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The type 120 emergency valve is an essential braking component of railway freight trains, but corresponding diaphragms consisting of natural rubber (NR) and chloroprene rubber (CR) exhibit insufficient aging resistance and low-temperature resistance, respectively. In order to develop type 120 emergency valve rubber diaphragms with long-life and high-performance, low-temperatureresistant CR and NR were processed.

The physical properties of the low-temperature-resistant CR and NR were tested by low-temperature stretching, dynamic mechanical analysis, differential scanning calorimetry and thermogravimetric analysis. Single-valve and single-vehicle tests of type 120 emergency valves were carried out for emergency diaphragms consisting of NR and CR.

The low-temperature-resistant CR and NR exhibited excellent physical properties. The elasticity and low-temperature resistance of NR were superior to those of CR, whereas the mechanical properties of the two rubbers were similar in the temperature range of 0 °C–150 °C. The NR and CR emergency diaphragms met the requirements of the single-valve test. In the low-temperature single-vehicle test, only the low-temperature sensitivity test of the NR emergency diaphragm met the requirements.

The innovation of this study is that it provides valuable data and experience for future development of type 120 valve rubber diaphragms.

The brake pipe system was an essential braking component of the railway freight trains, but the existing E-type sealing rings had problems such as insufficient low-temperature resistance, poor heat stability and short service life. To address these issues, low-phenyl silicone rubber was prepared and tested, and the finite element analysis and experimental studies on the sealing performance of its sealing rings were carried out.

The low-temperature resistance and thermal stability of the prepared low-phenyl silicone rubber were studied using low-temperature tensile testing, differential scanning calorimetry, dynamic thermomechanical analysis and thermogravimetric analysis. The sealing performance of the low-phenyl silicone rubber sealing ring was studied by using finite element analysis software abaqus and experiments.

The prepared low-phenyl silicone rubber sealing ring possessed excellent low-temperature resistance and thermal stability. According to the finite element analysis results, the finish of the flange sealing surface and groove outer edge should be ensured, and extrusion damage should be avoided. The sealing rings were more susceptible to damage in high compression ratio and/or low-temperature environments. When the sealing effect was ensured, a small compression ratio should be selected, and rubbers with hardness and elasticity less affected by temperature should be selected. The prepared low-phenyl silicone rubber sealing ring had zero leakage at both room temperature (RT) and −50 °C.

The innovation of this study is that it provides valuable data and experience for the future development of the sealing rings used in the brake pipe flange joints of the railway freight cars in China.

The service performance for colored asphalt pavement is inevitably affected by the addition of different colorants, especially the challenge of low temperature environment in cold regions. Therefore, the purpose of study is to explore the effects of different colorants on the service performance for colored asphalt pavement and to provide a foundation for improving the applicability of colored asphalt pavement in cold regions.

In the study, three kinds of colorants (iron oxide red, iron oxide yellow, iron oxide green) were used to compare the influence of different colorants amounts and different colorants kinds on the service performance for colored asphalt pavement in cold regions. According to the characteristics of low temperature in cold regions, the effects of different colorants on the low temperature performance for colored asphalt pavement were studied.

The study shows that different colorants have different effects on the service performance of colored asphalt pavement. The high temperature performance increases with the increase of the colorants amount, but the low temperature performance is opposite. Additionally, the yellow colored asphalt pavement has more advantages of low temperature adaptation than the red and green colored asphalt pavement.

The study results provide a certain theoretical foundation for the application of colored asphalt pavement in cold regions and have certain value and significance for the further development of colored asphalt pavement.

To understand the service performance of full ceramic ball bearings under extreme working conditions and improve their service life, dynamic characteristic tests of full ceramic ball bearings under ultra-low temperature conditions were carried out by a low-temperature bearing life testing machine, and temperature rise and friction were measured under extreme low-temperature environment.

The heat-flow coupling model of bearing was established by CFD software, and the test results were further analyzed.

The results show that the temperature rise of the bearing is not obvious in the liquid nitrogen environment. With the increase of the chamber temperature, the lubrication state of the bearing changes, resulting in the temperature rise of the outer ring of the bearing. As the temperature of the test chamber increases, the friction force on the bearing increases first and then decreases under the action of multifactor coupling.

The research results provide test data and theoretical basis for the application of all-ceramic ball bearings in aerospace and other fields and have important significance for improving the service life of high-end equipment under extreme working conditions.

The research results provide test data and theoretical basis for the application of full ceramic ball bearings in aerospace and other fields and have important significance for improving the service life of high-end equipment under extreme working conditions.

The research results provide test data and theoretical basis for the application of full ceramic ball bearings in aerospace and other fields and have important significance for improving the service life of high-end equipment under extreme working conditions.

The research results provide test data and theoretical basis for the application of full ceramic ball bearings in aerospace and other fields and have important significance for improving the service life of high-end equipment under extreme working conditions.

In order to evaluate the rheological properties of asphalt more comprehensively and effectively, and to explore and discuss the practicability of relevant models in the evaluation of the rheological properties of asphalt.

Based on the rheological and viscoelastic theories, temperature scanning, frequency scanning and multiple stress creep recovery (MSCR) tests of different modified asphalt were carried out by dynamic shear rheometer (DSR) to obtain relevant viscoelastic parameters and evaluate the high temperature properties of different modified asphalt. Based on the time-temperature equivalence principle, the main curve was constructed to study the viscoelastic properties of asphalt in a wider frequency domain. The main curve was fitted with the CAM model, and the rheological properties of different modified asphalt were evaluated through the analysis of model parameters. The creep stiffness and creep velocity of different modified asphalt were obtained through the rheological test of bending beam (BBR), and the low-temperature performance of different modified asphalt was analyzed by using Burgers model to fit the creep compliance.

The results show that the high temperature rheological properties of several modified asphalt studied in the test are ranked from best to worst as follows: PE modified asphalt > SBS modified asphalt > SBR modified asphalt. Short-term aging can improve the high temperature performance of asphalt, and different types of modifiers can promote or inhibit this improvement effect. Based on BBR test and Burgers model fitting analysis, SBR modified asphalt has the best low temperature performance, followed by SBS modified asphalt, while PE modified asphalt has poor low temperature performance, so it is not suitable to be used as road material in low temperature area.

Combined with effective evaluation methods, the rheological properties of asphalt at different temperatures and angles were systematically evaluated, and the evolution of rheological properties of asphalt characterized by model parameters was further analyzed by advanced model simulation.

Numerous problems have arisen in the application of freezing methods to the various types of food products. One problem is concerned with the determination of the direct effects of low temperatures upon the food itself and another problem is to determine the effects of low temperatures upon other factors which may in turn affect the quality of the food. We are especially interested in knowing the exact effects of freezing and other low temperatures upon the micro‐organisms associated with foods. Bacteria constitute the most significant group of micro‐organisms affecting the sanitation and keeping qualities of foods. Those bringing about the decomposition of food products, while they are many and vary greatly, depending upon the nature of the food, are chiefly organisms from the air, water and soil. The types of bacteria found in foods vary greatly in their action on the food and also in reaction or response to varying temperature conditions. The action of micro‐organisms on foods of high carbohydrate content results in fermentations, while the action of the micro‐organisms on foods of high protein content will result, chiefly, in putrefactive changes. The former type of change usually occurs at a more rapid rate, when conditions are favourable, but the latter change usually results in a more undesirable condition of the food. While certain types of bacteria grow best at temperatures well above human body temperatures and others even as low as the freezing point of water, a large majority of those found in foods and the ones normally responsible for the detrimental changes in foods, are active only between 50° and 100° F. It is this latter group which is most implicated in food spoilage and it is significant that this group will be most effectively suppressed by low temperatures. Bacteria are much less affected by low than by high temperatures. Cold alone does not kill most types of bacteria, but slows down their activities to such an extent that they multiply very slowly, if at all. Many bacteria will die off, however, when held at a temperature below that which permits growth and reproduction. Bacteria, generally speaking, will be more easily killed when frozen in pure water than when frozen in foods containing albuminous matter and fats. There are a few bacteria of the cold‐loving type, which may actually multiply and cause slow decomposition at temperatures of 0° C. or less, if substances in solution are present to depress the crystallising point of water. Cold not only retards the growth of bacteria by the direct physiological effect of slowing down the rate of metabolism, but also depresses bacterial activity through its effect on their water and food supplies. Bacteria cannot grow and multiply in a completely frozen or crystallised medium, since they are by nature aquatic and are unable to carry on their normal activities except in a liquid medium. There is no evidence that bacteria maintain a body temperature which would make water available from a completely frozen medium. Bacteria may only utilise food when it is in soluble form, and thus capable of diffusion through their semipermeable cell membranes. When the temperature is sufficiently low to cause the crystallisation of most of the water, the remaining constituents become relatively more concentrated and this will further suppress the activity of the bacterial cells by affecting their osmotic pressures. These effects are very similar to those of partial desiccation or drying. In the course of experimentation some very striking examples of bacterial resistance to low temperatures have been reported. Lactobacillus and aerobacter have been reported to survive in peas stored at −10° C. for two years; whilst bacteria of the genus Pseudomonas were reported to increase in numbers when stored at −4° C. In general it may be said that practically all pathogenic bacteria likely to be found in foods will die off rather rapidly at low temperatures. However, this should not be interpreted to mean that infected foods can be made safe by low temperatures alone. Among the disease producing bacteria transmitted through foods, those of special significance include the organisms and toxins of botulism, typhoid fever, the several organisms of food poisoning called ptomaine poisoning, belonging to the Salmonella group (Salmonella enteritidis, etc.), and various organisms causing infections of the general nature of dysenteries or summer complaints of infants and adults. Frozen foods present no greater threat of botulism than foods preserved by other methods, yet it has been shown that Clostridium botulinum spores may survive freezing at −16° C. for as long as 14 months. The vegetables when thawed become toxic in from three to six days. Experiments have shown that Clostridium botulinum in foods preserved by “quick freezing” and subsequent storage at temperatures below 10° C., show no toxin production for at least 30 days. The lower the temperature of storage the greater the protection against botulism. All foods in which Clostridium botulinum might be present, and which have not been thoroughly heated, should be refrigerated at or near the freezing point. All foods which may harbour the botulism organisms or toxins should be selected with special care, before they are frozen, and care should be taken to see that they are kept frozen until used by the customer. Frozen vegetables should be used immediately after thawing. Thawing and refreezing is always objectionable since such a practice leads to loss of quality, and since bacterial growth and activity may occur during the period of thawing. While the typhoid organisms (Eberthella typhosa) shows considerable variation in resistance to low temperatures, it has been shown that about 99 per cent. will be killed immediately by freezing. Temperatures below freezing apparently have little more effect than the freezing point temperature. Small numbers of the Salmonella and similar organisms of the food poisoning groups may survive in frozen foods for periods of several weeks. It has been shown, however, that no significant growth of activity of these organisms will occur if the foods are refrigerated at 5° C. (41° F.) or less. Moulds and yeasts are of relatively little importance in frozen foods, both from the standpoint of sanitation and food spoilage. While low temperatures will materially retard the rate of enzymatic changes within food products, there is evidence that such changes continue to take place in frozen foods, even considerably below the freezing point. These changes probably account, in part, for the fact that frozen foods once thawed, will decompose more rapidly than foods which have not been frozen.

The performance of epoxy coating on metal substrate at low temperature and high humidity application has adverse effect on cure rate, film properties and adhesion. In recent years, several advanced amine cross-linking agents having superior curing ability at low temperature application environment have been introduced. The aim of this paper is to study the properties of epoxy-based coating cured with different cross-linking agents designed for low temperature application at different environmental conditions.

Series of cross linking agents such as modified cycloaliphatic amine (H1), polyamine adduct (H2), modified aliphatic ketamine (H3), phenalkamine (H4) and phenalkamide (H5) have been studied to evaluate their performance in epoxy compositions when cured at four environmental conditions, i.e. at ambient and sub-ambient temperatures with 60 and 90 per cent relative humidity, respectively. The effect of curing conditions was investigated by evaluating different physico-mechanical properties. Dynamic mechanical analyser technique was used to determine glass transition temperature (T_g) and cross-link density (ρ) of coatings. Anticorrosive properties of coatings also have been studied by electrochemical impedance spectroscopy.

The outcome of this study is expected to generate new insight into the curing behaviour of epoxy coating using different cross-linking agents which are recommended for low temperature application. Optimum physico-mechanical and corrosion resistance properties have been obtained by phenalkamine curing agent at low temperature and high humidity condition.

This study is an experimental approach to select the better cross-linking agent for low temperature application. Different test conditions were measured for understanding the performance of epoxy coating cured at different environmental condition.

The understanding reaction mechanism of the epoxy resin with cross-linking agent at different environmental condition is the great challenge and is hardly investigated in the literature. Therefore, in this research, the influence of climatic conditions and type of cross-linking agents on curing behaviour of epoxy-based coating was investigated.

This study aims to address the problem of low-temperature wave soldering in industry production with Sn-9Zn-2.5 Bi-1.5In alloys and develop qualified process parameters. Sn–Zn eutectic alloys are lead-free solders applied in consumer electronics due to their low melting point, high strength, and low cost. In the electronic assembly industry, Sn–Zn eutectic alloys have great potential for use.

This paper explored developing and implementing process parameters for low-temperature wave soldering of Sn–Zn alloys (SN-9ZN-2.5BI-1.5 In). A two-factor, three-level design of the experiments experiment was designed to simulate various conditions parameters encountered in Sn–Zn soldering, developed the nitrogen protection device of waving soldering and proposed the optimal process parameters to realize mass production of low-temperature wave soldering on Sn–Zn alloys.

The Sn-9Zn-2.5 Bi-1.5In alloy can overcome the Zn oxidation problem, achieve low-temperature wave soldering and meet IPC standards, but requires the development of nitrogen protection devices and the optimization of a series of process parameters. The design experiment reveals that preheating temperature, soldering temperature and flux affect failure phenomena. Finally, combined with the process test results, an effective method to support mass production.

In term of overcome Zn’s oxidation characteristics, anti-oxidation wave welding device needs to be studied. Various process parameters need to be developed to achieve a welding process with lower temperature than that of lead solder(Sn–Pb) and lead-free SAC(Sn-0.3Ag-0.7Cu). The process window of Sn–Zn series alloy (Sn-9Zn-2.5 Bi-1.5In alloy) is narrow. A more stringent quality control chart is required to make mass production.

In this research, the soldering temperature of Sn-9Zn-2.5 Bi-1.5In is 5 °C and 25 °C lower than Sn–Pb and Sn-0.3Ag-0.7Cu(SAC0307). To the best of the authors’ knowledge, this work was the first time to apply Sn–Zn solder alloy under actual production conditions on wave soldering, which was of great significance for the study of wave soldering of the same kind of solder alloy.

Low-temperature wave soldering can supported green manufacturing widely, offering a new path to achieve carbon emissions for many factories and also combat to international climate change.

There are many research papers on Sn–Zn alloys, but methods of achieving low-temperature wave soldering to meet IPC standards are infrequent. Especially the process control method that can be mass-produced is more challenging. In addition, the metal storage is very high and the cost is relatively low, which is of great help to provide enterprise competitiveness and can also support the development of green manufacturing, which has a good role in promoting the broader development of the Sn–Zn series.

The purpose of this paper is to present a novel high speed impact testing method for evaluating the effects of low temperatures on eutectic and lead‐free solder joints. Interfacial cracking failure of Sn‐based and Pb‐free solders at subzero temperatures is of significant concern for electronic assemblies that operate in harsh environments.

This paper presents a newly designed low temperature control system coupled with an Instron micro‐impact testing machine, which offers a package level test for solder bumps, and that is used at subzero temperature ranges as low as −40°C. This study examined the failure characteristics of 63Sn‐37Pb (Sn37Pb) and 96.5Sn‐3Ag‐0.5Cu (SAC305) solder joints at temperatures ranging from room temperature (R.T.) to −40°C, and at impact speeds of 1 m/s.

Three types of failure mode were identified: M1 interfacial fracture with no residual solder remaining on the pad (interfacial cracking); M2 interfacial fracture with residual solder persisting on the pad (mixed mode failure); and M3 solder ball fracture (bulk solder cracking). The experimental results indicated that the energy to peak load for both types of solders decreased significantly, by approximately 35 percent to 38 percent when the test temperature was reduced from R.T. to −40°C. In addition, the peak load of the Sn37Pb solder joint increased noticeably with a decreasing test temperature. However, the peak load of the SAC305 specimen remained virtually unchanged with a reduction in the temperature. The Sn37Pb solder joints failed in an M3 failure mode under all the considered testing temperatures. The SAC305 solder joints displayed both M1 and M2 failure modes at R.T.; however, they failed almost exclusively in M1 mode at the lowest test temperature of −40°C.

This paper presents a novel technique for evaluating high‐speed impact strength and energy absorbance of Sn‐based and Pb‐free solders at the chip level within a low temperature control system. To overcome the drawbacks experienced in other studies, this study focused specifically on cryo‐impact testing systems and the performed experimental steps to improve the accuracy of post‐test analysis.

This paper aims to demonstrate low-temperature bonding for piezoelectric materials at temperatures well below the relevant Curie temperatures so as to avoid depolarization of the piezoelectric material during bonding.

Au-coated test samples of lead zirconate titanate (PZT) are bonded to a WC-based resonant backing layer with In–Bi eutectic material in which the In–Bi metal system is a preform or thin, evaporated layers. The bonded samples are characterized using electrical impedance spectroscopy and cross-section microscopy. The first technique verifies the integrity of polarization and reveals the quality of the bondline in a non-destructive manner, particularly looking for voids and delaminations. The latter technique is destructive but gives more precise information and an overview of the structure.

Successful low-temperature (115°C) bonding with intact PZT polarization was demonstrated. The bondlines show a layered structure of Au/Au–In intermetallic compounds (with Bi inclusions)/Au, capable of withstanding temperatures as high as 271°C before remelting occurs. For bonded samples using In–Bi preform, repeatable bonds of high quality (very little voiding) were obtained, but the bonding time is long (1 h or more). For bonded samples using evaporated thin films of In–Bi, bonding can be performed in 30 min, but the process needs further optimization to be repeatable.

Low-temperature solid-liquid interdiffusion (SLID) bonding is a novel technique, merging the fields of low-temperature solder bonding with the SLID/transient liquid phase (TLP) approach, which is normally used for much higher temperatures.