Table of contents
Interconnection strategies for high‐density printed circuits – an overview
Joseph FjelstadThe drive to increase the functionality and performance of electronic products has resulted in the need to increase the density of every element of the electronics assembly from…
Implementing solid solder deposits (SSDs) in PCB manufacture
J. DeBlisSolid solder deposit (SSD) technology was developed in the early to mid‐1990s to improve first pass yields in the manufacture of electronic devices. Examines the SSD process and…
Using computer models to identify optimal conditions for flip‐chip assembly and reliability
Christopher Bailey, Hua Lu, Greg Glinski, Daniel Wheeler, Phil Hamilton, Mike Hendriksen, Brian SmithFlip‐chip assembly, developed in the early 1960s, is now being positioned as a key joining technology to achieve high‐density mounting of electronic components on to printed…
Inspection of PCBs by laser‐induced fluorescence
Alex Alaluf, David BirnbaumExamines the use of laser‐induced fluorescence for the inspection of printed circuit boards. Discusses how it works, how it compares with other inspection options and what…
Numerical simulation of embedded passive components in multi‐layer PCB structures
D.M. Stubbs, S.H. Pulko, A.J. WilkinsonNumerical modelling is used to predict the thermal behaviour of embedded passive components in multi‐layer PCBs. A three‐signal layer PCB, containing embedded resistors of…
Horizontal processing for metallizing microvias
John Gebhardt, Keith Waryold, Dave Oglesby, John GravesThe demand for higher operating speeds and increasing densification in electronic packages is driving designers to reduce feature sizes in order to accommodate increases in I/O…
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari