John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher and Bob Sullivan
The High Density Packaging Users Group Consortium has conducted a study of process development and solder‐joint reliability of high‐density packages on printed circuit boards…
Abstract
Purpose
The High Density Packaging Users Group Consortium has conducted a study of process development and solder‐joint reliability of high‐density packages on printed circuit boards (PCB) using a low‐melting temperature lead‐free solder. The purpose of this paper is to investigate the reliability tests (e.g. temperature cycling and shock and vibration) and failure analysis (FA) of high‐density packages on PCB with the low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag).
Design/methodology/approach
The design for reliability, materials, and assembly process aspects of the project have been discussed in “Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)” also published in this journal issue. In this study, reliability tests (e.g. temperature cycling and shock and vibration) and FA of high‐density packages on PCB with the low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag) are investigated.
Findings
Lead‐free solder‐joint reliability of high‐density packages, such as the PBGA388, PBGA256, PBGA208, PBGA196, PBGA172, PQFP80, and TSSOP56 were determined by temperature cycling, shock, and vibration tests. Temperature cycling test data for over 8,100 cycles between 0 and 100°C in a 44 min. cycle were statistically analyzed. Shock and vibration test data based on the HP Standard Class Bi‐II Products SPEC have also been reported.
Originality/value
Currently there is a lack of experimental and simulation data and field experience in respect of one of the critical issues for industry – that of solder joint reliability in lead‐free soldering. The paper contains some important research results and recommendations.
Details
Keywords
John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher and Bob Sullivan
The purpose of this paper is to discuss the design, materials, and assembly process aspects of a study, conducted by The High Density Packaging Users Group Consortium, into…
Abstract
Purpose
The purpose of this paper is to discuss the design, materials, and assembly process aspects of a study, conducted by The High Density Packaging Users Group Consortium, into process development and solder joint reliability of high‐density packages on printed circuit boards using a low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag).
Design/methodology/approach
The components studied include several SMT package types and various lead configurations. The assembly process addresses the low‐temperature lead‐free assembly process, inspection and analysis of these boards and packages.
Findings
It was found that, the assembly process of the SnBiAg lead‐free test boards is very robust and the assembly yield is almost 100 percent.
Originality/value
The paper is of value by presenting a description of the rationale and material set used for an experiment to test SMT assembly and reliability characteristics using the 57Bi‐42Sn‐1Ag alloy, which has a melting point of 139°C.
Details
Keywords
Joe Smetana, Rob Horsley, John Lau, Ken Snowdon, Dongkai Shangguan, Jerry Gleason, Irv Memis, Dave Love, Walter Dauksher and Bob Sullivan
The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of high‐density packages using lead‐free solder. The design, material, and…
Abstract
The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of high‐density packages using lead‐free solder. The design, material, and assembly process aspects of the project are addressed in this paper. The components studied include many surface mount technology package types, various lead, and printed circuit board finishes and paste‐in‐hole assembly.
Details
Keywords
Abstract
Details
Keywords
Aim of the present monograph is the economic analysis of the role of MNEs regarding globalisation and digital economy and in parallel there is a reference and examination of some…
Abstract
Aim of the present monograph is the economic analysis of the role of MNEs regarding globalisation and digital economy and in parallel there is a reference and examination of some legal aspects concerning MNEs, cyberspace and e‐commerce as the means of expression of the digital economy. The whole effort of the author is focused on the examination of various aspects of MNEs and their impact upon globalisation and vice versa and how and if we are moving towards a global digital economy.
Details
Keywords
To help the reader understand how the ethics of management decisions become embedded into technology systems.
Abstract
Purpose
To help the reader understand how the ethics of management decisions become embedded into technology systems.
Design/methodology/approach
The article explains better approaches based on a core principle known as “Subsumption ethics.” Using many sources, it explains the concepts and methods in order to help readers avoid unintended consequences in technology development.
Findings
Technology can be dramatically improved by attending to its ethics. There are particular tools available to help.
Practical implications
Ultimately, these principles will require a higher level of professionalism in technology deployment, and formal processes devoted to impact analysis.
Originality/value
This paper represents a new way of looking at the technology development process that incorporates ethics in a cost‐effective manner. Business and technology leaders will learn how to improve the outcomes of technology projects.
Details
Keywords
The Bureau of Economics in the Federal Trade Commission has a three-part role in the Agency and the strength of its functions changed over time depending on the preferences and…
Abstract
The Bureau of Economics in the Federal Trade Commission has a three-part role in the Agency and the strength of its functions changed over time depending on the preferences and ideology of the FTC’s leaders, developments in the field of economics, and the tenor of the times. The over-riding current role is to provide well considered, unbiased economic advice regarding antitrust and consumer protection law enforcement cases to the legal staff and the Commission. The second role, which long ago was primary, is to provide reports on investigations of various industries to the public and public officials. This role was more recently called research or “policy R&D”. A third role is to advocate for competition and markets both domestically and internationally. As a practical matter, the provision of economic advice to the FTC and to the legal staff has required that the economists wear “two hats,” helping the legal staff investigate cases and provide evidence to support law enforcement cases while also providing advice to the legal bureaus and to the Commission on which cases to pursue (thus providing “a second set of eyes” to evaluate cases). There is sometimes a tension in those functions because building a case is not the same as evaluating a case. Economists and the Bureau of Economics have provided such services to the FTC for over 100 years proving that a sub-organization can survive while playing roles that sometimes conflict. Such a life is not, however, always easy or fun.
Details
Keywords
This paper aims to highlight the recent copyright lawsuit filed by Viacom against YouTube and parent company, Google.
Abstract
Purpose
This paper aims to highlight the recent copyright lawsuit filed by Viacom against YouTube and parent company, Google.
Design/methodology/approach
The paper focuses on the claims of Viacom, and Google's response to these claims.
Findings
The paper illustrates that the case may hinge on Google's compliance with Digital Millennium Copyright Act requirements.
Originality/value
This paper reviews an important copyright case that may have a chilling effect on media sharing sites.