Search results

This study aims to investigate the chromium (Cr) effects on the microstructural, mechanical and thermal properties of melt-spun Sn-3.5Ag alloy.

Ternary melt-spun Sn-Ag-Cr alloys were investigated using X-ray diffractions, scanning electron microscope, dynamic resonance technique, instron machine, Vickers hardness tester and differential scanning calorimetry.

The results revealed that the Ag₃Sn intermetallic compound (IMC) and ß-Sn have been refined because of the hard inclusions’ (Cr atoms) effects, causing lattice distortion increasing these alloys. The tensile results of Sn_96.4-Ag_3.5-Cr_0.1 alloy showed an improvement in Young’s modulus more than 100 per cent (42.16 GPa), ultimate tensile strength (UTS) by 9.4 per cent (23.9 MPa), compared with the eutectic Sn-Ag alloy due to the high concentration of Ag₃Sn and their uniform distribution. Shortage in the internal friction (Q⁻¹) of about 54 per cent (45.1) and increase in Vickers hardness of about 7.4 per cent (142.1 MPa) were also noted. Hexagonal Ag₃Sn formation led to low toughness values compared to the eutectic Sn-Ag alloy, which may have resulted from the mismatching among hexagonal Ag₃Sn phase with orthorhombic Ag₃Sn and ß-Sn phases. Mechanically, the values of Young’s modulus have been increased, with increasing chromium content, whereas the UTS and toughness values have been decreased. The opposite of this trend appeared in Sn_95.8-Ag_3.5-Cr_0.7 alloy, which may have been due to high lattice distortion (ƹ = 16.5 × 10⁻⁴) compared to the other alloys. Increase in the melting temperature T_m, ΔH, C_p and ΔT was because of Ag₃Sn IMC formation. The low toughness of Sn₉₆-Ag_3.5-Cr_0.5 and Sn_95.8-Ag_3.5-Cr_0.7 (109.56 J/m³ and 35.66 J/m³), relatively high melting temperature Tm (223.22°C and 222.65°C) and low thermal conductivity and thermal diffusivity (32.651 w.m⁻¹.k⁻¹ and 0.314 m²/s) make them undesirable in the soldering process. The high UTS, high E, high thermal conductivity and diffusivity, low creep rate and low electrical resistivity, which have occurred with “0.1 Wt.%” of Cr, make this alloy desirable and reliable for soldering applications and electronic assembly.

This study provides chromium effects on the structure of the eutectic Sn-Ag rapidly solidified by melt-spinning technique. In this paper, the authors compared the elastic modulus of the melt-spun compositions, which have been resulted from the Static method with that have been resulted from the Dynamic method. This paper presents new improvements in mechanical and thermal performance.

This study aims to investigate the structural, mechanical, thermal and electrical properties of tin–silver–nickel (Sn-Ag-Ni) melt-spun solder alloys. So, it aims to improve the mechanical properties of the eutectic tin–silver (Sn-Ag) such as tensile strength, plasticity and creep resistance by adding different concentrations of Ni content.

Ternary melt-spun Sn-Ag-Ni alloys were investigated using x-ray diffractions, scanning electron microscope, dynamic resonance technique (DRT), Instron machine, Vickers hardness tester and differential scanning calorimetry.

The results revealed that the Ni additions 0.1, 0.3, 0.5, 0.7, 1, 3 and 5 Wt.% to the eutectic Sn-Ag melt-spun solder were added. The “0.3wt.%” of Ni was significantly improved its mechanical properties to efficiently serve under high strain rate applications. Moreover, the uniform distribution of Ag₃Sn intermetallic compound with “0.3wt.%” of Ni offered the potential benefits, such as high strength, good plasticity consequently and good mechanical performance through a lack of dislocations and microvoids. The tensile results showed improvement in 17.63 per cent tensile strength (26 MPa), 21 per cent toughness (1001 J/m³), 22.83 per cent critical shear stress (25.074 MPa) and 11 per cent thermal diffusivity (2.065 × 10⁻⁷ m²/s) when compared with the tensile strength (21.416 MPa), toughness (790 J/m³), critical shear stress (19.348 MPa) and thermal diffusivity (1.487 × 10⁻⁷ m²/s) of the eutectic Sn-Ag. Slight increments have been shown for the melting temperature of Sn_96.2-Ag_3.5-Ni_0.3 (222.62°C) and electrical resistivity to (1.612 × 10⁻⁷ Ω.m). It can be said that the eutectic Sn-Ag solder alloy has been mechanically improved with “0.3wt.%” of Ni to become a suitable alloy for high strain rate applications. The dislocation movement deformation mechanism (n = 4.5) without Ni additions changed to grain boundary sliding deformation mechanism (n = 3.5) with Ni additions. On the other hand, the elastic modulus, creep rate and strain rate sensitivity with “0.3wt.%” of Ni have been decreased. The optimum Ni-doped concentration is “0.7wt.%” of Ni in terms of refined microstructure, electrical resistivity, Young’s Modulus, bulk modulus, shear modulus, thermal diffusivity, maximum shear stress, tensile strength and average creep rate.

This study provides nickel effects on the structural of the eutectic Sn-Ag rapidly solidified by melt-spinning technique. In this paper, the authors have compared the elastic modulus of the melt-spun compositions which has been resulted from the tensile strength tester with these results from the DRT for the first time to best of the authors’ knowledge. This paper presents new improvements in mechanical and electrical performance.

This study aims to summarize the effects of minor addition of Ho REE on the structure, mechanical strength and thermal stability of binary Sn- Ag solder alloys for high-performance applications.

This study investigates the effect of a small amount of holmium addition on the microstructure, thermal stability, mechanical behaviour and wettability of environmentally friendly eutectic melt-spun process Sn – Ag solder alloys. Dynamic resonance technique, X-ray diffraction (XRD) and scanning electron microscopy were carried to study stiffness, identification of the phases and the morphology features of the solder. Structure and microstructure analysis indicated that presence of rhombohedral ß-Sn phase in addition to orthorhombic IMC Ag₃Sn phase dispersed in Sn-matrix. Also, the results showed that Ho rare earth addition at a small trace amount into Sn-Ag system reduces and improves the particle size of both rhombohedral ß-Sn and orthorhombic IMC Ag₃Sn based on the adsorption effect of the active RE element. The adsorption of Ho at grain boundaries resulted in Ag₃Sn more uniform needle-like which is distributed in the ß-Sn matrix. The fine and uniform microstructure leads to improvement of mechanical strength. The microstructure refinement is due to the high surface free energy of IMC Ag₃Sn grains, and it prevents the dislocation slipping. This maybe enhance the micro-hardness and micro-creep hence delays the breaking point of the solder. Ho (RE) trace addition could enhance the melting temperature and contact angle up to 215°C and 31°, Respectively, compared with plain solder. All results showed that Ho trace addition element has an effective method to enhance new solder joints.

Effect of rare earth element Ho particles on the microstructure and mechanical behavior of eutectic Sn-3.5Ag solder alloy was studied. Some important conclusions are summarized in the following: microstructure investigations revealed that the addition of Ho particles to eutectic Sn-3.5Ag inhibited in reducing and refines the crystallite size as well as the Ag3Sn IMC which reinforced the strength of plain solder alloy. The mechanical properties values such as Young’s modulus, Vickers microhardness of Sn-3.5Ag solder alloy can be significantly improved by adding a trace amount of Ho particles compared with plain solder due to the existence of finer and higher volume fraction of Ag3SnIMC. These variations can be understood by considering the plastic deformation. The strengthening mechanism of the Sn-3.5Ag-Ho solder alloy could be explained in terms of Ho harden particles and finer IMC, which are distributed within eutectic regions because they act as pinning centres which inhibited the mobility of dislocation that concentrated around the grain boundaries. The results show that the best creep resistance is obtained when the addition of Ho 0.5 is compared to plain solder. The addition of Ho on Sn-3.5Ag lead-free solder alloy decreases the melting temperature to few degrees.

Development of holmium-doped eutectic Sn-Ag lead-free solder for electronic packaging.

This study aims to study the impact of intermetallic compound on microstructure, mechanical characteristics and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder.

In this paper, a new group of lead-free high-temperature Pb-free solder bearing alloys with five weight percentages of different silver additions, Bi-Ag_x (x = 3.0, 3.5, 4.0, 4.5 and 5.0 Wt.%) have been developed by rapidly solidification processing (RSP) using melt-spun technique as a promising candidate for the replacement of conventional Sn-37Pb common solder. The effect of the addition of a small amount of Ag on the structure, microstructure, thermal and properties of Bi-Ag solder was analyzed by means of X-ray diffractometer, scanning electron microscopy, differential scanning calorimetry and Vickers hardness technique. Applying the RSP commonly results in departures from conventional microstructures, giving an improvement of grain refinement. Furthermore, the grain size of rhombohedral hexagonal phase Bi solid solution and cubic IMC Bi_0.97Ag_0.03 phase is refined by Ag addition. Microstructure analysis of the as soldered revealed that relatively uniform distribution, equiaxed refined grains of secondary IMC Bi_0.97Ag_0.03 particles about 10 µm for Bi-Ag_4.5 dispersed in a Bi matrix. The addition of trace Ag led to a decrease in the solidus and liquidus temperatures of solder, meanwhile, the mushy zone is about 11.4°C and the melting of Sn-Ag_4.5 solder was found to be 261.42°C which is lower compared with the Sn-Ag₃ solder 263.60°C. This means that the silver additions into Bi enhance the melting point. The results indicate that an obvious change in electrical resistivity (?) at room temperature was noticed by the Ag addition. It was also observed that the Vickers microhardness (H_v) was increased with Ag increasing from 118 to 152 MPa. This study recommended the use of the Bi-Ag lead-free solder alloys for higher temperature applications.

Silver content is very important for the soldering process and solder joint reliability. Based on the present investigations described in this study, several conclusions were found regarding an evaluation of microstructural and mechanical deformation behavior of various Bi-Ag solders. The effect of Ag and rapid solidification on the melting characteristics, and microstructure of Bi-Ag alloys were studied. In addition, the mechanical properties of Bi with different low silver were investigated. From the present experimental study, the following conclusions can be drawn. The addition of Ag had a marked effect on the melting temperature of the lead-free solder alloys, it decreases the melting temperature of the alloy from 263.6 to 261.42°C. Bi-Ag solders are comprised of rhombohedral Hex. Bi solid solution and cubic Ag_0.97Bi_0.03 IMC is formed in the Bi matrix. The alloying of Ag could refine the primary Bi phase and the Bi_0.97Ag_0.03 IMC. With increasing Ag content, the microstructure of the Bi-Ag gradually changes from large dimples into tiny dimple-like structures. The refinement of IMC grains was restrained after silver particles were added into the matrix. The inhibition effect on the growth of IMC grains was most conspicuous when solder was doped with Ag particles. As a result, the Vickers microhardness of the Bi-Ag lead-free solder alloys was enhanced by more than 100% ranging from 118.34 to 252.95 MPa. Bi-Ag high-temperature lead-free solders are a potential candidate for replacing the tin-lead solder (Sn-37Pb) materials which are toxic to human and the environment and has already been banned.

This study recommended the use of the Bi-Ag lead-free solder alloys for high-temperature applications.

The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free solder for high-temperature applications.

Effect of rapid solidification processing on structural, thermal and mechanical properties of Bi-Ag lead-free solder reinforced Tb rare-earth element.

The obtained results indicated that the microstructure consists of rhombohedral Bi-rich phase and Ag99.5Bi0.5 intermetallic compound (IMC). The addition of Tb could effectively reduce the onset and melting point. The elastic modulus of Tb-containing solders was enhanced to about 90% at 0.5 Tb. The higher elastic modulus may be attributed to solid solution strengthening effect, solubility extension, microstructure refinement and precipitation hardening of uniform distribution Ag99.5Bi0.5 IMC particles which can reasonably modify the microstructure, as well as inhibit the segregation and hinder the motion of dislocations.

It is recommended that the lead-free Bi-0.5Ag-0.5Tb solder be a candidate instead of common solder alloy (Sn-37Pb) for high temperature and high performance applications.

This study aims to investigate the effect of a small amount of TiO₂ NPs addition on the microstructure, thermal, mechanical and electrical properties of environmentally friendly eutectic (SAC355)_100-x(TiO₂)_x (x = 0.1, 0.3, 0.5, 0.7 and 1 wt.%) solder alloys.

Mechanical, thermal and electrical properties and microstructure conditions are taken into major consideration in any study of materials containing nanoparticles. Dynamic resonance technique, X-ray diffraction and scanning electron microscopy were carried out to study stiffness, identification of the phases and the morphology features of the solder. Structure and microstructure analysis indicated that the presence of rhombohedral β–Sn phase in addition to orthorhombic intermetallic compound (IMC) Ag₃Sn and Cu₃Sn phase dispersed in Sn matrix. In addition, the results showed that TiO₂ NPs addition at a small trace amount into SAC355 system reduces and improves the particle size of both rhombohedral β–Sn and orthorhombic IMC Ag₃Sn and Cu₃Sn. The interstitial dispersion of TiO₂ NPs at grain boundaries resulted in Ag₃Sn being more uniform needle-like, which is distributed in the β–Sn matrix. The fine and uniform microstructure leads to improvement of mechanical strength.

Some important conclusions are summarized as follows: microstructure investigations revealed that the addition of TiO₂ NPs particles to eutectic SAC355 inhibited in reducing and refines the crystallite size as well as the Ag₃Sn IMC, which reinforced the strength of plain solder alloy. The mechanical properties values such as Young’s modulus and Vickers microhardness of SAC355 solder alloy can be significantly improved by adding a trace amount of TiO₂ NPs compared with plain solder because of the existence of appropriate volume fraction of Ag₃Sn IMC. The results show that the best creep resistance is obtained when the addition of 0.3 wt.% of TiO₂ NPs is compared to plain solder. TiO₂ NPs addition could increase the melting temperature, compared with plain solder. All results showed that TiO₂ NPs addition is an effective method to enhance new solder joints.

New solder alloys.

Development of TiO₂ NPs-doped eutectic SAC355 lead-free solder for electronic packaging.

The purpose of this paper is to present a ribbons production route of composition Fe₇₈Si₉B₁₃ (%at.) using low cost noncommercial scrap materials to obtain usable magnetic cores by melt spinning technique and their characterization. This way, these may compete with the materials produced by conventional casting processes.

The methodology is to design a master alloy with scrap different starting compositions, to which Fe is added to get the desired atomic ratio of components. With this starting alloy, using the method of melt spinning, in its variant of chill block melt spinning, are achieved amorphous ribbons with desired soft magnetic behavior. Then these ribbons are thermally treated for achieve nanocrystalline structures to improve the performance in the magnetic cores.

The result of this paper shows that it is possible to recycle scrap materials, and re-used efficiently as components essential in part of electrical components. This way, these may compete with the materials produced by conventional casting processes.

The limitation of this work to ensure that the scrap materials used is reasonably adequate to accomplish obtaining the master alloy, i.e. having reduced impurities.

The implications are important, because it assures that the components are recyclable and also high-tech in reference to energy saving that involves the production of amorphous and nanocrystalline materials in the electric industry. These products may compete with those produced by conventional casting processes.

The social implications lead to awareness in recycling and energy saving as an option for social progress in technology.

The originality of the study is that it takes as a starting point for the final product (ribbon) noncommercial scrap materials of known composition and the obtained results are comparable to those that also are manufactured from the pure elements. The control of impurities is necessary in the production route. This way, these may compete with the materials produced by conventional casting processes. This process achieved a production with lower cost, high efficient energy products and high added value.

THE equipment built at the Institute for research into the rapid solidification of tin alloys by melt‐spinning was successfully commissioned during the year and has been used extensively. The apparatus is capable of producing ribbon or flake from a jet of molten metal forced under gas pressure on to a wide bronze wheel rotating at circumferential speeds of up to 2000 m/min. The angle of attack of the metal stream, the clearance of the wheel by the crucible and the applied gas pressure may all be controlled so that various metal ribbon characteristics may be produced. The exact cooling rate for various alloys has not been measured but values of 106 deg C/sec are quoted by others as being attained with similar equipment. This produces very fine‐grained material which naturally shows changed mechanical properties in comparison with conventionally chill‐cast samples. However, no examples of amorphous material have yet been produced in work, which has concentrated so far on comparatively low melting point alloys.

This paper aims to summarise the effects of ZnO nanoparticles (0.1, 0.3, 0.5, 0.7 and 1.0 Wt.%) on the structure, mechanical, electrical and thermal stability of Sn–3.5Ag–0.5Cu (SAC355) solder alloys for high-performance applications.

The phase identification and morphology of the solders were studied using X-ray diffraction and scanning electron microscopy. Thermal parameters were investigated using differential scanning calorimetry. The elastic parameters such as Young's modulus (E) and internal friction (Q⁻¹) were investigated using the dynamic resonance technique, whereas the Vickers hardness (Hv) and creep indentation (n) were examined using a Vickers microhardness tester.

Microstructural analysis revealed that ZnO nanoparticles (NPs) were distributed uniformly throughout the Sn matrix. Furthermore, addition of 0.1, 0.3 and 0.7 Wt.% of ZnO NPs to the eutectic (SAC355) prevented crystallite size reduction, which increased the strength of the solder alloy. Mechanical parameters such as Young's modulus improved significantly at 0.1, 0.3 and 0.7 Wt.% ZnO NP contents compared to the ZnO-free alloy. This variation can be understood by considering the plastic deformation. The Vickers hardness value (Hv) increased to its maximum as the ZnO NP content increased to 0.5. A stress exponent value (n) of approximately two in most composite solder alloys suggested that grain boundary sliding was the dominant mechanism in this system. The electrical resistance (ρ) increased its maximum value at 0.5 Wt.% ZnO NPs content. The addition of ZnO NPs to plain (SAC355) solder alloys increased the melting temperature (T_m) by a few degrees.

Development of eutectic (SAC355) lead-free solder doped with ZnO NPs use for electronic packaging.

Shape memory polymers (SMPs) respond with a change in their shape against a specific stimulus by memorizing their original shape and are reformed after deformation most often by changing the temperature of the surrounding without additional mechanical efforts. In the coming years, these polymers indeed will be in limelight to manufacture textile materials which will retain their shape even after prolonged use under disturbed conditions. This study aims at defining shape memory materials and polymers as well as their technological characteristics and also highlights application in various fields of textiles.

The methodology used to explain these SMPs have been carried out starting with the discussion on their properties, their physical nature, types, viz., shape memory alloys (SMAs), shape memory ceramics, shape memory hybrid, magnetic shape memory alloy, shape memory composites, shape memory gels and SMP along with properties of each type. Other related details of these polymers, such as their advantages, structure and mechanism, shape memory functionality, thermally responsive SMPs and applications, have been detailed.

It has been observed that the SMPs are very important in the fields of wet and melt-spun fibers to offer novel and functional properties, cotton and wool fabric finishing, to produce SMP films, foams and laminated textiles, water vapor permeable and breathable SMP films, etc.

The field of SMPs is new, and very limited information is available to enable their smooth production and handling.