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The purpose of this study was to investigate the effects of aging time on the microstructure, mechanical properties and fracture morphology of Cu/Zn160%SAC0307/Al solder joints produced through solid-state bonding.

Zn particles with a size of 1 µm and Sn-0.3Ag-0.7Cu (SAC0307) particles ranging from 20 to 38 µm were used to achieve Cu/Al micro-connections using ultrasonic assistance at a temperature of 180 °C, followed by aging treatment at 150 °C to enhance the quality of Cu/Al joints. Scanning electron microscopy was used for observing and analyzing the solder seam, interface microstructure, and fracture morphology. The structural composition was determined using energy dispersive spectroscopy, while a PTR-1102 bonding tester was used to measure the average shear strength.

The results indicated that the intermetallic compounds formed at the interface between Cu substrates and solder metal primarily consisted of smooth Cu5Zn8. The Al-side interface mainly comprises an Al-Sn-Zn solid solution, with Zn-Sn-Cu phases forming between SAC0307 particles at 180 °C. During the aging process, atomic diffusion was accelerated, leading to improved connection quality. The shear strength of the joints initially increased before decreasing as aging time progressed; it peaked at 32.92 MPa after 24 h – an increase of 76.8% compared to as-received joints. After reaching stability at 96 h, there was still a notable increase in shear strength by 48.4% relative to as-received joints.

This study further explores the strengthening mechanisms associated with solid-state bonded Cu/SACZ/Al joints through aging processes. Joints created via solid-state bonding demonstrate superior reliability compared to traditional soldered connections. It is anticipated that insights gained from this research will contribute valuable knowledge toward developing low-temperature soldering methodologies for heterogeneous materials.

This study aims to research properties of Cu/SAC0307 mixed solder balls/Al joints with different bonding temperature under ultrasonic-assisted.

A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the joint and successfully achieved micro-joining of Cu/Al under ultrasonic-assisted.

The results indicated that when the bonding temperature was 180°C, there was only one layer of CuZn₅ intermetallic compounds (IMCs) at the Cu interface. However, when the bonding temperature was 190°C, 200°C and 210°C, the Cu interface IMCs had two layers: for one layer, the IMCs near the Cu substrate were Cu₅Zn₈ and for another layer, the IMCs near the solder were CuZn₅. In addition, the thickness of the Cu interfacial IMCs increased with the bonding temperature. In particular, the thickness of IMCs at the Cu interface of the Cu/Al joints soldered at 210°C was 4.6 µm, which increased by 139.6% compared with that of the Cu/Al joints soldered at 180°C. However, there was no IMC layer at the Al interface, but there might be a Zn–Al solid solution layer. The shear strength of Cu/Al joints soldered at 180°C was only 15.01 MPa, but as the soldering temperature continued to increase, the shear strength of the Cu/Al joints increased rapidly. When the soldering temperature was 200°C, the shear strength of the Cu/Al joints reached the maximum of 38.07 MPa, which was 153.6% higher than that at 180°C. When the soldering temperature was 180°C, the fracture of Cu/Al joints was mainly on the Al side. However, when soldering temperature was 190°C, 200°C and 210°C, the fracture of Cu/Al joints was mainly broken in the Zn particles layer.

A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the Cu/Al joint at 210°C.

This study aims to evaluate the effect of thermal aging temperature on the properties of Cu/Cu joints.

A new method that 1 um Zn-particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved the micro-joining of Cu/Cu under ultrasonic-assisted at low-temperature, and then the effect of thermal aging temperature on the properties of Cu/Cu joints was researched.

The composition of the intermetallic compounds (IMCs) on the upper and lower interfaces of Cu/SACZ/Cu joints remained unchanged, which was Cu₅Zn₈ in aging process, and the thickness of the IMCs on the upper and lower interfaces of the Cu/SACZ/Cu joints increased accordingly. Compared with the as-received joints, the thickness of the upper and lower interfaces IMCs of the soldering aged time for 24 h increased by 404.7% and 505.5% at 150ºC, respectively. The IMCs formation tendency and the IMCs growth rate of the lower interface are larger than those of the upper interface because the soldering seam near the IMCs at the upper and lower interfaces of the as-received joints were mostly white SAC0307 balls black Zn-particles, respectively. The growth activation energy of IMCs in the upper and lower interfaces is about 89.21 and 55.11 kJ/mol, respectively. Under the same aging time, with the increase of the aging temperature, the shear strength of Cu/SACZ/Cu joints did not change significantly at first before 150ºC. When the aging temperature reached 150ºC, the shear strength of the joints decreased significantly; the shear strength of the joints was the smallest at 150ºC for 24 h, which was 39.4% lower than that of the as-received joints because the oxidation degree of Zn particles in the joint with the increase of aging temperature and time.

Cu/Cu joints were successfully achieved under ultrasonic-assisted at low-temperature.

This paper aims to investigate the effects of different ultrasonic-assisted loading degrees on the microstructure, mechanical properties and the fracture morphology of Cu/Zn+15%SAC0307+15%Cu/Al solder joints.

A new method in which 45 μm Zn particles were mixed with 15% 500 nm Cu particles and 15% 500 nm SAC0307 particles as solders (SACZ) and five different ultrasonic loading degrees were applied for realizing the soldering between Cu and Al at 240 °C and 8 MPa. Then, SEM was used to observe and analyze the soldering seam, interface microstructure and fracture morphology; the structural composition was determined by EDS; the phase of the soldering seam was characterized by XRD; and a PTR-1102 bonding tester was adopted to test the average shear strength.

The results manifest that Al–Zn solid solution is formed on the Al side of the Cu/SACZ/Al joints, while the interface IMC (Cu₅Zn₈) is formed on the Cu side of the Cu/SACZ/Al joints. When single ultrasonic was used in soldering, the interface IMC (Cu₅Zn₈) gradually thickens with the increase of ultrasonic degree. It is observed that the proportion of Zn or ZnO areas in solders decreases, and the proportion of Cu–Zn compound areas increases with the variation of ultrasonic degree. The maximum shear strength of joint reaches 46.01 MPa when the dual ultrasonic degree is 60°. The fracture position of the joint gradually shifts from the Al side interface to the solders and then to the Cu side interface.

The mechanism of ultrasonic action on micro-nanoparticles is further studied. By using different ultrasonic loading degrees to realize Cu/Al soldering, it is believed that the understandings gained in this study may offer some new insights for the development of low-temperature soldering methodology for heterogeneous materials.

This study aims to research properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted.

A new method that 1µm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved micro-joining of Cu/Cu under ultrasonic-assisted at low temperature.

The results showed that with a continuous increase in the Zn-particle content, the interfacial intermetallic compounds (IMCs) of the upper and lower interfaces of joints gradually changed from scallop-shaped Cu₆Sn₅ to wavy-shaped Cu₅Zn₈. Moreover, the IMC thickness of the upper/lower interface of joints first decreased and then increased with increasing Zn-particle content. The shear strengths of joints increased with Zn-particle content, the shear strength of joints went to a maximum of 29.76 MPa when the Zn-particle content was 40%, an increase of 62.6% compared to joints without Zn particles. However, as the Zn-particle content continued to increase, the shear strengths of the joints decreased. Additionally, when the Zn content increased to 50%, because the oxidation degree of Zn particles increased, the joints were mainly broken among Zn particles.

A new method that 1µm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 µm were mixed to fill the Cu/Cu joint at 180°C.

This study aims to evaluate the effect of thermal aging temperature on the properties of Cu/Al joints.

A new method in which 1 µm Zn-particles and SAC0307 with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved the micro-joining of Cu/Al under ultrasonic-assisted at 200°C, and then, the effect of aging temperature on the properties of Cu/Al joints at different aging times was researched.

The results showed that the Cu interface intermetallic compounds (IMCs) had the same composition and had two layers with Cu₅Zn₈ near the Cu substrate and CuZn₅ near the solder. As the aging time increased, CuZn₅ gradually transformed to Cu₅Zn₈, and the thickness of the CuZn₅ layer gradually decreased until CuZn₅ disappeared completely. There was a Sn–Zn solid solution at the Al interface, and the composition of the Al interface of the Cu/Al joints did not change with changing temperature. The IMC thickness at the Cu interface of the joints continued to increase, and the shear strength of the Cu/Al joints decreased with increasing aging temperature and time. Compared with the as-received samples, the IMC thickness of the Cu interface of joints increased by 371.8% and the shear strength of the Cu/Al joints was reduced by 83.2% when the joints were aged at 150°C for 24 h. With an increase in aging temperature, the fracture mode of the Cu/Al joints changed from being between solder balls and Zn particles to between Zn particles.

With increasing aging temperature, the shear strengths of the Cu/SACZ/Al joints decreased at the same aging time, the shear strength of Cu/SACZ/Al joints at 150°C for 24h decreased by 83.2% compared with that of the as-received joints.

The purpose of this paper is to propose a novel strategy of optimal parameters configuration and placement for sensitive equipment.

In this study, clamped thin plate is considered as the foundation form, and a novel composite system is proposed based on the two-stage isolation system. By means of the theory of mechanical four-pole connection, the displacement amplitude transmissibility from the thin plate to precision equipment is derived. For the purpose of performing optimal design of the composite system, a novel multi-objective idea is presented. Multi-objective particle swarm optimization (MOPSO) algorithm is adopted as an optimization technique, which can achieve a global optimal solution (gbest), and selecting the desired solution from an equivalent Pareto set can be avoided. Maximum and variance of the four transmitted peak displacements are considered as the fitness functions simultaneously; the purpose is aimed at reducing the amplitude of the multi-peak isolation system, meanwhile pursuing a uniform vibration as far as possible. The optimization is mainly organized as a combination of parameter configuration and placement design, and the traversal search of discrete plate is performed in each iteration for the purpose of achieving the global optimum.

An important transmissibility based on the mechanical four-pole connection is derived, and a composite vibration isolation system is proposed, and a novel optimization problem is also defined here. This study reports a novel optimization strategy combined with artificial intelligence for parameters and placement design of precision equipment, which can promote the traditional view of two-stage vibration isolation.

Two-stage vibration isolation systems are widely applied to the vibration attenuation of precision equipment, but in these traditional designs, vibration participation of foundation is often ignored. In this paper, participation of foundation of equipment is considered, and a coherent new strategy for equipment isolation and foundation vibration is presented. This study shows a new vision of interdisciplinary including civil engineering, mechanical dynamics and computational science.

Monascus pigment was widely applied in food processing industry as functional additive, so more attention was paid to the fermentation optimization of pigment production. Therefore, this paper aims to evaluate the best possible fermentative conditions for maximum production of biopigment using submerged fermentation (SFM) and solid state fermentation (SSF) by Monascus purpureus HBSD 08.

The biopigment was produced by using an SMF and an SSF with optimized substrate to achieve higher yield. The antioxidant activity was evaluated by DPPH radical scavenging ability, superoxide anion radical scavenging ability and hydroxyl radical scavenging ability. The pigment composition was analyzed by thin layer chromatography.

Maximum Monascus pigment production (79.6 U/ml and 1,102 U/g) were obtained under an SFM and an SFF. The antioxidant activity of the pigment in an SFM was significantly higher than that in an SFM. The composition of pigment was not different in an SFM and an SFF.

The study developed new conditions, and Monascus strain was a candidate for producing pigment in an SFM and an SFF. To the authors’ best knowledge, this is a first attempt toward comparative evaluation on antioxidant capacity and composition between pigment in an SSF and an SFM. This result will serve for Monascus pigment production.

The purpose of this paper is to empirically examine whether investor attention is a significant risk pricing factor.

Using investor attention data from Eastmoney.com, which provides for each stock the number of investors whose watch list includes that stock on a daily basis, this paper constructs a “heat” factor based on the change in investor attention and a “market exposure” factor based on the proportion of attention on a given stock over the attention to all stocks. Using the Fama−MacBeth two-step regression and a rolling analysis, this study examines the ability of the investor attention factor to explain market returns.

The empirical results show that there exists a risk premium for the “heat” factor and “market exposure” factor that is significantly different from zero. This finding shows that investor attention can systematically influence stock returns, making it a significant risk pricing factor.

This paper’s research on the risk pricing factors of investor attention can help investors to rationally build investment portfolios, avoid risks and form a sound investment concept, which will further reveal the information recognition mechanism of the capital market and standardize the information disclosure behavior of listed companies.

This paper provides evidence that investor attention is a risk pricing factor for the stock market. There are “heat” factors and “market exposure” factors in the Chinese stock market that significantly affect the purchasing behavior of individual investors.

In the stock market, herding behavior occurs when investors mimic the actions of others in their investment decisions. As a result, the market becomes inefficient and speculative bubbles form. This study aims to investigate the relationship between information, overconfidence, market sentiment, experience and national culture, and herding behavior among Malaysian investors. A total of 400 questionnaires are distributed to bank institutions' investors. The survey design based on cross-sectional data is analyzed using the Partial Least Squares Structural Equation Model. The results indicate that information, market sentiment, experience, and national culture are positively related to herding behavior, while overconfidence has no effect. With this, the government should strengthen regulations to prevent the dissemination of misleading information. Moreover, investors are encouraged to overcome narrow thinking by expanding their understanding of different cultures when making investment decisions.