New flip-chip underfill now available from Henkel

Citation

(2005), "New flip-chip underfill now available from Henkel", Soldering & Surface Mount Technology, Vol. 17 No. 4. https://doi.org/10.1108/ssmt.2005.21917dad.001

New flip-chip underfill now available from Henkel

New flip-chip underfill now available from Henkel

Keywords: Epoxy resins

Hysol^® FP4548FC provides superior fracture resistance; improves thermal cycling performance

The electronics group of Henkel has brought to market its latest high purity, liquid epoxy encapsulant material, Hysol^® FP4548FC. The advanced material has been designed specifically for use as an underfill for flip-chip devices and provides superior flow and more robust processing capability as compared to competitive products.

Hysol FP4548FC features a low coefficient of thermal expansion (CTE) and low shrinkage – characteristics that are perfect for low k die applications. When fully cured, the material creates a rigid, high-strength, low-stress seal that dissipates solder joint stress, greatly extends thermal cycling performance and simplifies the assembly process.

Manufacturers transitioning to lead-free processes can confidently use Hysol FP4548FC, as the material is compatible with Pb-free manufacturing requirements. The unique formulation of Hysol FP4548FC also makes it ideally suited for flip-chip devices that require crack and fracture resistance and, due to its flux compatibilizers, the material works very well with most available no-clean fluxes. In most cases, post-assembly flip-chip cleaning processes may be eliminated, saving manufacturing time and capital resources.

Hysol FP4548FC is JEDEC Level 3/260°C qualified and is ideal for ASICs and all advanced packages that require a low CTE.

For more details, visit: www.electronics.henkel.com