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This paper aims to focus on the most popular technique nowadays, the use of microwave irradiation in organic synthesis; in a few years, most chemists will use microwave energy to heat chemical reactions on a laboratory scale. Also, many scientists use microwave technology in the industry. They have turned to microwave synthesis as a frontline methodology for their projects. Microwave and microwave-assisted organic synthesis (MAOS) has emerged as a new “lead” in organic synthesis.

Using microwave radiation for synthesis and design of fluorescent dyes is of great interest, as it decreases the time required for synthesis and the synthesized dyes can be applied to industrial scale.

The technique offers many advantages, as it is simple, clean, fast, efficient and economical for the synthesis of a large number of organic compounds. These advantages encourage many chemists to switch from the traditional heating method to microwave-assisted chemistry.

This review highlights applications of microwave chemistry in organic synthesis for fluorescent dyes. Fluorescents are a fairly new and very heavily used class of organics. These materials have many applications, as a penetrant liquid for crack detection, synthetic resins, plastics, printing inks, non-destructive testing and sports ball dyeing.

The aim value of this review is to define the scope and limitation of microwave synthesis procedures for the synthesis of novel fluorescent dyes via a simple and economic way.

This paper aims to focus on the application of low temperature co-fired ceramic (LTCC) technology in the fabrication of a microfluidic module with integrated microwave components. The design, technology and performance of such an LTCC-based module is investigated. The rapid heating of liquid samples on a microliter scale is shown to be possible with the use of microwaves.

The developed microwave-microfluidic module was fabricated using well-known LTCC technology. The finite element method was used to design the geometry of the microwave circuit. Various numerical simulations for different liquids were performed. Finally, the performance of the real LTCC-based microwave-microfluidic module was examined experimentally.

LTCC materials and technology can be used in the fabrication of microfluidic modules which use microwaves in the heating of the liquid sample. LTCC technology permits the fabrication of matching circuits with appropriate geometry, whereas microwave power can be used to heat up the liquid samples on a microliter scale.

The main limitation of the presented work is found to be in conjunction with LTCC technology. The dimensions and shape of the deposited conductors (e.g. microstrip line, matching circuit) depend on the screen-printing process. A line with resolution lower than 75 µm with well-defined edges is difficult to obtain. This can have an effect on the high-frequency properties of the LTCC modules.

The presented LTCC-based microfluidic module with integrated microwave circuits provides an opportunity for the further development of various micro-total analysis systems or lab-on-chips in which the rapid heating of liquid samples in low volumes is needed (e.g. miniature real-time polymerase chain reaction thermocycler).

Examples of the application of LTCC technology in the fabrication of microwave circuits and microfluidic systems can be found in the available literature. However, the LTCC-based module which combines microwave and microfluidic components has yet to have been reported. The preliminary work on the design, fabrication and properties of the LTCC microfluidic module with integrated microwave components is presented in this paper.

The purpose of this paper is to share valuable information about low‐cost microwave circuit research with academic and industrial communities that work, or want to work, in this field.

Screen‐printing technology has been chosen as the fabrication method because of simplicity and low costs. Different materials and printing parameters were tested in four generations of microstrip lines. After obtaining a satisfactory fabrication method, passive microwave components were printed, assembled, characterized and modeled.

Results demonstrated that the proposed low‐cost method allows fabricating low loss microstrip lines (15.63×10⁻³ dB/mm at 10 GHz), filters, inductors, and capacitors that work well up to 12 GHz.

Model accuracy of inductors and capacitors can be improved. The use of more precise calibration and de‐embedding techniques is necessary. More components can be fabricated and modeled to increase the flexibility and applicability of the proposed fabrication method.

The presented information can help limited budget companies and small educational institutions in electronics to fabricate microwave circuits at low costs. This is an excellent approach for students who want to learn how to make microwave frequency measurements and circuits without the need of expensive fabrication equipment and clean rooms.

The step‐by‐step fabrication method described in this paper allows fabricating different microwave components at low costs. The presentation of electrical models for each component completes the design‐fabrication cycle. As this information is gathered in a single source, it makes easier the incursion of new actors in the microwave field.

This paper aims to present the design development and measurement of two aerodynamic slotted X-bands back-to-back planer substrate-integrated rectangular waveguide (SIRWG/SIW) to Microstrip (MS) line transition for satellite and RADAR applications. It facilitates the realization of nonplanar (waveguide-based) circuits into planar form for easy integration with other planar (microstrip) devices, circuits and systems. This paper describes the design of a SIW to microstrip transition. The transition is broadband covering the frequency range of 8–12 GHz. The design and interconnection of microwave components like filters, power dividers, resonators, satellite dishes, sensors, transmitters and transponders are further aided by these transitions. A common planar interconnect is designed with better reflection coefficient/return loss (RL) (S₁₁/S₂₂ ≤ 10 dB), transmission coefficient/insertion loss (IL) (S₁₂/S₂₁: 0–3.0 dB) and ultra-wideband bandwidth on low profile FR-4 substrate for X-band and Ku-band functioning to interconnect modern era MIC/MMIC circuits, components and devices.

Two series of metal via (6 via/row) have been used so that all surface current and electric field vectors are confined within the metallic via-wall in SIW length. Introduced aerodynamic slots in tapered portions achieve excellent impedance matching and tapered junctions with SIW are mitered for fine tuning to achieve minimum reflections and improved transmissions at X-band center frequency.

Using this method, the measured IL and RLs are found in concord with simulated results in full X-band (8.22–12.4 GHz). RLC T-equivalent and p-equivalent electrical circuits of the proposed design are presented at the end.

The measurement of the prototype has been carried out by an available low-cost X-band microwave bench and with a Keysight E4416A power meter in the microwave laboratory.

The transition is fabricated on FR-4 substrate with compact size 14 mm × 21.35 mm × 1.6 mm and hence economical with IL lie within limits 0.6–1 dB and RL is lower than −10 dB in bandwidth 7.05–17.10 GHz. Because of such outstanding fractional bandwidth (FBW: 100.5%), the transition could also be useful for Ku-band with IL close to 1.6 dB.

This paper aims to study the structural, electrical and microwave properties of (Sr_0.6Ca_0.4) (Co_yMn_1−y) O₃ (0.2 ≤ y ≤ 1.0) thick-film ceramics.

The thick films of (Sr_0.6Ca_0.4) (Co_yMn_1−y) O₃ (0.2 ≤ y ≤ 1.0) on the alumina substrate have been delineated using screen printing technique. The structural analysis was carried out using an X-ray diffraction method and scanning electron microscopy. The direct current (DC) electrical resistivity is measured using a two-probe method. Microwave absorption was studied in the 8-18 GHz frequency range by using the Waveguide Reflectometer Method. The permittivity and permeability in the 8-18 GHz frequency range were measured by using Voltage Standing Wave Ratio slotted section method.

The thick films have orthorhombic perovskite structure with dominant (020) plane. By using first-principle calculation method, theoretical and experimental lattice parameter and cell volume of (Sr_0.6Ca_0.4) (Co_yMn_1−y) O₃ are matched with each other. The cobalt content changes the morphology from plates to needles. The DC electrical resistivity increases with increase in Co content and decreases with increase in temperature. (Sr_0.6Ca_0.4) (Co_yMn_1−y) O₃ thick film shows 75 per cent microwave absorption both in the X band and Ku band. The microwave permittivity and permeability decreases with increase in frequency and Co content.

Structural, electrical and microwave properties of (Sr_0.6Ca_0.4) (Co_yMn_1−y) O₃ (0.2 ≤ y ≤ 1.0). Thick film ceramics on alumina substrate is reported for the first time.

Purpose of this study is to design a compact gap coupled anchor shape patch antenna for wireless local area network/high performance radio local area network and worldwide interoperability for microwave access applications.

An anchor shape microstrip antenna is conceived, designed, simulated and measured. The anchor shape antenna is transformed to its rectangular equivalent by conserving the patch area. Modeling and simulation of the antenna is performed by Ansys high frequency structure simulator (HFSS) electromagnetic solver based on the concept of finite element method. The simulated results are experimentally verified by using Agilent E5071C vector network analyzer. Theoretical analysis of an electromagnetically gap coupled anchor shape microstrip patch antenna has been performed by obtaining the lumped element equivalent of the transformed antenna.

The proposed antenna has a compact conducting patch of dimension 0.26λ × 0.12λ mm² (λ is calculated at lower resonating frequency of 3.56 GHz) with impedance bandwidths of 100 and 140 MHz and antenna gains of 1.91 and 3.04 dB at lower resonating frequency of 3.56 GHz and upper resonating frequency of 5.4 GHz, with omni-directional radiation pattern.

In literature, one does not encounter anchor shape antenna using the concept of gap coupling and parasitic patches. The design has been optimized for wireless local area network/worldwide interoperability for microwave access applications with a relatively low patch area (291.12 mm²) as compared to other reported antennas for wireless local area network/worldwide interoperability for microwave access applications. Transformed antenna and the actual experimental antenna behavior varies, but the resonant frequencies of the transformed antenna as observed by theoretical analysis and simulated results (by high frequency structure simulator) are reasonably close, and the percentage difference between the resonant frequencies (both at lower and upper bands) is within the permissible limit of 1-2.5 per cent. Results confirm the theoretical proposition of transformation of shapes in antenna design, which allows a designer to adapt the design shape according to the application.

The Microelectronics Division of the Radio Measurement Engineering Research Institute of Lithuania has developed a unique photoimageable thick film chemistry and process technology which has been in use since the mid‐1980s. The main application of the technology was for complex thick film microwave integrated circuits at lower cost than equivalent thin film devices. The paper describes the photoimageable materials and processing used at the Institute and also gives examples of suitable application in the microwave, high density interconnect, sensor and component fields.

The purpose of this paper is to describe the behavior of different lead-free solders (95.5Sn3.8Ag0.7Cu, i.e. SAC387 and Sn7In4.1Ag0.5Cu, i.e. SAC-In) in thermomechanically loaded non-collapsible ball grid array (BGA) joints of a low-temperature co-fired ceramic (LTCC) module. The validity of a modified Engelmaier’s model was tested to verify its capability to predict the characteristic lifetime of an LTCC module assembly implementable in field applications.

Five printed wiring board (PWB) assemblies, each carrying eight LTCC modules, were fabricated and exposed to a temperature cycling test over a −40 to 125°C temperature range to determine the characteristic lifetimes of interconnections in the LTCC module/PWB assemblies. The failure mechanisms of the test assemblies were verified using scanning acoustic microscopy, scanning electron microscopy (SEM) and field emission SEM investigation. A stress-dependent Engelmaier’s model, adjusted for plastic-core solder ball (PCSB) BGA structures, was used to predict the characteristic lifetimes of the assemblies.

Depending on the joint configuration, characteristic lifetimes of up to 1,920 cycles were achieved in the thermal cycling testing. The results showed that intergranular (creep) failures occurred primarily only in the joints containing Sn7In4.1Ag0.5Cu solder. Other primary failure mechanisms (mixed transgranular/intergranular, separation of the intermetallic compound/solder interface and cracking in the interface between the ceramic and metallization) were observed in the other joint configurations. The modified Engelmaier’s model was found to predict the lifetime of interconnections with good accuracy. The results confirmed the superiority of SAC-In solder over SAC in terms of reliability, and also proved that an air cavity structure of the module, which enhances its radio frequency (RF) performance, did not degrade the reliability of the second-level interconnections of the test assemblies.

This paper shows the superiority of SAC-In solder over SAC387 solder in terms of reliability and verifies the applicability of the modified Engelmaier’s model as an accurate lifetime prediction method for PCSB BGA structures for the presented LTCC packages for RF/microwave telecommunication applications.

This paper aims to investigate in a self-designed closed loop reactor process conditions for thermal inactivation of B16 melanoma cells by microwave and conventional heating.

Besides control experiments (37°C), inactivation rate was determined in the range from 42°C to 46°C. Heating was achieved either by microwave radiation at 2.45 GHz or by warm water. To distinguish viable from dead cells, AnnexinV staining method was used and supported by field effect scanning electron microscopy (FE-SEM) imaging. Furthermore, numerical simulations were done to get a closer look into both heating devices. To investigate the thermal influence on cell inactivation and the differences between heating methods, a reaction kinetics approach was added as well.

Control experiments and heating at 42°C resulted in low inactivation rates. Inactivation rate at 44°C remained below 12% under conventional, whereas it increased to >70% under microwave heating. At 46°C, inactivation rate attained 68% under conventional heating; meanwhile, even 88% were determined under microwave heating. FE-SEM images showed a porous membrane structure under microwave heating in contrast to mostly intact conventional heated cells. Numerical simulations of both heating devices and a macroscopic Arrhenius approach could not sufficiently explain the observed differences in inactivation.

A combination of thermal and electrical effects owing to microwave heating results in higher inactivation rates than conventional heating achieves. Nevertheless, it was not possible to determine the exact mechanisms of inactivation under microwave radiation.