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This paper aims to inspect the effect of indirect elevated temperature on the mechanical performance of nano silica concrete (NSC). The effect on both compressive and bond strengths is studied. Pre- and post-exposure to elevated temperature ranges of 200 to 600°C is examined. A range covered by three percentages of 1.5, 3 and 4.5 per cent nano silica (NS) in concrete mixes is tested.

Pre-exposure mechanical tests (normal conditions – room temperature), using 3 per cent NS in the concrete mix, led to the highest increase in both compressive and bond strengths (43 per cent and 38.5 per cent, respectively), compared to the control mix without NS (based on 28-day results). It is worth noticing that adding NS to the concrete mixes does not have a significant effect on improving early-age strength. Besides, permeability tests are performed on NSC with different NS ratios. NS improved the concrete permeability for all tested percentages of NS. The maximum reduction is accompanied by the maximum percentage used (4.5 per cent NS in the NSC mix), reducing permeability to half the value of the concrete mix without NS. As for post-exposure to elevated-temperature mechanical tests, NSC with 1.5 per cent NS exhibited the lowest loss in strength owing to indirect heat exposure of 600°C; the residual compressive and bond strengths are 73 per cent and 35 per cent, respectively.

The dispersion technique of NS has a key role in NSC-distinguished mechanical performance with NSC having lower NS percentages. NS significantly improved bond strength. NS has a remarkable effect on elevated temperature endurance. The bond strength of NSC exposed to elevated temperatures suffered faster deterioration than compressive strength of the exposed NSC.

A special scale factor needs to be investigated for the NSC.

Although a lot of effort is placed in evaluating the benefits of using nano materials in structural concrete, this paper presents one of the first outcomes of the thermal effects on concrete mixes with NS as a partial cement replacement.

Anisotropic conductive film (ACF) is now an attractive technology for direct mounting of chips onto the substrate as an alternative to lead‐free solders. However, despite its various advantages over other technologies, it also has many unresolved reliability issues. For instance, the performance of ACF assembly in high temperature applications is questionable. The purpose of this paper is to study the effect of bonding temperatures on the curing of ACFs, and their mechanical and electrical performance after high temperature ageing.

In the work presented in this paper, the curing degree of an ACF at different bonding temperatures was measured using a differential scanning calorimeter. The adhesion strength and the contact resistance of ACF bonded chip‐on‐flex assembly were measured before and after thermal ageing and the results were correlated with the curing degree of ACF. The ACF was an epoxy‐based adhesive in which Au‐Ni coated polymer particles were randomly dispersed.

The results showed that higher bonding temperatures had resulted in better ACF curing and stronger adhesion. After ageing, the adhesion strength increased for the samples bonded at lower temperatures and decreased for the samples bonded at higher temperatures. ACF assemblies with higher degrees of curing showed smaller increases in contact resistance after ageing. Conduction gaps at the bump‐particle and/or particle‐pad interfaces were found with the help of scanning electron microscopy and are thought to be the root cause of the increase in contact resistance.

The present study focuses on the effect of bonding temperatures on the curing of ACFs, and their adhesion strength and electrical performances after high temperature ageing. The results of this study may help the development of ACFs with higher heat resistance, so that ACFs can be considered as an alternative to lead‐free solders.

Bumpless Cu/SiO₂ hybrid bonding, which this paper aims to, is a key technology of three-dimensional (3D) high-density integration to promote the integrated circuits industry’s continuous development, which achieves the stacks of chips vertically connected via through-silicon via. Surface-activated bonding (SAB) and thermal-compression bonding (TCB) are used, but both have some shortcomings. The SAB method is overdemanding in the bonding environment, and the TCB method requires a high temperature to remove copper oxide from surfaces, which increases the thermal budget and grossly damages the fine-pitch device.

In this review, methods to prevent and remove copper oxidation in the whole bonding process for a lower bonding temperature, such as wet treatment, plasma surface activation, nanotwinned copper and the metal passivation layer, are investigated.

The cooperative bonding method combining wet treatment and plasma activation shows outstanding technological superiority without the high cost and additional necessity of copper passivation in manufacture. Cu/SiO₂ hybrid bonding has great potential to effectively enhance the integration density in future 3D packaging for artificial intelligence, the internet of things and other high-density chips.

To achieve heterogeneous bonding at a lower temperature, the SAB method, chemical treatment and the plasma-assisted bonding method (based on TCB) are used, and surface-enhanced measurements such as nanotwinned copper and the metal passivation layer are also applied to prevent surface copper oxide.

The purpose of this paper is to investigate the efficiencies of argon (Ar), oxygen (O₂) and O₂ followed by Ar (O₂→Ar) plasma treatments in terms of contaminant removal and wire bond interfacial adhesion improvement. The aim of this study is to resolve the “lifted ball bond” issue, which is one of the critical reliability checkpoints for light emitting diodes (LEDs) in automotive applications.

Ar, O₂ and O₂→Ar plasma treatments were applied to LED chip bond pad prior to wire bonding process with different treatment durations. Various surface characterization methods and contact angle measurement were then used to characterize the surface properties of these chip bond pads. To validate the improvements of Ar, O₂ and O₂→Ar plasma treatments to the wire bond interfacial adhesion, the chip bond pads were wire bonded and examined with a ball shear test. Moreover, the contact resistance of the wire bond interfaces was also measured by using four-point probe electrical measurements to complement the interfacial adhesion validation.

Surface characterization results show that O₂→Ar plasma treatment was able to remove the contaminant while maintaining relatively low oxygen impurity content on the bond pad surface after the treatment and was more effective as compared with the O₂ and Ar plasma treatments. However, O₂→Ar plasma treatment also simultaneously reduced high-polarity bonds on the chip bond pad, leading to a lower surface free energy than that with the O₂ plasma treatment. Ball shear test and contact resistance results showed that wire bond interfacial adhesion improvement after the O₂→Ar plasma treatment is lower than that with the O₂ plasma treatment, although it has the highest efficiency in surface contaminant removal.

To resolve “lifted ball bond” issue, optimization of plasma gas composition ratios and parameters for respective Ar and O₂ plasma treatments has been widely reported in many literatures; however, the O₂→Ar plasma treatment is still rarely focused. Moreover, the observation that wire bond interfacial adhesion improvement after O₂→Ar plasma treatment is lower than that with the O₂ plasma treatment although it has the highest efficiency in surface contaminant removal also has not been reported on similar studies elsewhere.

The relationship between Cr/C and properties of Fe‐C‐Cr high chromium white irons was studied by calculating the valence electron structure of austenite of Fe‐C‐Cr high chromium white irons with the empirical electron theory of solids and molecules (EET) and the equilibrium phase diagram of Fe‐C‐Cr system. Results show that the C‐Cr bond is the strongest bond of all bonds in alloying austenite in Fe‐C‐Cr high chromium white irons of industrial application and, thereby, causes partial aggregation of C‐Cr atomic groups. The weight of partial aggregation of C‐Cr atomic groups would be increased greatly and more austenite would be reserved to room temperature when Cr/>6. The Fe‐CCr high chromium white irons achieve best mechanical property when Cr/C=5.5‐6.5.

This paper aims to investigate the thermal oxidation behavior of trimethylolpropane trioleate (TMPTO) base oil when exposed to Fe surfaces.

Samples of TMPTO bulk oil were placed in Fe vessels and heated in an oven to accelerate the oxidation at different time intervals, while others were placed in glass vessels and used as experimental controls. Subsequently, the physicochemical properties of the oxidized TMPTOs, including the kinematic viscosity and acid value, were measured and a structural analysis was conducted using the Raman and Fourier transform infrared (FTIR) techniques.

The results demonstrate that the TMPTO bulk oil exhibited an exponential increase in the kinematic viscosity along with the increasing acid value over the oxidation time. The Fe surface significantly increased the kinematic viscosity of TMPTO, while only mildly impacting its acid value compared with the experimental controls. The structural analysis results of the TMPTO suggest that the C = C and = C-H bonds were the vulnerable sites. Furthermore, the results suggest that the Fe surface evidently accelerates the chemical reactions of the C = C and the = C-H bonds, and less alcohols and more carbonyl products were identified in the oil samples that were heated in the Fe vessels.

The results demonstrate that the Fe surfaces affected the oxidation behavior of the TMPTO base oil, and an interaction mechanism between the Fe and the TMPTO is developed.

The strength of annealed ZrO2/Pd diffusion bonds was found to be weakened after annealing in both air and vacuum. Annealing in air reduces the strength much faster and more severely than in vacuum. Fracture surfaces of as‐bonded joints and those annealed in air and vacuum were studied to characterise the different effects of air and vacuum on the bonded interfaces. Various sizes of precipitates and voids were observed and their distribution on the fractured surfaces was examined by light microscopy. Large precipitates and voids were found close to the edges of the specimen. It is believed that the loss of strength after annealing is an effect of these defects at the highly stressed specimen edges. Transmission and analytical electron microscopy of as‐bonded joints show that an interface layer of very fine grains about 1 micron thick was formed during the bonding process. This layer has a different crystalline structure and composition from both Pd and ZrO2. Characterisation of this layer by electron microscopy is presented in this report. The formation of such a thick interface layer is probably not a pure diffusion process, rather a diffusion and melting process. From the Pd‐Zr phase diagram, there is a range of compositions near a eutectic point where a liquid phase is possible at the bonding temperatures used (1100°C). Taking the Pd‐Zr system as a qualitatively comparable system to Pd‐ZrO2, it is deduced that, at the very beginning of the bonding, Zr and Pd diffuse into each other until the melting composition is reached. The formation of the liquid phase will promote the contact and bonding processes dramatically. This explains why strong bonding cannot be achieved at lower bonding temperatures as was reported in an earlier paper. Similar experiments on Ni/ZrO2 diffusion bonds have also been studied to identify the mechanism of bonding and to compare it with Pd/ZrO2. No reaction was observed at the interface in Ni/ZrO2. Thus the wetting mechanism is absent which explains the formation of a large amount of interface voids and the much weaker bonding strength found in Ni/ZrO2 bonds.

This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints by transient liquid phase bonding (TLPB).

TLPB is promising to assemble die-attaching packaging for power devices. In this study, porous Cu (P-Cu) foil with a distinctive porous structure and Sn-58Bi solder (SB) serve as the bonding materials for TLPB under a formic acid atmosphere (FA). The high surface area of P-Cu enables efficient diffusion of the liquid phase of SB, stimulating the wetting, spreading and formation of intermetallic compounds (IMCs).

The higher bonding temperature decreased strength due to the coarsening of IMCs. The longer bonding time reduced the bonding strength owing to the coarsened Bi and thickened IMC. Applying optimal bonding pressure improved bonding strength, whereas excessive pressure caused damage. The presence of a Pt catalyst enhanced bonding efficiency and strength by facilitating reduction–oxidation reactions and oxide film removal.

Overall, this study demonstrates the feasibility of low-temperature TLPB for Cu/SB/P-Cu/SB/Cu joints and provides insights into optimizing bonding strength for the interconnecting materials in the applications of power devices.

The deposition of particles onto a substrate during the cold spraying (CS) process relies on severe plastic deformation, so there are various micro-defects induced by insufficient deformation and severe crushing. To solve the problems, many post-treat techniques have been used to improving the quality by eliminating the micro-defects. This paper aims to help scholars and engineers in this field a better and systematic understand of CS technology by summarizing the post-treatment technologies that have been investigated recently years.

This review summarizes the types of micro-defects and introduces the effect of micro-defects on the properties of CS coating/additive manufactured, illustrates the post-treatment technologies and its effect on the microstructure and performances, and finally outlooks the future development trends of post-treatments for CS.

There are significant discoveries in post-treatment technology to change the performance of cold spray deposits. There are also many limitations for post-treatment methods, including improved performance and limitations of use. Thus, there is still a strong requirement for further improvement. Hybrid post-treatment may be a more ideal method, as it can eliminate more defects than a single method. The proposed ultrasonic impact treatment could be an alternative method, as it can densify and flatten the CS deposits.

It is the first time to reveal the influence factors on the performances of CS deposits from the perspective of microdefects, and proposed corresponding well targeted post-treatment methods, which is more instructive for improving the performances of CS deposits.