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This paper aims to analyze the morphology transformation on the Cu₃Sn grains during the formation of full Cu₃Sn solder joints in electronic packaging.

Because of the infeasibility of analyzing the morphology transformation intuitively, a novel equivalent method is used. The morphology transformation on the Cu₃Sn grains, during the formation of full Cu₃Sn solder joints, is regarded as equivalent to the morphology transformation on the Cu₃Sn grains derived from the Cu/Sn structures with different Sn thickness.

During soldering, the Cu₃Sn grains first grew in the fine equiaxial shape in a ripening process until the critical size. Under the critical size, the Cu₃Sn grains were changed from the equiaxial shape to the columnar shape. Moreover, the columnar Cu₃Sn grains could be divided into different clusters with different growth directions. With the proceeding of soldering, the columnar Cu₃Sn grains continued to grow in a feather of the width growing at a greater extent than the length. With the growth of the columnar Cu₃Sn grains, adjacent Cu₃Sn grains, within each cluster, merged with each other. Next, the merged columnar Cu₃Sn grains, within each cluster, continued to merge with each other. Finally, the columnar Cu₃Sn grains, within each cluster, merged into one coarse columnar Cu₃Sn grain with the formation of full Cu₃Sn solder joints. The detailed mechanism, for the very interesting morphology transformation, has been proposed.

Few researchers focused on the morphology transformation of interfacial phases during the formation of full intermetallic compounds joints. To bridge the research gap, the morphology transformation on the Cu₃Sn grains during the formation of full Cu₃Sn solder joints has been studied for the first time.

This study aims to analyse the changes in the microstructure and grain orientation of the full Cu₃Sn solder joint (Cu/Cu₃Sn/Cu) during isothermal aging at 420°C.

The Cu₃Sn solder joint was fabricated through soldering Cu/Sn/Cu structure and then aged at 420°C. The microstructure evolution and grain orientation were studied by observing the cross-section and top-view surfaces of solder joints.

Original Cu₃Sn solder joint initially transformed into the full Cu₄₁Sn₁₁solder joint (Cu/Cu₄₁Sn₁₁/Cu) at 10 h and finally into the full α(Cu) solder joint (Cu/α(Cu)/Cu) at 150 h during aging. Micro-voids formed in the center of the solder joint interface during the conversion of Cu₄₁Sn₁₁to α(Cu), resulting in lower reliability of the solder joint. Cu₃Sn and Cu₄₁Sn₁₁ grains presented a column-like shape, while α(Cu) presented an irregular shape. The average grain sizes of interfacial phases first increased and then decreased during aging. Original Cu₃Sn solder joint exhibited two main textures: [100]//TD and [203]//TD. For Cu₄₁Sn₁₁, the preferred orientation of [111]//TD was found in the early nucleation stage, while the orientation of the formed full Cu₄₁Sn₁₁ solder joint was dispersed. Furthermore, α(Cu) grains exhibited {100}<100> preferred orientation.

Few researchers focused on the process of microstructure and grain orientation changes during high-temperature (> 300°C) aging of Cu₃Sn solder joint. To bridge the research gap, a high-temperature aging experiment was conducted on Cu₃Sn solder joints.

To develop electrode materials for supercapacitor with superior electrochemical performance and simple preparation process, the purpose of this study is to prepare flexible CC/NiS/a-NiS electrodes with self-supporting structure by loading hydrothermally synthesized a-NiS particles along with nano-NiS on carbon cloth by electroplating method.

The effects of current densities, temperatures and pH values on the loading amount and uniformity of the active substances during the plating process were investigated on the basis of optimization of surface morphology, crystalline structure and electrochemical evaluation as the cyclic voltammetry curves, constant current charge–discharge curves and AC impedance.

The a-NiS particles on CC/NiS/a-NiS were mostly covered by the plated nano-NiS, which behaved as a bulge and provided a larger specific surface area. The CC/NiS/a-NiS electrode prepared with the optimized parameter exhibited a specific capacitance of 115.13 F/g at a current density of 1 A/g and a Coulomb efficiency of 84% at 5 A/g, which is superior to that of CC/NiS electrode prepared by electroplating at a current density of 10 mA/cm², a temperature of 55°C and a pH of 4, demonstrating its fast charge response of the electrode and potential application in wearable electronics.

This study provides an integrated solution for the development of specifically structured NiS-based electrode for supercapacitor with simple process, low cost and high electrochemical charge/discharge performance, and the simple and easy-to-use method is also applicable to other electrochemically active composites.

The purpose of this paper is to investigate the diffusion behaviors of different atoms at the Cu/Cu3Sn interface and the vacancy formation energy, diffusion energy barrier and vacancy diffusion activation energy.

The diffusion behaviors of different atoms at the Cu/Cu3Sn interface are analyzed, and the vacancy formation energy, diffusion energy barrier and vacancy diffusion activation energy are obtained using molecular dynamics simulation. The nudged elastic band method is used to evaluate diffusion energy barrier for Cu/Cu3Sn system.

It is found that the vacancies in the Cu/Cu3Sn interface promote the interfacial diffusion, and the formation energy of Cu vacancy in the Cu crystal is larger than that in Cu3Sn crystal. In addition, the formation energies of Cu1 vacancy and Cu2 vacancy are close to each other in Cu3Sn crystal, and they are all less than the formation energy of Sn vacancy. Furthermore, the vacancy diffusion barrier and vacancy diffusion activation energy of the Cu/Cu3Sn interface are calculated, and the results show that the vacancy diffusion activation energy of Sn was higher than that of Cu. Finally, by comparison of diffusion activation energies of different diffusion mechanisms, Cu→Cu1vac is the most possible migration path at all temperatures.

It is concluded that the vacancies in Cu/Cu3Sn interface promote interfacial diffusion, and the activation energy of vacancy diffusion in most diffusion mechanisms decreases with the increase of temperature.

This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times.

Solder joints with different microstructures are obtained by ultrasonic-assisted soldering. To analyze the effect of ultrasounds on Cu₆Sn₅ growth during the solid–liquid reaction stage, the interconnection heights of solder joints are increased from 30 to 50 μm.

Scallop-like Cu₆Sn₅ nucleate and grow along the Cu₆Sn₅/Cu₃Sn interface under the traditional soldering process. By comparison, some Cu₆Sn₅ are formed at Cu₆Sn₅/Cu₃Sn interface and some Cu₆Sn₅ are randomly distributed in Sn when ultrasonic-assisted soldering process is used. The reason for the formation of non-interfacial Cu₆Sn₅ has to do with the shock waves and micro-jets produced by ultrasonic treatment, which leads to separation of some Cu₆Sn₅ from the interfacial Cu₆Sn₅ to form non-interfacial Cu₆Sn₅. The local high pressure generated by the ultrasounds promotes the heterogeneous nucleation and growth of Cu₆Sn₅. Also, some branch-like Cu₃Sn formed at Cu₆Sn₅/Cu₃Sn interface render the interfacial Cu₃Sn in ultrasonic-assisted solder joints present a different morphology from the wave-like or planar-like Cu₃Sn in conventional soldering joints. Meanwhile, some non-interfacial Cu₃Sn are present in non-interfacial Cu₆Sn₅ due to reaction of Cu atoms in liquid Sn with non-interfacial Cu₆Sn₅ to form non-interfacial Cu₃Sn. Overall, full Cu₃Sn solder joints are obtained at ultrasonic times of 60 s.

The obtained microstructure evolutions of ultrasonic-assisted solder joints in this paper are different from those reported in previous studies. Based on these differences, the effects of ultrasounds on the formation of non-interfacial IMCs and growth of interfacial IMCs are systematically analyzed by comparing with the traditional soldering process.

This study aims to analyze the shear strength and fracture mechanism of full Cu-Sn IMCs joints with different Cu₃Sn proportion and joints with the conventional interfacial structure in electronic packaging.

The Cu-Sn IMCs joints with different Cu₃Sn proportion were fabricated through soldering Cu-6 μm Sn-Cu sandwich structure under the extended soldering time and suitable pressure. The joints of conventional interfacial structure were fabricated through soldering Cu-100 μm Sn-Cu sandwich structure. After the shear test was conducted, the fracture mechanism of different joints was studied through observing the cross-sectional fracture morphology and top-view fracture morphology of sheared joints.

The strength of joints with the conventional interfacial structure was 26.6 MPa, while the strength of full Cu-Sn IMCs joints with 46.7, 60.6, 76.7 and 100 per cent Cu₃Sn was, respectively, 33.5, 39.7, 45.7 and 57.9 MPa. The detailed reason for the strength of joints showing such regularity was proposed. For the joint of conventional interfacial structure, the microvoids accumulation fracture happened within the Sn solder. However, for the full Cu-Sn IMCs joint with 46.7 per cent Cu₃Sn, the cleavage fracture happened within the Cu6Sn5. As the Cu₃Sn proportion increased to 60.6 per cent, the inter-granular fracture, which resulted in the interfacial delamination of Cu₃Sn and Cu6Sn5, occurred along the Cu₃Sn/Cu6Sn5 interface, while the cleavage fracture happened within the Cu6Sn5. Then, with the Cu₃Sn proportion increasing to 76.7 per cent, the cleavage fracture happened within the Cu6Sn5, while the transgranular fracture happened within the Cu₃Sn. The inter-granular fracture, which led to the interfacial delamination of Cu₃Sn and Cu, happened along the Cu/Cu₃Sn interface. For the full Cu₃Sn joint, the cleavage fracture happened within the Cu₃Sn.

The shear strength and fracture mechanism of full Cu-Sn IMCs joints was systematically studied. A direct comparison regarding the shear strength and fracture mechanism between the full Cu-Sn IMCs joints and joints with the conventional interfacial structure was conducted.

This study aims to investigate the effect of ultrasound on interfacial microstructures and growth kinetics of intermetallic compounds (IMCs) at different temperatures.

To investigate the effect of ultrasound on IMCs growth quantitatively, the cross-sectional area of IMCs layers over a confirmed length was obtained for calculating the thickness of the IMCs layer.

The generation of dimensional difference in normal direction between Cu₆Sn₅ and its adjacent Cu₆Sn₅, formation of bossed Cu₆Sn₅ and non-interfacial Cu₆Sn₅ in ultrasonic solder joints made the interfacial Cu₆Sn₅ layer present a non-scallop-like morphology different from that of traditional solder joints. At 260°C and 290°C, the Cu₃Sn layer presented a wave-like shape. In contrast, at 320°C, the Cu₃Sn in ultrasonic solder joints consisted of non-interfacial Cu₃Sn and interfacial Cu₃Sn with a branch-like shape. The Cu₆Sn₅/Cu₃Sn boundary and Cu₃Sn/Cu interface presented a sawtooth-like shape under the effect of ultrasound. The predominant mechanism of ultrasonic-assisted growth of Cu₆Sn₅ growth at 260°C, 290°C and 320°C involved the grain boundary diffusion accompanied by grain coarsening. The Cu₃Sn growth was controlled by volume diffusion during the ultrasonic soldering process at 260°C and 290°C. The diffusion mechanism of Cu₃Sn growth transformed to grain boundary diffusion accompanied by grain coarsening when the ultrasonic soldering temperature was increased to 320°C.

The microstructural evolution and growth kinetics of IMCs in ultrasonically prepared ultrasonic solder joints at different temperatures have rarely been reported in previous studies. In this study, the effect of ultrasound on microstructural evolution and growth kinetics of IMCs was systematically investigated.

To improve the problems as the heavy burden of sewage treatment and environmental pollution caused by the traditional sodium hydrosulfite reduction dyeing of indigo, this study aims to carry out the direct electrochemical reduction dyeing for indigo with the eco-friendly Cu(II)/sodium borohydride reduction system under normal temperature and pressure conditions.

The electrochemical behavior of Cu(II)/sodium borohydride reduction system was investigated by cyclic voltammetry. And, the dyeing performance of the Cu(II)/sodium borohydride reduction system was developed by optimizing the concentration of copper sulfate in the anode electrolyte, applied voltage and reduction time via single-factor and orthogonal integrated analysis.

The dyeing performance of the Cu(II)/sodium borohydride reduction system is superior to that of the traditional reduction dyeing with sodium hydrosulfite. In the case of the optimized condition, the soaping fastness and dry/wet rubbing fastness of the dyed fabric in the two reduction dyeing processes were basically comparable, the K/S value of electrocatalytic reduction of indigo by Cu(II)/NaBH4 is 11.81, which is higher than that obtained by traditional sodium hydrosulfite reduction dyeing of indigo.

The innovative electrocatalytic reduction system applied herein uses sodium borohydride as the hydrogen source combined with Cu(II) complex as the catalyst, which can serve as a medium for electron transfer and active the dye molecule to make it easier to be reduced. The electrochemical dyeing strategy presented here provides a new idea to improve the reduction dyeing performance of indigo by sodium borohydride.

The purpose of this paper is under the analysis framework of the system theory, analyzing the optimal contract mode of agricultural supply chain to guarantee the stability of agricultural supply chain and the equilibrium of agricultural product market, to analyze the effect of farmers’ risk attitude on the selection of contract modes and to find the way to encourage farmers’ productive effort and to avoid farmers’ hitchhiking behavior, to guarantee the stability of agricultural supply chain.

Under the guidance of the system theory, using the Stackelberg model and the nonlinear programming theory, this paper comparatively analyzes farmers’ effort (productive effort and sales effort), farmers’ income and the stability of agricultural supply system of four types of contract modes between farmers, third-party organizations and market.

First, in the agricultural market, market-type contract cannot maximize farmers’ income. The main reason is that farmers do not have enough ability to avoid market risk and to bargain. Second, for farmers of risk seeking, choosing a market-type contract and secondary-income contract can increase their income. Third, under the fixed-purchase price contract, the hitchhiking behavior would happen. Fourth, when farmers’ productive efforts are the same, farmers’ income under the secondary-income contract is higher than under the fixed-purchase price contract. Because under the secondary-income contract, farmers have the opportunity to obtain the secondary distribution of benefits, farmers’ hitchhiking behavior could be avoided.

Analyzing the contract modes between farmers and the third-party organization in the agricultural market could reduce the influence of price fluctuation, avoid the uncertainty of the relationship between the supply and demand, stimulate the productive effort of farmers and provide theoretical guidance for establishing efficient and stable agricultural supply system.

For nanostores, striving to become the community group-buying leader is gaining prominence. This paper aims to construct Hotelling linear models to investigate whether nanostores should be registered as leaders and their decisions in a competitive environment.

This paper constructs three Hotelling linear models: neither nanostore registers as community leader, only one nanostore registers as community leader and both nanostores register as community leader. The competitive operation strategies of two general nanostores under three scenarios are solved.

The study finds that nanostores without a cost advantage may benefit from being the first leader. The nanostore's preferred decisions depend on the investment cost parameters of its own and competitors which may lead to market share competition. Furthermore, consumers' sensitivity to community group-buying service has a negative effect on nanostores' profit.

The study is one of the few to consider the competition between community leaders. Besides, the study considers that the utilities functions of consumers are concurrently impacted by the service decisions, along with the price in different nanostores. It can provide nanostores useful implications in the dynamic industry.