On display at Productronica 2005, proven Pb-free from Almit

Citation

(2005), "On display at Productronica 2005, proven Pb-free from Almit", Soldering & Surface Mount Technology, Vol. 17 No. 4. https://doi.org/10.1108/ssmt.2005.21917dac.002

On display at Productronica 2005, proven Pb-free from Almit

On display at Productronica 2005, proven Pb-free from Almit

Keywords: Electronics industry, Trade fairs, Solder paste

Almit Technology offers an extensive range of advanced lead-free solder materials and chemicals. The company's Pb-free solder paste formulations and solder wire have been proven in use for many years in production facilities worldwide (Plate 2).

Plate 2 Almit Technology have an extensive range of advanced lead-free solder materials and chemicals

LFM-48 TM HP Pb-free solder paste from Almit is a latest generation tin-copper-silver alloy formulation exhibiting good wetting, easy low-residue printing with long screen and tack life. It is already approved by, and in use with, major manufacturers around the world, and is suitable for both open blade printing and enclosed print head systems.

The world's best cored solder wire from Almit, is now available in industry standard 96.5 percent Sn-3 percent Ag-0.5 percent Cu Pb-free alloy. The KR-19SH RMA wire retains all the benefits and advantages of the original product to deliver excellent wetting, high reliability and low residue. It is available is a range of diameters from 0.3 to 1.6 mm on 0.5 kg reels – and in selected sizes on Almit's new anti-static Handy Reels™.

Almit is a true technology leader in the field of materials jointing. The Japanese corporation has been supplying Pb-free solder materials for volume electronics manufacturing production in its home market for over 4 years, and to the automotive industry for almost a decade. Addressing these localised lead-free process requirements has put Almit ahead of the curve in the global Pb-free changeover initiative now in progress to meet the 2006 deadline.