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Rapidly changing technological and marketing environments challenge the survival of business organizations. Developing dynamic capability is critical in helping companies respond to today's turbulent environments. Thus, fruitful studies on the antecedents of dynamic capability have been conducted. However, in the context of the supply chain, little is known about the factors that can be harmful to dynamic capability. Drawing on the theory of cooperation and competition, the first purpose of this study is to examine the relationship between independent goal interdependence with suppliers and dynamic capability by focusing on the mediating role of supplier integration. Combining the information processing theory and transaction cost economics with the theory of cooperation and competition, the second purpose of this study is to discuss and test the moderating role of internal integration.

Using a carefully designed questionnaire, a large-scale survey was employed to collect data in China. The senior manager (e.g. president, vice president, chief executive officer [CEO], executive or purchasing manager) of each company was asked to participate in our survey. The final valid sample in our survey consisted of 233 companies. Hierarchical multiple regression statistical analysis and bias-corrected bootstrapping methods were applied to test the correlation, mediation, moderation and moderated mediation relationships between variables.

The authors found that independent goal interdependence negatively influences dynamic capability through frustrating supplier integration. In addition, the moderated mediation model analysis shows that internal integration weakens the positive direct effect of supplier integration on dynamic capability while neutralizing the negative indirect effect of independent goal interdependence on dynamic capability. The theoretical and managerial implications of these results are discussed.

First, starting from the goal interdependence and supply chain management perspectives, this research not only is consistent with remote theoretical research that explains why interdependence among organizations influences the capability to enhance competitive advantage but also incorporates relevant internal and external factors that influence dynamic capability. Second, by proposing an innovative boundary factor – internal integration – this study also contributes to adjusting the predictions of the theory of cooperation and competition. Third, focusing specifically on the negative antecedent of dynamic capability can provide a better understanding of the antecedents that cause companies to have weakened dynamic capability.

The dynamic capabilities theory indicates that uncertain environments necessitate firms’ dynamic capability. This study aims to examine how dynamic capability can be shaped based on cooperative goal interdependence with supply chain partners by focusing on the mediating role of strategic flexibility and the moderating role of human resource flexibility.

Questionnaire surveys were administered to firm presidents, chief executive officers, chief human resources officers (CHOs) and other senior managers at 300 firms located in China. The data collection process was carried out in one wave with multiple sources. Of the firms contacted, the sample in this study consisted of 233 matched “CHO-other top manager” dyads. Structural equation modeling and the bias-corrected bootstrap method were used to test the proposed causal relationships, moderation model, mediation model and moderated mediation model.

Cooperative goal interdependence with both upstream companies and downstream companies was positively related to dynamic capability and strategic flexibility mediated these main effects. Moreover, human resource flexibility moderated the positive direct relationship between strategic flexibility and dynamic capability and the indirect relationships among cooperative goals, strategic flexibility and dynamic capability such that these relationships in companies with high human resource flexibility were stronger than these relationships in companies with low human resource flexibility.

The findings contribute to the literature on dynamic capability by providing empirical evidence regarding the relationships among cooperative goals, strategic flexibility, human resource flexibility and dynamic capability, which enriches the theory of cooperation and competition and suggests a new path to promote dynamic capability.

This study seeks to apply a dual-processing model to understand how ethical leadership prohibits employee unethical behavior through both employee deontic justice and distributive justice.

A survey research was conducted with 62 supervisors and 244 subordinates of 17 firms collected at 2 time points separated by approximately 3 weeks in People's Republic of China.

A multilevel modeling analysis was used to test the dual-processing model. The results showed that both employee deontic justice (moral intuition process) and distributive justice (deliberate reasoning process) significantly mediate the negative relationship between ethical leadership and employee unethical behavior.

As traditional ethics-training approaches mainly focus on developing the deliberate decision-making process driven by distributive justice, the authors' dual-processing model suggests that moral intuition led by deontic justice is equally important and could significantly inhibit employee unethical behavior. Applying the proposed dual-processing model in the ethics training can enhance the effectiveness of employee moral training.

Previous studies have studied the deliberate reasoning process and moral intuition on employee unethical behavior independently. This study contributes to the current literature by a comprehensive dual-processing model which demonstrates equal impact of employee deontic justice and distributive justice led by ethical leadership on the inhibition of employee unethical behavior.

This study aims to address the issue of high-precision measurement of AC electric field. An electro-optical sensor with high sensitivity is proposed for this purpose.

The proposed sensor combines electromagnetic induction and fiber Bragg grating (FBG) sensing techniques. It is composed of a sensing probe, a piece or stack of piezoelectric ceramics (PZT) and an FBG. A signal processing circuit is designed to rectify and amplify the induced voltage. The processed signal is applied to the PZT and the deformation of PZT is detected by FBG. Theoretical calculation and simulation are conducted to verify the working principle of the probe. The sensor prototype is fabricated and its performance is tested.

The results of this study show that the sensor has good linearity and repeatability. The sensor sensitivity is 0.061 pm/Vm⁻¹ in the range from 250 to 17,500 V/m, enabling a measurement resolution of electric field strength of 16.3 V/m. The PZT stack is used to enhance the sensor sensitivity and the resolution can be improved up to 3.15 V/m.

A flexure hinge lever mechanism is used to amplify the deformation of PZT for further enhancement of sensitivity. The results show that the proposed sensor has high sensitivity and can be used for the accurate measurement of an electric field. The proposed sensor could have potential use for electric field measurement in the power industry.

Autonomous mobile manipulation depends on a lot of effort at various levels. In general, the hardware design is as important as algorithm (or software) design. In particular, the absence of certain capabilities of hardware can seriously affect the feasibility and performance of algorithms. The purpose of this paper is to present work on developing hardware capability for mobile manipulation by low‐cost humanoids (LOCH) humanoid robot.

This paper presents research work on developing the hardware support which enables vision‐guided mobile manipulation realized on top of a biped humanoid robot called LOCH. One important goal which guides the development is to achieve the hardware capability with human‐like dexterity, modularity, functionality, and appearance.

This paper discusses the detail of solutions leading to the realization of the intended hardware capability, focusing in particular on the issues related to mechanism, actuation, distributed sensing, and distributed control of humanoid head, humanoid hands and humanoid arms. Finally, the paper shows the result of the actual prototype, which can be controlled by a remote control station through wireless connection.

In designing a machine, it is common to do motor‐sizing and material selection. Since these are standard procedures, these details are omitted because readers with the training in mechanical engineering should be able to work out such details in order to select the appropriate motors and materials. Also, this paper does not delve into the description of the biped system of LOCH humanoid, because such work requires another long paper in order to reveal major details.

This paper presents the major detail of research efforts toward developing hardware capabilities for achieving autonomous mobile manipulation by LOCH humanoid robot, focusing on three important modules, namely: perception head, human‐like hands, and arms. The uniqueness of this work is twofold. First, LOCH humanoid robot's perception head has the most versatile sensing capabilities, which are fully integrated into a compact and human‐like head. Second, each of LOCH humanoid robot's hands has 14 degrees of freedom, which are realized within a mechanism which is of human‐hand size and shape. In addition, the perception head, humanoid hands and humanoid arms are seamlessly integrated together owing to the adoption of a distributed system which supports networked sensing and control through the use of both control area network bus and transmission control protocol/internet protocol internet.

This paper aims to review recent advances and applications of abrasive processes for microelectronics fabrications.

More than 80 patents and journal and conference articles published recently are reviewed. The topics covered are chemical mechanical polishing (CMP) for semiconductor devices, key/additional process conditions for CMP, and polishing and grinding for microelectronics fabrications and fan-out wafer level packages (FOWLPs).

Many reviewed articles reported advanced CMP for semiconductor device fabrications and innovative research studies on CMP slurry and abrasives. The surface finish, sub-surface damage and the strength of wafers are important issues. The defects on wafer surfaces induced by grinding/polishing would affect the stability of diced ultra-thin chips. Fracture strengths of wafers are dependent on the damage structure induced during dicing or grinding. Different thinning processes can reduce or enhance the fracture strength of wafers. In the FOWLP technology, grinding or CMP is conducted at several key steps. Challenges come from back-grinding and the wafer warpage. As the Si chips of the over-molded FOWLPs are very thin, wafer grinding becomes critical. The strength of the FOWLPs is significantly affected by grinding.

This paper attempts to provide an introduction to recent developments and the trends in abrasive processes for microelectronics manufacturing. With the references provided, readers may explore more deeply by reading the original articles. Original suggestions for future research work are also provided.

This paper aims to give an overview about the state of wireless passive surface acoustic wave (SAW) gas sensor used in the detection of chemical vapor. It also discusses a variety of different architectures including delay line and array sensor for gas detection, and it is considered that this technology has a good application prospect.

The authors state the most of the wireless passive SAW methods used in gas sensing, such as CO2, CO, CH4, C2H4, NH3, NO2, et al., the sensor principles, design procedures and technological issues are discussed in detail; their advantages and disadvantages are also summarized. In conclusion, it gives a prospect of wireless passive SAW sensor applications and proposes the future research field might lie in the studying of many kinds of harmful gases.

In this paper, the authors will try to cover most of the important methods used in gas sensing and their recent developments. Although wireless passive SAW sensors have been used successfully in harsh environments for the monitoring of temperature or pressure, the using in chemical gases are seldom reported. This review paper gives a survey of the present state of wireless passive SAW sensor in gas detection and suggests new and exciting perspectives of wireless passive SAW gas sensor technology.

The authors will review most of the methods used in wireless passive SAW sensor and discuss the current research status and development trend; the potential application in future is also forecasted.

The authors will review most of the methods used in wireless passive SAW sensor and discuss the current research status and development trend; the potential application in future is also forecasted.

Surface acoustic wave (SAW) sensors have attracted great attention worldwide for a variety of applications in measuring physical, chemical and biological parameters. However, stability has been one of the key issues which have limited their effective commercial applications. To fully understand this challenge of operation stability, this paper aims to systematically review mechanisms, stability issues and future challenges of SAW sensors for various applications.

This review paper starts with different types of SAWs, advantages and disadvantages of different types of SAW sensors and then the stability issues of SAW sensors. Subsequently, recent efforts made by researchers for improving working stability of SAW sensors are reviewed. Finally, it discusses the existing challenges and future prospects of SAW sensors in the rapidly growing Internet of Things-enabled application market.

A large number of scientific articles related to SAW technologies were found, and a number of opportunities for future researchers were identified. Over the past 20 years, SAW-related research has gained a growing interest of researchers. SAW sensors have attracted more and more researchers worldwide over the years, but the research topics of SAW sensor stability only own an extremely poor percentage in the total researc topics of SAWs or SAW sensors.

Although SAW sensors have been attracting researchers worldwide for decades, researchers mainly focused on the new materials and design strategies for SAW sensors to achieve good sensitivity and selectivity, and little work can be found on the stability issues of SAW sensors, which are so important for SAW sensor industries and one of the key factors to be mature products. Therefore, this paper systematically reviewed the SAW sensors from their fundamental mechanisms to stability issues and indicated their future challenges for various applications.

This paper aims to provide details of MEMS (micro-electromechanical system) sensors produced from materials other than silicon.

Following a short introduction, this first considers reasons for using alternatives to silicon. It then discusses MEMS sensor products and research involving sapphire, quartz, silicon carbide and aluminium nitride. It then considers polymer and paper MEMS sensor developments and concludes with a brief discussion.

MEMS sensors based on the “hard” materials are well-suited to very-high-temperature- and precision-sensing applications. Some have been commercialised and there is a strong, on-going body of research. Polymer MEMS sensors are attracting great interest from the research community and have the potential to yield devices for both physical and molecular sensing that are inexpensive and simple to fabricate. The prospects for paper MEMS remain unclear but the technology may ultimately find uses in ultra-low-cost sensing of low-magnitude mechanical variables.

This provides a technical insight into the increasingly important role played by MEMS sensors fabricated from materials other than silicon.

Bumpless Cu/SiO₂ hybrid bonding, which this paper aims to, is a key technology of three-dimensional (3D) high-density integration to promote the integrated circuits industry’s continuous development, which achieves the stacks of chips vertically connected via through-silicon via. Surface-activated bonding (SAB) and thermal-compression bonding (TCB) are used, but both have some shortcomings. The SAB method is overdemanding in the bonding environment, and the TCB method requires a high temperature to remove copper oxide from surfaces, which increases the thermal budget and grossly damages the fine-pitch device.

In this review, methods to prevent and remove copper oxidation in the whole bonding process for a lower bonding temperature, such as wet treatment, plasma surface activation, nanotwinned copper and the metal passivation layer, are investigated.

The cooperative bonding method combining wet treatment and plasma activation shows outstanding technological superiority without the high cost and additional necessity of copper passivation in manufacture. Cu/SiO₂ hybrid bonding has great potential to effectively enhance the integration density in future 3D packaging for artificial intelligence, the internet of things and other high-density chips.

To achieve heterogeneous bonding at a lower temperature, the SAB method, chemical treatment and the plasma-assisted bonding method (based on TCB) are used, and surface-enhanced measurements such as nanotwinned copper and the metal passivation layer are also applied to prevent surface copper oxide.