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Artificial intelligence (AI) is constantly evolving and is poised to significantly transform the world, affecting nearly every sector and aspect of society. As AI continues to evolve, it is expected to create a more dynamic, efficient and personalized education system, supporting lifelong learning and adapting to the needs and pace of each student. In this research, we focus on testing the model of AI acceptance in higher education (HE) through human interaction-based factors including attitudes, competencies and openness to experience. Perceived benefits were our expectation to enhance AI acceptance in HE.

To test the model, we collected data from Arab HE institutions by spreading an online questionnaire. The sample consisted of 1,152 of teaching staff and students in Arab region, which were selected randomly. Partial least squares structural equation modeling (PLS-SEM) was employed to determine the interrelated dependence of relationships among variables. Furthermore, processing analysis was conducted to ensure the reliability and validity of questionnaires, multicollinearity and factor loading, in which the items were tested one more time to ensure their validity after translation into Arab language.

Results reveal that adopted attitude, digital competency and openness to experience have positive and significant relationship with both perceived benefits and AI acceptance in HE in the Arab region. The results also demonstrate the indirect impact of digital factors on AI acceptance in existence of perceived benefits, which was important in the validation of the model.

The research contributes to AI acceptance theory and research by providing evidence of AI acceptance in the Arab region. As generative AI applications continue to expand and change, the way we accept and interact with them will be different. This model could be adopted by authorities to facilitate the acceptance of AI in Arab HE institutions.

Integration of religiosity and positive emotions at workplace sheds light on the intersection of faith and professional well-being where these two factors lead to increased job satisfaction, higher productivity and improved overall mental health. The study examines the relationship between religiosity, positive emotions and work engagement among academics in Algeria.

This research is based on the Conservation of Resources (COR) theory and the job demands-resources (JD-R) model of work engagement. The study uses a cross-sectional self-administered questionnaire with stratified random sampling to collect data from 356 academics at public universities in Algeria. The data were analysed using partial least squares structural equation modelling (PLS-SEM) with Smart PLS 3.

The results indicate that religiosity is positively associated with work engagement, and positive emotions mediate the relationship between religiosity and work engagement. The study also illustrates that job demands (workload) moderate the relationship between positive emotions and work engagement.

The study highlighted that role of religiosity and positive emotions as essential factors in increasing academics' work engagement and contributes to the COR theory and JD-R model of work engagement.

This study aims to investigate numerically a thermomechanical behavior of disc brake using ANSYS 11.0 which applies the finite element method (FEM) to solve the transient thermal analysis and the static structural sequentially with the coupled method. Computational fluid dynamics analysis will help the authors in the calculation of the values of the heat transfer (h) that will be exploited in the transient evolution of the brake disc temperatures. Finally, the model resolution allows the authors to visualize other important results of this research such as the deformations and the Von Mises stress on the disc, as well as the contact pressure of the brake pads.

A transient finite element analysis (FEA) model was developed to calculate the temperature distribution of the brake rotor with respect to time. A steady-state CFD model was created to obtain convective heat transfer coefficients (HTC) that were used in the FE model. Because HTCs are dependent on temperature, it was necessary to couple the CFD and FEA solutions. A comparison was made between the temperature of full and ventilated brake disc showing the importance of cooling mode in the design of automobile discs.

These results are quite in good agreement with those found in reality in the brake discs in service and those that may be encountered before in literature research investigations of which these will be very useful for engineers and in the design field in the vehicle brake system industry. These are then compared to experimental results obtained from literatures that measured ventilated discs surface temperatures to validate the accuracy of the results from this simulation model.

The novelty of the work is the application of the FEM to solve the thermomechanical problem in which the results of this analysis are in accordance with the realized and in the current life of the braking phenomenon and in the brake discs in service thus with the thermal gradients and the phenomena of damage observed on used discs brake.

This paper focuses on the fluid-structure interaction (FSI) analysis of moisture induced stress for the flip chip ball grid array (FCBGA) package with hydrophobic and hydrophilic materials during the reflow soldering process. The purpose of this paper is to analyze the influence of moisture concentration and FCBGA with hydrophobic material on induced pressure and stress in the package at varies times.

The present study analyzed the warpage deformation during the reflow process via visual inspection machine (complied to Joint Electron Device Engineering Council standard) and FSI simulation by using ANSYS/FLUENT package. The direct concentration approach is used to model moisture diffusion and ANSYS is used to predict the Von-Misses stress. Models of Test Vehicle 1 (similar to Xie et al., 2009b) and Test Vehicle 2 (FCBGA package) with the combination of hydrophobic and hydrophilic materials are performed. The simulation for different moisture concentrations with reflows process time has been conducted.

The results from the mechanical reliability study indicate that the FSI analysis is found to be in good agreement with the published study and acceptable agreement with the experimental result. The maximum Von-Misses stress induced by the moisture significantly increased on FCBGA with hydrophobic material compared to FCBGA with a hydrophilic material. The presence of hydrophobic material that hinders the moisture desorption process. The analysis also illustrated the moisture could very possibly reside in electronic packaging and developed beyond saturated vapor into superheated vapor or compressed liquid, which exposed electronic packaging to higher stresses.

The findings provide valuable guidelines and references to engineers and packaging designers during the reflow soldering process in the microelectronics industry.

Studies on the influence of moisture concentration and hydrophobic material are still limited and studies on FCBGA package warpage under reflow process involving the effect of hydrophobic and hydrophilic materials are rarely reported. Thus, this study is important to effectively bridge the research gap and yield appropriate guidelines in the microelectronics industry.

The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed.

Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process.

With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed.

This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process.

The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

The purpose of this study is to investigate the dynamics of capillary underfill flow (CUF) in flip-chip packaging, particularly in a multi-chip configuration. The study aims to understand how various parameters, such as chip-to-chip spacing (S12), chip thickness (tc) and others, affect the underfill flow process. By using computational fluid dynamics (CFD) simulations and experimental studies, the goal is to provide insights into understanding the dynamics of CUF in heterogeneous electronic packaging.

The paper introduces a CFD analysis and experimental study on CUF in a multi-chip configuration, aiming to understand underfill flow dynamics. A 3D geometry models of multi-chip arrangement are created using computer-aided design (CAD) software. After that, the CAD models are meshed and simulated in Ansys Fluent using incompressible and non-Newtonian fluid properties. The study maintains S12 of 2.86 and tc of 22.29 between experimental and simulation data for results validation. Next, a various of S12 values (1.14, 2.86, 5.71, 8.57, 14.29 and 20) which focus on tc of 22.29 have been investigated. Further studies have been conduct using S12 of 5.71 and tc of 8.00, 14.29 and 22.29.

Results show a strong correlation between simulation and experiment which validate the correctness and robustness of simulation. Further parameter’s studies using simulation for various of S12 indicated that higher S12 values lead to faster flow. This effect is due to large underfill weight from reservoir able to flow into S12 region which contributed to higher mass momentum movement. Furthermore, the effect of various of tc shows that the thicker the chip the faster the underfill to flow in S12 region.

The intentional exclusion of solder bump pattern arrangements from the experiment and simulation may limit the study's ability to fully understand the impact of solder bump patterns on underfill flow. Therefore, more parameters can be investigated such as solder bump pattern, underfill weight and dispense pattern in the future using CFD.

The manuscript provides a comprehensive examination of the contributions of CFD to the advancement of knowledge regarding CUF phenomena in heterogeneous electronic packaging assemblies. Moreover, it delineates the utilization of CFD methodologies to assess the influence of chip-to-chip spacing (S12) and the thickness of the chip (tc) on the underfill flow characteristics.

This paper fulfills an identified need of computational fluid dynamics method to study capillary underfill flow dynamics in heterogenous electronic packaging.

The purpose of this paper is to present the experimental and simulation studies on the influence of copper pillar bump structure on flip chip packaging during reflow soldering.

In this work, solidification/melting modelling and volume of fluid modelling were used. Reflow soldering process of Cu pillar type FC was modelled using computational fluid dynamic software (FLUENT). The experimental results have been validated with the simulation results to prove the accuracy of the numerical method.

The findings of this study reveal that solder volume is the most important element influencing reflow soldering. The solder cap volume reduces as the Cu pillar bump diameter lowers, making the reflow process more difficult to establish a good solder union, as less solder is allowed to flow. Last but not least, the solder cap height for the reflow process must be optimized to enable proper solder joint formation.

This study provides a basis and insights into the impact of copper pillar bump structure on flip chip packaging during reflow soldering that will be advancing the future design of 3D stack package. This study also provides a superior visualization and knowledge of the melting and solidification phenomenon during the reflow soldering process.

The computational fluid dynamics analysis of copper pillar bump structure on flip chip packaging during reflow soldering is scant. To the authors’ best knowledge, no research has been concentrated on copper pillar bump size configurations in a thorough manner. Without the in-depth study, copper pillar bump size might have the impact of copper pillar bump structure on flip chip packaging during reflow soldering. Five design of parameter of flip chip IC package model was proposed for the investigation of copper pillar bump structure on flip chip packaging during reflow soldering.

This paper aims to investigate the relationships between key mediators, namely, Muslim-friendly context and the intention of tourists to revisit edu-tourism destinations in Terengganu.

The study engages tourists and visitors who have explored seven distinct edu-tourism destinations, with a total sample size of 384 participants. Data analysis is conducted using the Statistical Package for the Social Sciences and Analysis of Moment Structures for structural equation modeling.

Findings indicate that Muslim-friendly does not mediate the relationship between tourism operators, events and investment concerning tourists revisiting Terengganu. However, it plays a significant mediating role between local communities, educational institutions and tourism organizations.

Despite valuable insights, limitations arose due to a lack of Terengganu-specific literature on Muslim-friendliness in edu-tourism, leading to reliance on studies about Sharia-compliant hotels, the broader tourism industry and Islamic tourism.

The thriving halal tourism industry’s growth has heightened awareness of Muslim-friendly destinations, like Terengganu. The state actively promotes diverse halal services for Muslim travelers, encouraging operators to prioritize Sharia-compliant facilities. Strategic marketing and government support for Sharia-compliant edu-tourism investments aim at fostering economic growth and ensuring sustainability.

Social implications stress the need for inclusivity and cultural sensitivity in Terengganu’s tourism. Prioritizing Muslim-friendly services not only boosts economic growth but also fosters an inclusive and welcoming environment for diverse travelers. Government support for Sharia-compliant edu-tourism investments aligns development with cultural and religious values, promoting a harmonious and inclusive society.

This research explores Terengganu’s innovative edu-tourism approach, prioritizing Muslim-friendly services for diverse travelers. By emphasizing Sharia-compliant facilities and investments, the region aims to foster economic growth and create an inclusive cultural environment.

This study aims to examine the antecedents of tourist citizenship behavior (TCB). It also investigates the role of digital halal literacy (DHL) and religiosity in enhancing TCB.

This quantitative research used survey with questionnaire as the data collection methods. The samples of this study were 400 tourists who visited tourist destinations in five cities/municipals in West Sumatra Indonesia. This research used partial least square structural equation model as the data analysis tools.

This study found that satisfaction, trust and DHL are significant antecedents of TCB. In addition, satisfaction had a direct impact on TCB and influenced TCB through trust as a mediator. This study also found that religiosity had a direct influence on DHL, satisfaction and trust.

The findings will provide insights to tourist destination managers as well as the government on how to motivate tourists to participate in the development of Halal tourism in Indonesia. The tourists should gain sufficient knowledge or literacy about Halal, and especially in the digital context. Therefore, this will lead to their satisfaction, trust and willingness to participate in tourism development such as providing assistance to other tourists in the destinations.

This research has identified a new variable, DHL, which has not been addressed previously. This research has extended social exchange theory by establishing a relationship between TCB and DHL that has also not been previously explored. In addition, this study has investigated several relationships between DHL, satisfaction, trust and TCB and has shed new insights in the context of Halal tourism. This study has also provided a more comprehensive model of the relationship between DHL, satisfaction, trust and citizenship behavior specifically in Halal tourism research.

This paper aims to present experimental and finite volume method (FVM)-based simulation studies on the scaling effect on the capillary contact angle and entrant pressure for a three-dimensional encapsulation process of ball-grid array (BGA).

With the development of various sizes of BGA packages, the scaling effect of BGA model on capillary underfill (CUF) process is investigated together with the influences of different industrial standard solder bump arrangements and dispensing methods used as case study.

The experimental results agree well to the simulation findings with minimal deviation in filling time and similar flow front profiles for all setups. The results revealed that the capillary contact angle of flow front decreases in scale-up model with larger gap height observed and lengthens the encapsulation process. Statistical correlation studies are conducted and accurate regression equations are obtained to relate the gap height to the completion filling time and contact angle. CUF threshold capillary pressures were computed based on Leverett-J function and found to be increasing with the scale size of the package.

These statistical data provide accurate insights into the impact of BGA’s scale sizes to the CUF process that will be benefiting the future design of BGA package. This study provided electronic designers with profound understanding on the scaling effect in CUF process of BGA, which may be extended to the future development of miniature-sized BGA and multi-stack device.

This study relates the flow behaviour of encapsulant to its capillary contact angle and Leverett-J pressure threshold, in the CUF process of different BGA and dispensing conditions. To date, no research has been found to predict the threshold pressure on the gap between the chip and substrate.