SMT conference with renowned keynote speakers: Sino-European RoHS Dialogue on March 21, 2007

Citation

(2007), "SMT conference with renowned keynote speakers: Sino-European RoHS Dialogue on March 21, 2007", Soldering & Surface Mount Technology, Vol. 19 No. 1. https://doi.org/10.1108/ssmt.2007.21919aab.002

SMT conference with renowned keynote speakers: Sino-European RoHS Dialogue on March 21, 2007

SMT conference with renowned keynote speakers: Sino-European RoHS Dialogue on March 21, 2007

From March 21 to 23, 2007, the China SMT Forum (International Conference and Exhibition on Surface Mount Technologies and Microelectronic Packaging Technologies) will premier at the Shanghai International Convention Center. The organization of this highly specialized professional event, which is accompanied by an exhibition and focuses explicitly on the demands of the Chinese SMT market, was conducted by Stuttgart-based Business Media China AG (BMC) in cooperation with the Shanghai Science & Technology Development and Exchange Center.

Around 300 participants from China and Asia are expected to attend the two- day conference that starts on March 22. Developers, manufacturers, and users of SMT systems as well as technology decision makers are among the target groups. The concept of the top-notch conference program was developed under the direction of Prof. Mathias Nowottnik from the University of Rostock and comprises six sessions with 22 presentations. The topics “Lead-free Implementation” “Advance Circuit Assembling” “New Printed Circuit Board Technologies” “Development in Packaging” “Solutions for Reliable Assemblies” as well as “Electronics Market & Future Trends” form the main focuses of the conference. Prof. Wolfgang Scheel, Head of the Module Integration and Board Interconnection Technologies Department at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, is among the renowned keynote speakers. In the context of his speech titled “The Development of PCB for the Next Decade” Scheel will point out how the stronger system integration will develop the printed circuit board into a multifunctional system platform and, as a consequence, how this will create the necessity of a closer linkage between microsystems technology and printed circuit technology. Dr Shangguan Dongkai, Vice President for Assembly Technology and Platform Realisation at Flextronics International, is among the keynote speakers as well. The topic of the lecture of the US-resident Chinese scientist will be “Electronics Products Miniaturization and Its Impact on the Supply Chain”. He makes the assumption that packaging and assembly group manufacturing technologies are predominantly accelerated by customer expectations of end products. Also, trends like miniaturisation, enhancement of functional density and integration, fulfillment of environmental standards, flexible market adjustment, cost efficiency and high reliability are emphasized. Furthermore, Prof. Hans- Jürgen Albrecht from the Corporate Technology Department of Siemens AG and Hubertus von Janecek, Vice President Sales at Bosch Sensortec, will hold keynote speeches on the China SMT Forum.

On the afternoon of March 21, 2007, the program contains the tutorial “Sino- European RoHS Dialogue”. Here, Dr Jutta Müller (Fraunhofer IZM) and Chinese experts will provide information about the demands and the implementation of the RoHS process in China and Europe. The first China SMT Forum will be rounded off with a table-top exhibition directly connected to the conference. This concept enables interested providers to present products in a flexible, time-saving and cost-effective way. Moreover, it offers the possibility for conference participants to gather practically relevant information on SMT-related technologies.

The complete conference program as well as background information is available on www.chinasmtforum.com. The organiser BMC will be glad to answer inquiries of interested exhibitors or trade visitors under, Phone: +49 711 490 890 29 or E-mail: es@businessmediachina.com. BMC is an international stock exchange listed media company, which combines key competences in exhibition organization, trade publishing, and advertising media solutions. BMC was founded by Klaus M. Hilligardt, who also created the SMT/Hybrid/Packaging in Nuremberg.