Keywords
Citation
(2002), "Stencil cleaning frame optimises efficiency", Soldering & Surface Mount Technology, Vol. 14 No. 2. https://doi.org/10.1108/ssmt.2002.21914bad.005
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
Stencil cleaning frame optimises efficiency
Keywords: Soldering
A highly-effective frame system, specifically for handling solder paste/glue stencils during the cleaning process, has been developed by Tecan Ltd.
With the new approach, the stencil is easily and quickly transferred, from the printing frame to the dedicated cleaning frame, and fixed using a simple quick-release mechanism. In addition to double-ended axial tensioning the readily adjustable cleaning frame has mid-section support to stabilise the stencil, avoiding damage throughout the cleaning cycle.
Saving time and money, typically for medium and high volume PCB manufacturers, the frame overcomes traditional problems, such as accidental damage and inconsistent cleaning, encountered while transferring stencils to and from the cleaning area and in the cleaning machines and tanks themselves. Some producers attempt to clean stencils while they are still attached to their re- mountable printing frames, a common practise, which can bring further problems. For example, prolonged exposure to today's cleaning solutions can inflict terminal damage to printing frames, significantly reducing overall operational efficiency.