Numerical simulation of embedded passive components in multi‐layer PCB structures

Abstract

Numerical modelling is used to predict the thermal behaviour of embedded passive components in multi‐layer PCBs. A three‐signal layer PCB, containing embedded resistors of dimensions 0.3 6 0.3mm and thickness 0.1μm, is used to generate thermal design rules that can be applied to a wide range of PCB structures containing embedded passive components. A software package using the design rules can then make fast predictions on the thermal behaviour of heat‐generating components inside such structures.

Citation

Stubbs, D.M., Pulko, S.H. and Wilkinson, A.J. (2002), "Numerical simulation of embedded passive components in multi‐layer PCB structures", Circuit World, Vol. 28 No. 1, pp. 29-33. https://doi.org/10.1108/03056120210407711