Packaging technologies for pressure‐sensors
Marko Pavlin
(University of Ljubljana, Faculty for Electrical Engineering, Ljubljana, Slovenia)
Darko Belavic
(University of Ljubljana, Faculty for Electrical Engineering, Ljubljana, Slovenia)
Marina Santo Zarnik
(University of Ljubljana, Faculty for Electrical Engineering, Ljubljana, Slovenia)
Marko Hrovat
(University of Ljubljana, Faculty for Electrical Engineering, Ljubljana, Slovenia)
Matej Mozek
(University of Ljubljana, Faculty for Electrical Engineering, Ljubljana, Slovenia)
957
Abstract
Pressure‐sensor miniaturization requires high‐density packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible, requirements. In this paper we will present three examples with specific technologies and aspects of miniaturization and packaging. The first example is a pressure switch, the second a pressure sensor and the third a smart pressure sensor.
Keywords
Citation
Pavlin, M., Belavic, D., Santo Zarnik, M., Hrovat, M. and Mozek, M. (2002), "Packaging technologies for pressure‐sensors", Microelectronics International, Vol. 19 No. 3, pp. 9-13. https://doi.org/10.1108/13565360210444989
Publisher
:MCB UP Ltd
Copyright © 2002, MCB UP Limited