Viscom's 4M camera module increases test speed and passage height

Citation

(2002), "Viscom's 4M camera module increases test speed and passage height", Soldering & Surface Mount Technology, Vol. 14 No. 2. https://doi.org/10.1108/ssmt.2002.21914bad.004

Viscom's 4M camera module increases test speed and passage height

Keywords: Cameras, Sensors

Viscom's new 4M sensor modules boost throughput without sacrificing depth of inspection. With 4 megapixels per module, Viscom has succeeded in increasing this throughput by approximately 40 per cent. At the same time, the passage height of 35mm has become the standard height in Viscom test systems. In the past, speed and high testing depth often were contradictory requirements. With Viscom's new 4M-modules, high testing quality is achieved with a throughput that has been increased by up to 40 per cent.

The compact design 4M-module offers an orthogonal view of an overall picture area of 56mm x 44mm. The resolution of 4 megapixels and the optimized data transfer put the efficiency of modern processors and computer systems to optimum use, while it is not necessary to accept any cutbacks with regard to the tried and tested resolution of approximately 22µm per pixel.

Due to the small size of the new module, the system layout of larger assembly groups also takes on less critical dimensions. The costly adaptation of the lighting equipment and the drastically enlarged inspection surface result in an upper passage height of 35 mm, and thus in a new standard for Viscom inspection systems. As with the previously used SI-module, the 4M- module is suitable for solder paste inspection and for testing wave and reflow soldered printed circuit boards.