Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. % W barrier film by nanoindentation
Abstract
Purpose
The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. % W alloy film by nanoindentation. It has been found that a ternary amorphous Sn-Ni-W layer formed below Ni3Sn4 IMC at the interface. In this study, mechanical properties of the IMC formed between SA solder and Ni-18 at. % W film after six times reflows were performed by nanoindentation.
Design/methodology/approach
The characterization was carried at 25°C, and 100 indents were generated. The elastic modulus and hardness were investigated.
Findings
The results showed that hardness of Ni3Sn4 IMC was higher than amorphous Sn-Ni-W phase. A slight bigger indent was observed on the Sn-Ni-W layer compared with that on the Ni3Sn4 IMC. Lower topographical height in the Sn-Ni-W layer indicated that the Sn-Ni-W phase was softer compared with the Ni3Sn4 IMC. The lower hardness and soft Sn-Ni-W phase is significantly related to the amorphous structure that formed through solid-state amorphization.
Originality/value
There are no publications about the indentation on the interfacial between the Ni-W layer and the Sn-Ag solder.
Keywords
Acknowledgements
The authors would like to acknowledge the financial support from Research University Grant, University of Malaya (Project no. RG 068/09AET) and Institute of Research Management and Consultancy (IPPP), University of Malaya (Project no. PS354-2009B). Special thanks to Micro Materials Ltd., UK.
Citation
Chew, C.S., Durairaj, R., Haseeb, A.S.M.A. and Beake, B. (2015), "Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. % W barrier film by nanoindentation", Soldering & Surface Mount Technology, Vol. 27 No. 2, pp. 90-94. https://doi.org/10.1108/SSMT-01-2015-0001
Publisher
:Emerald Group Publishing Limited
Copyright © 2015, Emerald Group Publishing Limited