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Article
Publication date: 15 March 2019

Muhammad Junaid, Fujun Hou, Khalid Hussain and Ali Ashiq Kirmani

The purpose of this paper is to determine the impact on brand love of consumption experience at the dimensional level and to determine whether brand love mediates between…

4518

Abstract

Purpose

The purpose of this paper is to determine the impact on brand love of consumption experience at the dimensional level and to determine whether brand love mediates between consumption experience and customer engagement in the context of Generation M.

Design/methodology/approach

A sample of 265 Muslim smartphone users responded to a structured questionnaire adapted from existing literature. First, confirmatory factor analysis was carried out, and then data were analyzed through structural equation modeling using MPlus.

Findings

The findings indicate that hedonic pleasure and escapism directly, while flow, challenge and learning indirectly affect brand love and that brand love mediates the relationship between consumption experience and customer engagement.

Practical implications

This paper explicates Generation M’s consumption experience, ascertains ways to supplement their love for brand and engage them in gainful relationships and provides suggestions for further investigation. From a managerial perspective, the paper has implications for the management of consumer experience, identifies the most valuable dimensions of consumption experience and proposes that managers can develop customer-engagement strategies via brand love.

Originality/value

The paper validates the mediating role of brand love in the relationship between consumption experience and customer engagement; is the first to investigate the relationship between all dimensions of consumption experience and brand love; is one of few studies to investigate consumption experience, brand love and customer engagement in developing countries; and is one of first investigations to use a sample of Generation M.

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Article
Publication date: 1 March 1986

G. Menozzi

Faced with LCCC growth and their widespread acceptance for military applications, Crouzet has planned a two‐way approach for SMDs with MLTF (multilayer thick film) hybrids and…

24

Abstract

Faced with LCCC growth and their widespread acceptance for military applications, Crouzet has planned a two‐way approach for SMDs with MLTF (multilayer thick film) hybrids and advanced PWBs. This paper deals with the R&D programme carried out on both technologies. It briefly addresses MLTF interconnects under a CNES qualification programme and now being used and describes PWB R&D: first investigation and screening, optimisation programme and improvement of large advanced PWB processing. Data are given on the material analysis, TCE measurements, MLB assembly, PTH (plated‐through‐holes), solder joints and thermal analysis.

Details

Microelectronics International, vol. 3 no. 3
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 February 1987

G.F. Love

This paper addresses the various types of surface mounted packages used today for high‐density packaging of Very Large Scale Integrated devices. The paper discusses the pros and…

29

Abstract

This paper addresses the various types of surface mounted packages used today for high‐density packaging of Very Large Scale Integrated devices. The paper discusses the pros and cons of both the leaded and leadless package, and provides the reader with general guidelines for their use.

Details

Circuit World, vol. 13 no. 3
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 February 1985

W. Engelmaier

One concern that has slowed the progress of surface mounted technology, in particular leadless chip carriers, has been the question of the reliability of the surface mount…

128

Abstract

One concern that has slowed the progress of surface mounted technology, in particular leadless chip carriers, has been the question of the reliability of the surface mount attachment technology. This concern follows from the realisation that the functional reliability of surface mount technology is a very complex issue involving many not very well understood components. What is needed is a relatively simple, useful, predictive model. The model reported here sidesteps the numerous complex underlying issues, which, if considered separately, make a predictive reliability model all but impossible, by taking a purely phenomenological approach and relegating second‐order effects to a lumped empirical figure of merit.

Details

Circuit World, vol. 11 no. 3
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 April 1995

Martin Fojt

This special “Anbar Abstracts” issue of Employee Relations is split into seven sections covering abstracts under the following headings: Design of Work; Performance, Productivity…

190

Abstract

This special “Anbar Abstracts” issue of Employee Relations is split into seven sections covering abstracts under the following headings: Design of Work; Performance, Productivity and Motivation; Patterns of work; Pay, incentives and pensions; Career/manpower planning, recruitment; Industrial relations and participation; Health and safety.

Details

Employee Relations, vol. 17 no. 4
Type: Research Article
ISSN: 0142-5455

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Article
Publication date: 1 February 1985

B.L. Roos‐Kozel

The chip carrier industry and the mounting of chip carriers with solder paste are growing rapidly. Recent papers have covered the advantages of increased board density and design…

26

Abstract

The chip carrier industry and the mounting of chip carriers with solder paste are growing rapidly. Recent papers have covered the advantages of increased board density and design flexibility. This paper addresses how percent metal, paste viscosity, paste constituents, pad dimensions and spacing, print thickness, chip carrier weight, and reflow profile correlate with the incidence of undesired pad bridging and solder balls. This information can be used in circuit design and process optimisation.

Details

Microelectronics International, vol. 2 no. 2
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 March 1995

Martin Fojt

This special “Anbar Abstracts” issue of the Industrial and Commercial Training is split into six sections covering abstracts under the following…

223

Abstract

This special “Anbar Abstracts” issue of the Industrial and Commercial Training is split into six sections covering abstracts under the following headings:Education/Graduates/Students; Training/Learning Techniques; Skills Training; Management Development; Career/Human Resources Development; Training Technology.

Details

Industrial and Commercial Training, vol. 27 no. 3
Type: Research Article
ISSN: 0019-7858

Available. Content available
Book part
Publication date: 30 July 2018

Abstract

Details

Marketing Management in Turkey
Type: Book
ISBN: 978-1-78714-558-0

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Article
Publication date: 20 August 2024

Anil Kumar, Pawan Kumar Shaw and Sunil Kumar

The objective of this work is to analyze the necessary conditions for chaotic behavior with fractional order and fractal dimension values of the fractal-fractional operator.

25

Abstract

Purpose

The objective of this work is to analyze the necessary conditions for chaotic behavior with fractional order and fractal dimension values of the fractal-fractional operator.

Design/methodology/approach

The numerical technique based on the fractal-fractional derivative is implemented over the fractional model and analyzes the condition at the distinct values of fractional order and fractal dimension.

Findings

The obtained numerical solution from the numerical technique is analyzed at distinct fractional order and fractal dimension values, and it has been figured out that the behavior of the solution either chaotic or non-chaotic agrees with the condition.

Originality/value

The necessary condition is associated with the fractional order only. So, our work not only studies the condition with fractional order but also examines the model by simultaneously adjusting fractal dimension values. It is found that the model still has chaotic or non-chaotic behavior at certain fractal dimension values and fractional order values corresponding to the condition.

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Article
Publication date: 20 November 2024

Thomas M. Hickman and Michael Stoica

The purpose of this study is to determine if regional proximity and fan club involvement could be used to predict success for brands that jointly sponsor a team and their key…

22

Abstract

Purpose

The purpose of this study is to determine if regional proximity and fan club involvement could be used to predict success for brands that jointly sponsor a team and their key rival.

Design/methodology/approach

A brand with regional proximity to the rival teams it sponsored was identified. Fan club members of a major college sports team served as respondents. Structural equation modeling was used to test a model that predicted antecedents to purchase intentions and positive word-of-mouth based on individual fan characteristics.

Findings

Results suggest that the intrinsic and social components of fanship as well as regional proximity facilitate the success of brands jointly sponsoring rivals. The intrinsic dimension of fandom foreshadowed approval of the joint sponsorship investigated but did not directly enhance the sponsor’s brand equity. Instead, it was demonstrated that fans must first approve of the joint sponsorship arrangement before conferring elevated brand equity onto the sponsor. Increased social interaction with the fan club resulted in higher levels of purchase intentions and positive word-of-mouth of the joint sponsor.

Originality/value

This study differs from prior studies investigating joint sponsors in four ways. First, the intrinsic and social dimensions of fanship were measured within the context of a fan community. Second, the context of the study included a sponsor with regional proximity to both rival teams. Third, it was determined that the proclivity for social interaction within a fan community enhances the positive outcomes for joint sponsors. Fourth, unlike previous research studying joint sponsors, this study demonstrates a path to success for these brands.

Details

Journal of Product & Brand Management, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1061-0421

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