Table of contents
Comparison of Dry Film and Liquid Photo‐imageable Solder Masks for Surface‐mount Assemblies
G.M. Tilsley, F.J. AxonThe need for high packing density has led to a requirement for photo‐imageable solder masks, and the increase in surface mount technology is rapidly expanding the use of these…
Low Dielectric Constant—The Substrate of the Future
J. Balde, G. MessnerLow dielectric constant printed circuit board materials are becoming available. There are four or more materials that can produce boards with a dielectric constant of 28. This…
PC Based CAD for the Electronics Designer
R.D. Battell, J.C. WallaceThis paper is more than just a guide to the points to look for when contemplating the purchase of a CAD system for electronics to run on personal computers. It offers many helpful…
New Copper Surface Treatment for Polyimide Multilayer Printed Wiring Boards
H. Akahoshi, K. Kogawa, Y. Suzuki, M. WajimaA new treatment method for the copper innerlayers of polyimide multilayer printed wiring boards has been developed. Conventional oxide coatings experience acid penetration through…
Developments in Passive Thermal Management Systems for Electronics
S. HamiltonIncreasing power densities within electronic equipment have led to a rise in the number of heat related problems being experienced. This paper describes the use of computerised…
Critical Aspects of Multilayer Manufacture
M. Bayes, K. Chiba, Y. KurokawaThe key to the production of high quality multilayer PWBs lies in a clear understanding of the many interactions between the chemical and mechanical processing involved. This…
Contamination Problems within SMT
B.N. EllisThis paper is intended as a guide towards increasing the reliability of electronics assemblies, particularly SMAs, by going through the stages of production and examining the…
Phototools for Printed Circuit Board Production: Part 2
H. Junginger, W. WernerPhotographic films and glass plates are widely used as phototools for PCB production. In this two‐part paper photographic and physical characteristics of the products are…
Evolution of Glass Finish Technology in the Past Decade
D.J. Vaughan, N. TsujiokaOver the past ten years, there has been continuing development of coupling agent technology and the utilisation of these materials in treating reinforcing fibres in composite…
The Impact of Microwave Theory on MLBs for High‐speed Digital Applications‐Design, Production, Qualification
A.L.M. AngstenbergerMultilayer boards for high‐speed digital applications are no longer solely substrates for the electrical interconnections needed but play an active role regarding the overall…
A New, One‐component Dicy‐free Epoxy Resin System Developed for FR‐4 Glass/Epoxy Laminates
D. SextonThis new system does not use dicyandiamide or any other amine as the curing agent and has no problems with crystallisation either of the varnish or on the prepreg. The system can…
Printed Circuit World Convention IV June 2–5, 1987 TOKYO JAPAN: Part 2
Lorna CullenIn this second part of the report on Printed Circuit World Convention IV held at the Tokyo Prince Hotel, Tokyo, from 3–5 June 1987, a general synopsis of the content of the papers…
Print Service BV, Echt, Holland
Lorna CullenA gloriously sunny August day set the natural beauty of the Limburg countryside off to perfection during Circuit World's brief journey through this area to visit Print Service BV…
Shipley Europe Ltd, Coventry, England
Lorna CullenCelebrating in 1987 thirty years of activity, predominantly in the field of electroless chemicals for the printed circuit industry, the Shipley organisation worldwide can…
ICT News
This two‐week course held in May 1987 at Oxford University Department for External Studies comprised an interesting and comprehensive programme of instructive lecture sessions…
Industry news
Christine MuirM & T Chemicals have announced the appointment of Mr David Smith as Director of PCB Systems and as a member of the company's Board of Management. Mr Smith, who was formerly Sales…
New products
New from Design Environmental is a range of advanced design Humidity/Temperature Test Chambers. Although the machines offer a very high specification in terms of equipment and…
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari