Table of contents
Electrical properties of Pb[Zr0.35Ti0.65]O3 on PEALD Al2O3 for NVM applications
Prashant Singh, Rajesh Kumar Jha, Rajat Kumar Singh, B.R. SinghDevelopment of (1T-type) ferroelectric random access memory (FeRAM) has most actively progressed since 1995 and motivated by the physical limits and technological drawbacks of the…
The electrothermal impact on a contact metal-semiconductor: applications to the germanium–silver system
Arkadiy Skvortsov, Nikolay A. Khripach, Boris A. Papkin, Danila E. PshonkinThis study aims to examine the electromigration processes resulting from thermal overloads of semiconductor devices. While in operation, parts of such devices can heat up to 330°C…
Development of a current mirror-integrated pressure sensor using CMOS-MEMS cofabrication techniques
Shashi Kumar, Pradeep Kumar Rathore, Brishbhan Singh Panwar, Jamil AkhtarThis paper aims to describe the fabrication and characterization of current mirror-integrated microelectromechanical systems (MEMS)-based pressure sensor.
Absorption enhancement in a-Si thin-film solar cells based on silver nanopillar arrays
Boyang Qu, Peng Zhang, Jianmin Luo, Shie Yang, Yongsheng ChenThe purpose of this paper is to investigate a light-trapping structure based on Ag nanograting for amorphous silicon (a-Si) thin-film solar cell. Silver nanopillar arrays on…
High performance of quantum dots light-emitting diodes based on double transparent electrodes
Zhiwei LiThe purpose of this paper is to find an effective route to fabricate high transparent top electrode in quantum dots light-emitting diodes (QLEDs).
Facile method for synthesis of α-Co(OH)2 and their supercapacitor properties
F.F.M Shaikh, T.D. Dongale, R.K. KamatThe overall purpose of this research paper largely depends on developing an easy method to synthesis a material suitable for supercapacitor application. This paper includes the…
System in package (SiP) technology: fundamentals, design and applications
Fabio Santagata, Jianwen Sun, Elina Iervolino, Hongyu Yu, Fei Wang, Guoqi Zhang, P.M. Sarro, Guoyi ZhangThe purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked silicon submount technology. As…
ISSN:
1356-5362e-ISSN:
1758-812XISSN-L:
1356-5362Online date, start – end:
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Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson