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Article
Publication date: 1 December 2002
Marko Pavlin, Darko Belavic, Marina Santo Zarnik, Marko Hrovat and Matej Mozek
Pressure‐sensor miniaturization requires high‐density packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible…
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Abstract
Pressure‐sensor miniaturization requires high‐density packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible, requirements. In this paper we will present three examples with specific technologies and aspects of miniaturization and packaging. The first example is a pressure switch, the second a pressure sensor and the third a smart pressure sensor.
Details
Microelectronics International, vol. 19 no. 3
Type: Research Article
ISSN: 1356-5362