Note from the publisher

Citation

(2002), "Note from the publisher", Soldering & Surface Mount Technology, Vol. 14 No. 3. https://doi.org/10.1108/ssmt.2002.21914caa.002

Note from the publisher

Throughout 2003 Soldering & Surface Mount Technology will continue to provide a central, authoritative and independent forum for the exchange of information pertaining to the research, development and application of all branches of soldering and surface mount technologies. Through plans to expand the Editorial Advisory Board throughout next year, the Editor and Publisher are confident that Soldering & Surface Mount Technology will continue to deliver high quality, cutting edge papers.

If you have a paper that you would like to be considered for publication in Soldering & Surface Mount Technology, then please contact David Whalley at d.c.whalley@lboro.ac.uk David will be pleased to hear from you if you have a state of the art technical paper, a research paper, a case study or a review article that you would like publishing.

As an author, you can be sure that your work will be widely disseminated due to the international exposure to leading industrial and academic institutions via the Emerald database and distribution to all SMART Group members. Also, your work will be further disseminated through the indexing and abstracting services covering Soldering & Surface Mount Technology, including ISI. Indeed, for the year 2000 the journal enjoyed an ISI impact factor of 0.342, demonstrating how widely and frequently papers are cited.

Electronic usage of Soldering & Surface Mount Technology has continued to increase for the period May 2001 to April 2002. During this time the journal had over 20,000 visits on the web site with users in the UK, USA and the Far East being the most active. The benefits of having an electronic archive are clear to see when we look at the most accessed article for this period. As we can see below, content from over 3 years ago continues to be regularly accessed alongside more recent content:

Most accessed articles for the period May 2001 to April 2002

Lead-free reflow soldering for electronics assembly

M R Harrison, J H Vincent, H A H SteenVolume 13 Number 3

A high-performance lead-free solder-the effects of In on 99.3Sn/0.7Cu

J S Hwang, Z Guo, H KoenigsmannVolume 13 Number 2

Microstructure investigation of Sn-0.5Cu-3.5 Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders

L Ye, Z H Lai and A TholenVolume 13 Number 3

Critical factors affecting paste flow during the stencil printing of solder paste

R Durairaj, T A Nguty, N N EkereVolume 13 Number 2

Ceramic chip scale package solder joint reliability

J Seyyedi and J PadgettVolume 13 Number 3

Microstructural characterisation of reflowed and isothermally aged Cu and Ag particulate reinforced Sn-3.5Ag composite solders

F Guo, S Choi, J P Lucas, K N SubramanianVolume 13 Number 1

Effects of Pb contamination on the eutictic Sn-Ag solder joint

S Choi, T R Bieler, K N Subramanian, J P LucasVolume 13 Number 2

Tin pest in lead-free solders

Y Kariya, C Gagg, W J PlumbridgeVolume 13 Number 1

The role of intermetallic compounds in lead-free soldering

P G Harris and K S ChaggerVolume 10 Number 3

Materials behaviour and the reliability in performance of solder joints

W J PlumbridgeVolume 11 Number 3

Do not forget to use your electronic entitlement as a subscriber to Soldering & Surface Mount Technology. Also, tell us about the articles you like, and the subjects you would be interested to see covered in the journal.

Contact Managing Editor, Sharon Parkinson at sparkinson@emeraldinsight.com