Search results

1 – 10 of 12
Per page
102050
Citations:
Loading...
Access Restricted. View access options
Article
Publication date: 11 April 2008

John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher and Bob Sullivan

The High Density Packaging Users Group Consortium has conducted a study of process development and solder‐joint reliability of high‐density packages on printed circuit boards…

480

Abstract

Purpose

The High Density Packaging Users Group Consortium has conducted a study of process development and solder‐joint reliability of high‐density packages on printed circuit boards (PCB) using a low‐melting temperature lead‐free solder. The purpose of this paper is to investigate the reliability tests (e.g. temperature cycling and shock and vibration) and failure analysis (FA) of high‐density packages on PCB with the low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag).

Design/methodology/approach

The design for reliability, materials, and assembly process aspects of the project have been discussed in “Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)” also published in this journal issue. In this study, reliability tests (e.g. temperature cycling and shock and vibration) and FA of high‐density packages on PCB with the low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag) are investigated.

Findings

Lead‐free solder‐joint reliability of high‐density packages, such as the PBGA388, PBGA256, PBGA208, PBGA196, PBGA172, PQFP80, and TSSOP56 were determined by temperature cycling, shock, and vibration tests. Temperature cycling test data for over 8,100 cycles between 0 and 100°C in a 44 min. cycle were statistically analyzed. Shock and vibration test data based on the HP Standard Class Bi‐II Products SPEC have also been reported.

Originality/value

Currently there is a lack of experimental and simulation data and field experience in respect of one of the critical issues for industry – that of solder joint reliability in lead‐free soldering. The paper contains some important research results and recommendations.

Details

Soldering & Surface Mount Technology, vol. 20 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Access Restricted. View access options
Article
Publication date: 11 April 2008

John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher and Bob Sullivan

The purpose of this paper is to discuss the design, materials, and assembly process aspects of a study, conducted by The High Density Packaging Users Group Consortium, into…

629

Abstract

Purpose

The purpose of this paper is to discuss the design, materials, and assembly process aspects of a study, conducted by The High Density Packaging Users Group Consortium, into process development and solder joint reliability of high‐density packages on printed circuit boards using a low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag).

Design/methodology/approach

The components studied include several SMT package types and various lead configurations. The assembly process addresses the low‐temperature lead‐free assembly process, inspection and analysis of these boards and packages.

Findings

It was found that, the assembly process of the SnBiAg lead‐free test boards is very robust and the assembly yield is almost 100 percent.

Originality/value

The paper is of value by presenting a description of the rationale and material set used for an experiment to test SMT assembly and reliability characteristics using the 57Bi‐42Sn‐1Ag alloy, which has a melting point of 139°C.

Details

Soldering & Surface Mount Technology, vol. 20 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Access Restricted. View access options
Article
Publication date: 1 April 2004

Joe Smetana, Rob Horsley, John Lau, Ken Snowdon, Dongkai Shangguan, Jerry Gleason, Irv Memis, Dave Love, Walter Dauksher and Bob Sullivan

The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of high‐density packages using lead‐free solder. The design, material, and…

706

Abstract

The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of high‐density packages using lead‐free solder. The design, material, and assembly process aspects of the project are addressed in this paper. The components studied include many surface mount technology package types, various lead, and printed circuit board finishes and paste‐in‐hole assembly.

Details

Soldering & Surface Mount Technology, vol. 16 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Available. Content available
Article
Publication date: 1 December 2005

Martin Goosey

128

Abstract

Details

Circuit World, vol. 31 no. 4
Type: Research Article
ISSN: 0305-6120

Keywords

Available. Content available
Book part
Publication date: 8 September 2022

Stephen Turner

Free Access. Free Access

Abstract

Details

Mad Hazard
Type: Book
ISBN: 978-1-80382-670-7

Access Restricted. View access options
Article
Publication date: 1 April 2003

Georgios I. Zekos

Aim of the present monograph is the economic analysis of the role of MNEs regarding globalisation and digital economy and in parallel there is a reference and examination of some…

101241

Abstract

Aim of the present monograph is the economic analysis of the role of MNEs regarding globalisation and digital economy and in parallel there is a reference and examination of some legal aspects concerning MNEs, cyberspace and e‐commerce as the means of expression of the digital economy. The whole effort of the author is focused on the examination of various aspects of MNEs and their impact upon globalisation and vice versa and how and if we are moving towards a global digital economy.

Details

Managerial Law, vol. 45 no. 1/2
Type: Research Article
ISSN: 0309-0558

Keywords

Access Restricted. View access options
Article
Publication date: 1 January 2006

David H. Gleason

To help the reader understand how the ethics of management decisions become embedded into technology systems.

733

Abstract

Purpose

To help the reader understand how the ethics of management decisions become embedded into technology systems.

Design/methodology/approach

The article explains better approaches based on a core principle known as “Subsumption ethics.” Using many sources, it explains the concepts and methods in order to help readers avoid unintended consequences in technology development.

Findings

Technology can be dramatically improved by attending to its ethics. There are particular tools available to help.

Practical implications

Ultimately, these principles will require a higher level of professionalism in technology deployment, and formal processes devoted to impact analysis.

Originality/value

This paper represents a new way of looking at the technology development process that incorporates ethics in a cost‐effective manner. Business and technology leaders will learn how to improve the outcomes of technology projects.

Details

Handbook of Business Strategy, vol. 7 no. 1
Type: Research Article
ISSN: 1077-5730

Keywords

Access Restricted. View access options
Book part
Publication date: 29 August 2018

Paul A. Pautler

The Bureau of Economics in the Federal Trade Commission has a three-part role in the Agency and the strength of its functions changed over time depending on the preferences and…

Abstract

The Bureau of Economics in the Federal Trade Commission has a three-part role in the Agency and the strength of its functions changed over time depending on the preferences and ideology of the FTC’s leaders, developments in the field of economics, and the tenor of the times. The over-riding current role is to provide well considered, unbiased economic advice regarding antitrust and consumer protection law enforcement cases to the legal staff and the Commission. The second role, which long ago was primary, is to provide reports on investigations of various industries to the public and public officials. This role was more recently called research or “policy R&D”. A third role is to advocate for competition and markets both domestically and internationally. As a practical matter, the provision of economic advice to the FTC and to the legal staff has required that the economists wear “two hats,” helping the legal staff investigate cases and provide evidence to support law enforcement cases while also providing advice to the legal bureaus and to the Commission on which cases to pursue (thus providing “a second set of eyes” to evaluate cases). There is sometimes a tension in those functions because building a case is not the same as evaluating a case. Economists and the Bureau of Economics have provided such services to the FTC for over 100 years proving that a sub-organization can survive while playing roles that sometimes conflict. Such a life is not, however, always easy or fun.

Details

Healthcare Antitrust, Settlements, and the Federal Trade Commission
Type: Book
ISBN: 978-1-78756-599-9

Keywords

Access Restricted. View access options
Book part
Publication date: 1 February 2007

Dwight R. Merunka and Robert A. Peterson

Abstract

Details

Review of Marketing Research
Type: Book
ISBN: 978-0-7656-1306-6

Access Restricted. View access options
Article
Publication date: 13 February 2009

Norm Medeiros

This paper aims to highlight the recent copyright lawsuit filed by Viacom against YouTube and parent company, Google.

592

Abstract

Purpose

This paper aims to highlight the recent copyright lawsuit filed by Viacom against YouTube and parent company, Google.

Design/methodology/approach

The paper focuses on the claims of Viacom, and Google's response to these claims.

Findings

The paper illustrates that the case may hinge on Google's compliance with Digital Millennium Copyright Act requirements.

Originality/value

This paper reviews an important copyright case that may have a chilling effect on media sharing sites.

Details

OCLC Systems & Services: International digital library perspectives, vol. 25 no. 1
Type: Research Article
ISSN: 1065-075X

Keywords

1 – 10 of 12
Per page
102050