Keywords
Citation
(2002), "Void free soldering – inline reflow and vacuum furnace", Soldering & Surface Mount Technology, Vol. 14 No. 2. https://doi.org/10.1108/ssmt.2002.21914bad.003
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
Void free soldering – inline reflow and vacuum furnace
Keywords: Soldering, Reflow
The new ATV reflow/vacuum inline furnace from PESL uses the proven ATV "no void" technology for soldering bump modules, wafers, power devices and similar components. This is of value where, perfect connection is needed to minimise signal distortion or heat build-up.
The multi-platten furnace can handle wafers up to 300mm diameter (assemblies 300 x 300 x 85mm) at temperatures up to 420°C with a controlled temperature profile using nitrogen based atmospheres enriched with formic acid. This improves surface de-oxidation of metal contact areas at low temperatures for best wetting of solder.
The penultimate platten is optionally configured as a vacuum stage operating at approximately 5 x 10- 2 mbar. The combination of controlled atmosphere, temperature profiling and vacuum chamber ensures that voids are minimised in process and removed prior to cooling on the final stage watercooled platten.
This comprehensive approach leads to reliable void free results with solder paste and without flux. This style of multi-step inline oven replaces batch vacuum ovens for laser/RF/automotive/ power modules/IGBT/DCB/wafer bump/uBGA reflow, Polyimide/epoxy/photo resist curing and SiAu alloying.