Table of contents
Thick Film Superconductors Based on Bi2O3 Modified Y‐Ba‐Cu‐O and Bi‐Sr‐Ca‐Cu‐O Systems
M. Hrovat, S. Bernik, D. Kolar, I. Jarkovi?A superconducting material with a composition Y1−xBa2Cu3O7−3/2x − x/2 Bi2O3 (x = 0·1 and 0·2) was synthesised. The influence of Bi2O3 additions on sintering was studied…
Price/Density Tradeoffs of Multi‐chip Modules
G. MessnerWhen designing electronic systems it is very useful to analyse the relationship between the interconnection capacity of selected packaging methods and their prices. Such an…
The Optimal Choice of High Pin Count ASIC Packages
K. Gustafsson, U. Andersson, S. Ek, L.‐G. LiljestrandThe choice of high pin count ASIC packages has a major impact on the total cost and performance of the whole packaging system. Six different types of ASIC packages have been…
Processing and Diagnostics for Thick Film Superconductors Produced from Y‐Ba‐Cu‐O Materials
J.S. Choi, M. Bhalodia, S. Samph, P. Snowden, P. Yahner, K.J. ScolesThick film superconductors have been produced by screen printing and annealing pastes made from oxide powders and pre‐annealed powders. These films have been analysed by X‐ray…
The Possibilities for Applying Superconductive Ceramics to HMT (Hybrid Microelectronics Technology)
F. MiyashiroSuperconductive ceramics, at present, have not yet grown into a practical material for actual application to devices and systems, but are still in the raw material stage within…
A Thick Film Materials System for the Manufacture of Advanced Hybrid Microcircuits
R. Gee, M.V. ColemanThe environmental reliability of Series Q, a system of materials designed for advanced ‘HIC’ circuits, has been studied using three different migration‐resistance tests. —LMRT: a…
Design and Fabrication of an Ingestible Rechargeable Capsule for Thermal Monitoring
J.C. Lesho, B.M. Romenesko, A.F. HogrefeJHU/APL has developed and tested ingestible pills that telemeter core body temperature. The hybrids were manufactured as chip and wire on thick film ceramic substrates and surface…
Will ASIC Technology Demand a New Interconnection Technology instead of Soldering in Automotive Electronics?
H. DanielssonAutomotive electronics, after 1995, will be similar to aerospace electronics because there is a demand for low weight and volume together with very high speed and ultra‐high…
Glass Ceramics: An Alternative Substrate for Microwave Integrated Circuits
T. WhatleyThis paper presents the results of an investigation into alternative substrate materials to alumina and the associated techniques necessary to utilise them in microwave integrated…
The Current Situation of Japanese Hybrid Microelectronics
A. KuniokaThe status and the problems of HMT (hybrid microelectronics technology) in Japan are reviewed, and a market survey for Japan is presented.
Techniques for the Inspection of Flip Chip Solder Bonded Devices
P.A. Burdett, K.J. Lodge, D.J. PedderAfter a brief introduction to the advantages and method of construction of flip chip solder bond devices, this paper looks at different techniques that can be used to inspect…
Cooling of Hybrid Circuits with Fluorocarbon Liquids
G. De Mey, L. De VriezeThe possibilities of liquid cooling in electronics is briefly discussed. A particular application of hybrid circuit cooling is presented. Emphasis is placed on the fact that the…
W.C. Heraeus GmbH, Hanau, West Germany
Drive east from Frankfurt, upstream along the valley of the River Main, and in 25 kilometres or so you will reach Hanau, where once the brothers Grimm lived and collected the…
EMCA, Linton, Cambridge, England
EMCA has been supplying thick film materials since the mid '60s and their name will be familiar to the great majority, if not all, engaged in the manufacture of hybrid circuits…
ISHM news
The ISHM CAN‐AM Chapter recently organised a half‐day programme of paper presentations followed by a tour of a local hybrid facility. The event took place on 26 April at the…
Industry news
Janette Rowland has been appointed marketing services manager of General Hybrid. Based at their facility on Tyneside, and reporting to the general sales manager, Ms Rowland is…
New products
Electro‐Science Laboratories have recently introduced two new mixed‐bonded ternary conductors that form excellent cermet resistor terminations. Made of platinum, palladium, and…
ISSN:
1356-5362e-ISSN:
1758-812XISSN-L:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson