlation and consumer switching behavior, thereby providing new theoretical value and managerial implications for retailers to choose the optimal joint promotion strategy under different market conditions.

Details

Asia Pacific Journal of Marketing and Logistics, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1355-5855

Keywords

Access Restricted. View access options
Article
Publication date: 18 February 2019

Li Yang, Li Xiaoyan and Peng Yao

The purpose of this paper is to investigate the diffusion behaviors of different atoms at the Cu/Cu3Sn interface and the vacancy formation energy, diffusion energy barrier and…

273

Abstract

Purpose

The purpose of this paper is to investigate the diffusion behaviors of different atoms at the Cu/Cu3Sn interface and the vacancy formation energy, diffusion energy barrier and vacancy diffusion activation energy.

Design/methodology/approach

The diffusion behaviors of different atoms at the Cu/Cu3Sn interface are analyzed, and the vacancy formation energy, diffusion energy barrier and vacancy diffusion activation energy are obtained using molecular dynamics simulation. The nudged elastic band method is used to evaluate diffusion energy barrier for Cu/Cu3Sn system.

Findings

It is found that the vacancies in the Cu/Cu3Sn interface promote the interfacial diffusion, and the formation energy of Cu vacancy in the Cu crystal is larger than that in Cu3Sn crystal. In addition, the formation energies of Cu1 vacancy and Cu2 vacancy are close to each other in Cu3Sn crystal, and they are all less than the formation energy of Sn vacancy. Furthermore, the vacancy diffusion barrier and vacancy diffusion activation energy of the Cu/Cu3Sn interface are calculated, and the results show that the vacancy diffusion activation energy of Sn was higher than that of Cu. Finally, by comparison of diffusion activation energies of different diffusion mechanisms, Cu→Cu1vac is the most possible migration path at all temperatures.

Originality/value

It is concluded that the vacancies in Cu/Cu3Sn interface promote interfacial diffusion, and the activation energy of vacancy diffusion in most diffusion mechanisms decreases with the increase of temperature.

Details

Soldering & Surface Mount Technology, vol. 31 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Access Restricted. View access options
Article
Publication date: 25 January 2021

Xu Han, Xiaoyan Li, Peng Yao and Dalong Chen

This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times.

272

Abstract

Purpose

This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times.

Design/methodology/approach

Solder joints with different microstructures are obtained by ultrasonic-assisted soldering. To analyze the effect of ultrasounds on Cu6Sn5 growth during the solid–liquid reaction stage, the interconnection heights of solder joints are increased from 30 to 50 μm.

Findings

Scallop-like Cu6Sn5 nucleate and grow along the Cu6Sn5/Cu3Sn interface under the traditional soldering process. By comparison, some Cu6Sn5 are formed at Cu6Sn5/Cu3Sn interface and some Cu6Sn5 are randomly distributed in Sn when ultrasonic-assisted soldering process is used. The reason for the formation of non-interfacial Cu6Sn5 has to do with the shock waves and micro-jets produced by ultrasonic treatment, which leads to separation of some Cu6Sn5 from the interfacial Cu6Sn5 to form non-interfacial Cu6Sn5. The local high pressure generated by the ultrasounds promotes the heterogeneous nucleation and growth of Cu6Sn5. Also, some branch-like Cu3Sn formed at Cu6Sn5/Cu3Sn interface render the interfacial Cu3Sn in ultrasonic-assisted solder joints present a different morphology from the wave-like or planar-like Cu3Sn in conventional soldering joints. Meanwhile, some non-interfacial Cu3Sn are present in non-interfacial Cu6Sn5 due to reaction of Cu atoms in liquid Sn with non-interfacial Cu6Sn5 to form non-interfacial Cu3Sn. Overall, full Cu3Sn solder joints are obtained at ultrasonic times of 60 s.

Originality/value

The obtained microstructure evolutions of ultrasonic-assisted solder joints in this paper are different from those reported in previous studies. Based on these differences, the effects of ultrasounds on the formation of non-interfacial IMCs and growth of interfacial IMCs are systematically analyzed by comparing with the traditional soldering process.

Details

Soldering & Surface Mount Technology, vol. 33 no. 4
Type: Research Article
ISSN: 0954-0911

Keywords

Access Restricted. View access options
Article
Publication date: 12 August 2021

Xu Han, Xiaoyan Li and Peng Yao

This study aims to investigate the effect of ultrasound on interfacial microstructures and growth kinetics of intermetallic compounds (IMCs) at different temperatures.

148

Abstract

Purpose

This study aims to investigate the effect of ultrasound on interfacial microstructures and growth kinetics of intermetallic compounds (IMCs) at different temperatures.

Design/methodology/approach

To investigate the effect of ultrasound on IMCs growth quantitatively, the cross-sectional area of IMCs layers over a confirmed length was obtained for calculating the thickness of the IMCs layer.

Findings

The generation of dimensional difference in normal direction between Cu6Sn5 and its adjacent Cu6Sn5, formation of bossed Cu6Sn5 and non-interfacial Cu6Sn5 in ultrasonic solder joints made the interfacial Cu6Sn5 layer present a non-scallop-like morphology different from that of traditional solder joints. At 260°C and 290°C, the Cu3Sn layer presented a wave-like shape. In contrast, at 320°C, the Cu3Sn in ultrasonic solder joints consisted of non-interfacial Cu3Sn and interfacial Cu3Sn with a branch-like shape. The Cu6Sn5/Cu3Sn boundary and Cu3Sn/Cu interface presented a sawtooth-like shape under the effect of ultrasound. The predominant mechanism of ultrasonic-assisted growth of Cu6Sn5 growth at 260°C, 290°C and 320°C involved the grain boundary diffusion accompanied by grain coarsening. The Cu3Sn growth was controlled by volume diffusion during the ultrasonic soldering process at 260°C and 290°C. The diffusion mechanism of Cu3Sn growth transformed to grain boundary diffusion accompanied by grain coarsening when the ultrasonic soldering temperature was increased to 320°C.

Originality/value

The microstructural evolution and growth kinetics of IMCs in ultrasonically prepared ultrasonic solder joints at different temperatures have rarely been reported in previous studies. In this study, the effect of ultrasound on microstructural evolution and growth kinetics of IMCs was systematically investigated.

Details

Soldering & Surface Mount Technology, vol. 34 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Access Restricted. View access options
Article
Publication date: 3 July 2017

Yao-Ping Peng and Ku-Ho Lin

Based on a dynamic capability (DC) view, the purpose of this paper is to explore whether market orientation (MO) (external) and learning orientation (LO) (internal) facilitate…

1193

Abstract

Purpose

Based on a dynamic capability (DC) view, the purpose of this paper is to explore whether market orientation (MO) (external) and learning orientation (LO) (internal) facilitate internationalizing small- and medium-sized enterprises’ (ISMEs) global dynamic capabilities (GDCs) – i.e., their global marketing and product-design capabilities – and promote firm performance.

Design/methodology/approach

Empirical data are randomly selected from Taiwanese ISMEs, yielding 206 valid responses. Informants’ (CEOs, vice presidents, senior managers) knowledge about and shouldering of firm responsibilities are explored.

Findings

A significant increase in global marketing and product-design capabilities is found to affect firm performance. MO and LO positively influence GDCs, which increase firm performance. Furthermore, LO and MO support GDCs’ development.

Research limitations/implications

The sample is reasonably diverse in terms of demographics including firm location, size, industry, and market type. Disaggregation results are generally robust regarding model parameters. However, future research should target different countries to assess result generalizability.

Practical implications

The findings reveal two practical implications for managers. First, successful GDCs help firms spread the costs of designing products or components across many contexts and to offer appealing products to consumers worldwide. Second, it is important that managers foster development of MOs and LOs.

Originality/value

The study contributes to the literature in two ways. First, by conceptualizing GDCs of ISMEs, DC literature is expanded based on a global context. Second, the complexity of extending DC literature into ISMEs may arise from the fact that ISMEs, as separate and living entities, devise their own organizational culture, which significantly affects their GDC development.

Details

Baltic Journal of Management, vol. 12 no. 3
Type: Research Article
ISSN: 1746-5265

Keywords

1 – 10 of over 2000
Per page
102050