Keywords
Citation
(2005), "Lead-free design for manufacture assembly workshop<", Soldering & Surface Mount Technology, Vol. 17 No. 4. https://doi.org/10.1108/ssmt.2005.21917dab.003
Publisher
:Emerald Group Publishing Limited
Copyright © 2005, Emerald Group Publishing Limited
Lead-free design for manufacture assembly workshop<
Lead-free design for manufacture assembly workshop<
Keywords: Electronics industry, Workshops
Table-Top Exhibition, Thursday 20 October 2005, EADS Astrium, Stevenage, Hertfordshire
9.30 a.m.: Registration & Exhibition
10.00 p.m.: Introduction and overview of the LEADOUT Project
Lead-Free Design for manufacture workshop will include:
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Component specification, selection and WEEE & RoHS compatible
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Laminate changes, options and industry trends
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Through hole pad sizes and fillet lifting
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PCB Supports - Eliminating Warp and sag
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Via hole plating and reliability with lead-free processes
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Copper thickness and lead-free copper erosion
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Solder finish selection, storage life and process compatibility
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Eliminating wave soldering with intrusive reflow
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CAF and reliability in lead-free
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Solder mask specification
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Optimising hole fill with lead-free intrusive reflow
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Multilayer thermal break design
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Through hole solder thieve designs
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Modifying breakouts for lead-free
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Optimising SMT placement for lead-free
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Modification of paste stencil apertures
Question and Answer Session on Lead- Free design and production process issues
Delegates can pose questions prior to the workshop to guarantee a detailed answer; these can be e-mailed to technical@smartgroup.org the best questions posed will win Lead- FreeInteractive Training CD-ROMs.
Workshop concludes at 4.30 p.m. The event is part of SMART Group's participation in the European LEADOUT Programme.
Cost is £50 SMART Group members/£100 Non members+VAT