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Article
Publication date: 13 September 2013

Ervina Efzan Mhd Noor, Amares Singh and Yap Tze Chuan

Recently nanoparticles reinforced lead free solders are vastly developed in electronics packaging industry. Studies and investigations have been conducted to learn and investigate…

882

Abstract

Purpose

Recently nanoparticles reinforced lead free solders are vastly developed in electronics packaging industry. Studies and investigations have been conducted to learn and investigate the types, properties, method, availability and importance of nanoparticles in this field.

Design/methodology/approach

Mechanical properties, melting temperature and microstructural conditions are taken into major considerations in any of the preparation on nanoparticles and being reviewed in this paper. Segregation of the types of nanoparticles being added together with their properties is summarized in this paper. High temperature reliability is crucial in providing a good viable solder and hence addition of nanoparticles have been seen to give a positive outcome in this particular property.

Findings

This paper reviews on the beneficial of the various nanoparticles addition in the solder. Briefed explanations and the factors are revealed in this review.

Originality/value

This paper reviews on the beneficial of the various nanoparticles addition in the solder.

Details

Soldering & Surface Mount Technology, vol. 25 no. 4
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 5 April 2013

Y.H. Chan, M.M. Arafat and A.S.M.A. Haseeb

The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn‐3.8Ag‐0.7Cu (SAC) solder and Cu…

387

Abstract

Purpose

The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn‐3.8Ag‐0.7Cu (SAC) solder and Cu substrate during multiple reflow.

Design/methodology/approach

The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250°C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma‐optical emission spectroscopy (ICP‐OES). The wetting behavior of the solders was characterized by analyzing the contact angles and spreading rates according to the Japanese Industrial Standard (JIS 23198‐3, 2003). The interfacial microstructure of the solder joints were investigated by field emission scanning electron microscope (FESEM) and energy dispersive X‐ray spectroscopy (EDAX).

Findings

It was found that upon the addition of 0.3 wt% Zn nanoparticles to the SAC solder, the growth of interfacial intermetallic compound (IMC) layers was retarded to a minimum value. Excessive amount of Zn nanoparticles (0.8 wt%) induced an additional IMC layer (Cu5Zn8) which increased the total IMC thickness and raising the reliability issue.

Originality/value

It is concluded that Zn nanoparticles undergo melting/reaction during reflow and impart their effect on the IMCs through alloying effects.

Details

Soldering & Surface Mount Technology, vol. 25 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 27 May 2014

Ervina Efzan Mhd Noor and Amares Singh

The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative…

855

Abstract

Purpose

The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative solder to overcome the environmental concern of lead (Pb) solder. Many researchers have studied the SAC solder alloy and found that the properties such as melting temperature, wettability, microstructure and interfacial, together with mechanical properties, are better for the SAC solder than the tin – lead (SnPb) solders. Meanwhile, addition of various elements and nanoparticles seems to produce enhancement on the prior bulk solder alloy as well. These benefits suggest that the SAC solder alloy could be the next alternative solder for the electronic packaging industry. Although many studies have been conducted for this particular solder alloy, a compilation of all these properties regarding the SAC solder alloy is still not available for a review to say.

Design/methodology/approach

Soldering is identified as the metallurgical joining method in electronic packaging industry which uses filler metal, or well known as the solder, with a melting point < 425°C (Yoon et al., 2009; Ervina and Marini, 2012). The SAC solder has been developed by many methods and even alloying it with some elements to enhance its properties (Law et al., 2006; Tsao et al., 2010; Wang et al., 2002; Gain et al., 2011). The development toward miniaturization, meanwhile, requires much smaller solder joints and fine-pitch interconnections for microelectronic packaging in electronic devices which demand better solder joint reliability of SAC solder Although many studies have been done based on the SAC solder, a review based on the important characteristics and the fundamental factor involving the SAC solder is still not sufficient. Henceforth, this paper resolves in stating all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.

Findings

Various Pb-free solders have been studied and investigated to overcome the health and environmental concern of the SnPb solder. In terms of the melting temperature, the SAC solder seems to possess a high melting temperature of 227°C than the Pb solder SnPb. Here, the melting temperature of this solder falls within the range of the average reflow temperature in the electronic packaging industry and would not really affect the process of connection. A good amendment here is, this melting temperature can actually be reduced by adding some element such as titanium and zinc. The addition of these elements tends to decrease the melting temperature of the SAC solder alloy to about 3°C. Adding nanoparticles, meanwhile, tend to increase the melting temperature slightly; nonetheless, this increment was not seemed to damage other devices due to the very slight increment and no drastic changes in the solidification temperature. Henceforth, this paper reviews all the properties of the Pb-free SAC solder system by how it is developed from overcoming environmental problem to achieving and sustaining as the viable candidate in the electronic packaging industry. The Pb-free SAC solder can be the alternative to all drawbacks that the traditional SnPb solder possesses and also an upcoming new invention for the future needs. Although many studies have been done in this particular solder, not much information is gathered in a review to give better understanding for SAC solder alloy. In that, this paper reviews and gathers the importance of this SAC solder in the electronic packaging industry and provides information for better knowledge.

Originality/value

This paper resolves in stating of all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.

Details

Soldering & Surface Mount Technology, vol. 26 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 7 April 2015

C.S. Chew, R. Durairaj, A. S. M. A. Haseeb and B. Beake

The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. % W alloy film by nanoindentation…

243

Abstract

Purpose

The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. % W alloy film by nanoindentation. It has been found that a ternary amorphous Sn-Ni-W layer formed below Ni3Sn4 IMC at the interface. In this study, mechanical properties of the IMC formed between SA solder and Ni-18 at. % W film after six times reflows were performed by nanoindentation.

Design/methodology/approach

The characterization was carried at 25°C, and 100 indents were generated. The elastic modulus and hardness were investigated.

Findings

The results showed that hardness of Ni3Sn4 IMC was higher than amorphous Sn-Ni-W phase. A slight bigger indent was observed on the Sn-Ni-W layer compared with that on the Ni3Sn4 IMC. Lower topographical height in the Sn-Ni-W layer indicated that the Sn-Ni-W phase was softer compared with the Ni3Sn4 IMC. The lower hardness and soft Sn-Ni-W phase is significantly related to the amorphous structure that formed through solid-state amorphization.

Originality/value

There are no publications about the indentation on the interfacial between the Ni-W layer and the Sn-Ag solder.

Details

Soldering & Surface Mount Technology, vol. 27 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 5 August 2014

S. Liza, A.S.M.A. Haseeb and H.H. Masjuki

The purpose of this paper was to gain a better understanding of wear behaviour of polymethylmethacrylate (PMMA) in contact with 316L stainless steel under different conditions…

210

Abstract

Purpose

The purpose of this paper was to gain a better understanding of wear behaviour of polymethylmethacrylate (PMMA) in contact with 316L stainless steel under different conditions (dry condition, distilled water and Ringer's solution). PMMA is commonly used in low-stress sliding application against metal. The effects of applied load and frequency on the wear rate of PMMA against 316L stainless steel were examined.

Design/Methodology/Approach

Tests were conducted under dry condition, in distilled water and in Ringer’s solution by using reciprocating wear machine. Worn surface morphology and composition was evaluated by scanning electron microscopy.

Findings

PMMA wear rate increases with the increase in applied load, naturally. An increase in sliding frequency increases the wear rate under dry condition, but it decreases the wear rate in water and in Ringer’s solution.

Originality value

The objective of the present work was to gain a better understanding of the wear behaviour of PMMA in contact with 316L stainless steel under different conditions (dry condition, distilled water and Ringer's solution). The effects of applied normal load and frequency on the wear rate of PMMA against 316L stainless steel at various conditions were examined experimentally. This information may have future implications for the design of materials which have a contact with physiological fluid in orthopeadic implants.

Details

Industrial Lubrication and Tribology, vol. 66 no. 5
Type: Research Article
ISSN: 0036-8792

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Article
Publication date: 28 June 2011

M.M. Arafat, A.S.M.A. Haseeb and Mohd Rafie Johan

In electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid‐liquid interface…

537

Abstract

Purpose

In electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid‐liquid interface. The purpose of this paper is to study the effect of the presence of molybdenum nanoparticles on the dissolution of copper and the formation of interfacial IMC.

Design/methodology/approach

Cu wire having a diameter of 250 μm is immersed in liquid composite solders at 250°C up to 15 min. Composite solder was prepared by adding various amount of Mo nanoparticles into the Sn‐3.8Ag‐0.7Cu (SAC) solder paste. The dissolution behavior of Cu substrate is studied for SAC and Mo nanoparticles added SAC solders. The IMCs and its microstructure between the solder and substrate are analyzed by using conventional scanning electron microscope (SEM) and field emission SEM. The elemental analysis was done by using energy‐dispersive X‐ray spectroscopy.

Findings

Generally, the dissolution of the substrate increases with increasing immersion time but decreases with the increase of the content of Mo nanoparticles in the solder. The IMC thickness increases with increasing the reaction time but Mo nanoparticles can hinder the growth of IMC layer. The presence of Mo nanoparticle is found to be effective in reducing the dissolution of copper into SAC solder.

Originality/value

The paper shows that molybdenum nanoparticles in liquid SAC solders have a prominent effect on the substrate dissolution rate and the interfacial IMC between the SAC solder and copper substrate.

Details

Soldering & Surface Mount Technology, vol. 23 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 8 February 2011

S.L. Tay, A.S.M.A. Haseeb and Mohd Rafie Johan

The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn‐3.8Ag‐0.7Cu solder.

690

Abstract

Purpose

The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn‐3.8Ag‐0.7Cu solder.

Design/methodology/approach

Cobalt (Co) nanoparticles were added to Sn‐Ag‐Cu solders by thoroughly blending various weight percentages (0‐2.0 wt%) of Co nanoparticles with near eutectic SAC387 solder paste. Blending was done mechanically for 30 min to ensure a homogeneous mixture. The paste mixture was then reflowed on a hot plate at 250°C for 45 s. The melting points of nanocomposite solder were determined by differential scanning calorimetry. Spreading rate of nanocomposite was calculated following the JIS Z3198‐3 standard. The wetting angle was measured after cross‐sectional metallographic preparation.

Findings

No significant change in melting point of the solder was observed as a result of Co nanoparticle addition. The wetting angles of the solder increased with the addition of nanoparticles, while the spreading rate decreased. Although the wetting angle increased, the values were still within the acceptable range. Scanning micrograph observations revealed that the as‐solidified microstructure of the composite solder was altered by the addition of Co nanoparticles. Microhardness of the solders slightly increased upon Co nanoparticles addition to SAC387.

Originality/value

The paper demonstrates that a simple process like paste mixing can be used to incorporate nanoparticles into solder.

Details

Soldering & Surface Mount Technology, vol. 23 no. 1
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 12 April 2011

Aemi Nadia and A.S.M.A. Haseeb

The purpose of this paper is to focus on the fabrication of SAC nanocomposites solder and discuss the effects of nanoCu addition on the structure and properties of resulted…

514

Abstract

Purpose

The purpose of this paper is to focus on the fabrication of SAC nanocomposites solder and discuss the effects of nanoCu addition on the structure and properties of resulted nanocomposite solder.

Design/methodology/approach

Ball milling is a nonequilibrium processing technique for producing composite metal particles with submicron homogeneity by the repeated cold welding and fracture of powder particles. This method is believed to offer good processablity, precise control over the solder composition, and produce more homogeneous mixture.

Findings

It is found that the melting temperature, the wetting behaviour, and hardness are improved when the Cu nanoparticles are added.

Originality/value

So far, no work has been done on the preparation of Cu nanoparticle added composite by ball milling. This paper presents the fabrication of Sn‐Ag‐Cu nanocomposite solders in a planetary ball mill process, and the data are compared with related researches done.

Details

Soldering & Surface Mount Technology, vol. 23 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 3 April 2017

Gaofang Ban, Fenglian Sun, Yang Liu and Shaonan Cong

The purpose of this paper is to focus on the fabrication of SnAgCu (SAC) nanocomposites solder and study the effect of Cu nanopowders (nano-Cu) addition on the microstructure…

132

Abstract

Purpose

The purpose of this paper is to focus on the fabrication of SnAgCu (SAC) nanocomposites solder and study the effect of Cu nanopowders (nano-Cu) addition on the microstructure evolution of resultant nanocomposite solder after reflow and thermal aging.

Design/methodology/approach

Mechanical mixing is used in this work to incorporate nanoparticles into the solder and produce more homogeneous mixture. Standard metallographic procedures are applied for microstructural analysis of solder joints.

Findings

It is found that nano-Cu doped into Sn0.7Ag0.5Cu-BiNi solder has no appreciable influence on melting temperature of the composite solder. The addition of Cu nanoparticles refines the microstructure of bulk solder and suppresses the growth of interfacial intermetallic compound (IMC) layers. However, interfacial IMC grain size increases slightly after 1.0 per cent nano-Cu added.

Originality/value

The paper demonstrates a method of nano-composite solder paste preparation by means of mechanical mixing and a comparison study of the microstructure evolution of composite solder with the basic SAC solder.

Details

Soldering & Surface Mount Technology, vol. 29 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 13 September 2013

Krystyna Bukat, Janusz Sitek, Marek Koscielski, Wojciech Niedzwiedz, Anna Mlozniak and Malgorzata Jakubowska

The purpose of this work is to investigate the influence of carbon nanotube additions to solder paste on the solder joints mechanical strength and their microstructure. In our…

376

Abstract

Purpose

The purpose of this work is to investigate the influence of carbon nanotube additions to solder paste on the solder joints mechanical strength and their microstructure. In our investigation, the basic solder paste contains 85 wt.% of the commercial Sn96.5Ag3Cu0.5 powder (with the particle sizes in the range of 20‐38 μm) and 15 wt.% of the self‐prepared middle activated rosin flux. To this paste we added the 0.01, 0.05 and 0.1 wt.% of the self‐modified CNT by functionalized them by mineral acid and than esterificated by methanol (FCNTMet) or polyethylene glycol 400 (FCNTPG). After the pastes had stabilized, the reflow soldering process of “zero ohm” chip resistors on PCBs with Ni/Au and SAC (HASL) finishes was carried out and then shear strength of the solder joints was measured. The correlations between the mechanical strength of solder joins without and with the carbon nanotubes and their microstructure were analysed.

Design/methodology/approach

For shear strength measurement of solder joints, the printed circuit boards with Ni/Au and SAC (HASL) finishes was applied. The SAC solder paste with different carbon nanotubes and the basic SAC solder paste as reference were used for this experiment. The automatic SMT line was applied for the paste screen printing; “zero ohms” chip resistors: 0201, 0402, 0603 and 0805 were placing on PWBs and then reflowing according to appropriate time – temperature profile. The shear strength of the solder joints was measured. For the solder joints microstructure analysis, the standard metallographic procedures were applied. Changes in the microstructure, the thickness of the intermetallic compounds and their chemical compositions were observed by means of the SEM equipped with EDS.

Findings

As the authors expected, the SAC solder paste with the carbon nanotubes addition improve the solder joints shear strength of the chip resistors mounted on PCBs with Ni/Au and SAC (HASL) finishes. The carbon nanotubes addition positive effects on IMCs thickness because of blocking their excessive growth.

Research limitations/implications

It is suggested that further studies are necessary for the confirmation of the practical application, especially of the reliability properties of the solder joints obtained using solder paste with chosen carbon nanotubes.

Practical implications

Taking into account the shear strength data, the best results of the “nano” SAC solder pastes were obtained for the lowest addition of the carbon nanotubes modified by esterification process, especially by the methanol compared to the polyethylene glycol 400.

Originality/value

The obtained results made it possible to draw conclusions regarding the correlation between the output of the mechanical results and the amount of the added carbon nanotubes, and also the microstructure and thickness of the IMCs of the “nano” solder joints. It can be useful from practical point of view.

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