Table of contents
A comparative analysis of interconnection technologies for integrated multilayer inductors
Stephen O’ Reilly, John Flannery, Terence O’ Donnell, Andrew Muddiman, Gerard Healy, Michael Byrne, Sean Cian Ó MathúnaMultilayer aircore inductors fabricated in a range of interconnection technologies which are MCM compatible are presented and compared. These consist of thick‐film, low…
Thin‐film processing on a thick‐film multilayer
Gerhard Klink, Andreas DrostCoating and lithography steps in thin‐film processing require planar and smooth surfaces. Usually ceramic substrates with as‐fired surface roughness of Ra < 0.1µm or with polished…
Current noise of trimmed thick‐film resistors: measurement and simulation
Achim Raab, Christian Jung, Peter DullenkopfAn investigation of laser‐trimmed thick‐film resistors’ current noise was carried out. A large number of samples from two pastes with different P‐ and L‐cuts were prepared. The…
Thermodynamic aspect of the wire‐bonding process
J. FalkThe influence of process heat, with regard to wire‐ and substrate‐materials, on the adhesion of wire‐bonds was investigated. Temperature increases up to 200°C were measured on the…
Low‐cost fibre‐chip coupling for electro‐optic EMC‐probes
Luc VanwassenhoveA straightforward flip‐chip mounting technique is described using gold bumps, a silicon motherboard and non‐conductive adhesives to fabricate electro‐optical modules coupling…
Effects of chip scale package and flip‐chip on the design and manufacturing of electronic products
Petri SavolainenCustomer demand is driving the evolution of electronic equipment towards smaller devices with increased performance and more features. At the same time, product price should…
A five‐layer thin film MCM‐Si design using oxynitride dielectrics
Jo LernoutA novel technology for a multichip module (MCM) on silicon is presented. The technology features the integration of a power and a ground plane, resulting in a five‐conductor layer…
ISSN:
1356-5362e-ISSN:
1758-812XISSN-L:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson