Microelectronics International: Volume 36 Issue 2

Dielectrophoresis velocities response on tapered electrode profile: simulation and experimental

Muhammad Izzuddin Abd Samad, Muhamad Ramdzan Buyong, Shyong Siow Kim, Burhanuddin Yeop Majlis

The purpose of this paper is to use a particle velocity measurement technique on a tapered microelectrode device via changes of an applied voltage, which is an enhancement of the…

Evaluation of fan-out wafer level package strength

Cheng Xu, Z.W. Zhong, W.K. Choi

The fan-out wafer level package (FOWLP) becomes more and more attractive and popular because of its flexibility to integrate diverse devices into a very small form factor. The…

Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds

Muhammad Nubli Zulkifli, Fuaida Harun, Azman Jalar

This paper aims to analyze the effect of surface roughness and hardness of leadframe on the bondability of gold (Au) wedge bond using in situ inspection of laser interferometer…

Aging effect in dye-sensitized solar cells sealed with thermoplastic films

Mian-En Yeoh, Adrian Jaloman, Kah-Yoong Chan

The purpose of this paper is to elucidate the aging effect in dye-sensitized solar cells (DSSCs) sealed with thermoplastic film and to compare it with unsealed DSSCs.

Design optimization of the graded AlGaN/GaN HEMT device performance based on material and physical dimensions

Nurul Aida Farhana Othman, Sharidya Rahman, Sharifah Fatmadiana Wan Muhamad Hatta, Norhayati Soin, Brahim Benbakhti, Steven Duffy

To design and optimize the traditional aluminum gallium nitride/gallium nitride high electron mobility transistor (HEMT) device in achieving improved performance and current…

Selective metallization of silicon and ceramic substrates

Piotr Kowalik, Edyta Wrobel, Janusz Mazurkiewicz

The purpose of this paper is to present the possibility of technology of chemical metallization for the production of electrodes and resistors based on Ni–P alloy on silicon (Si)…