Citation
(2000), "Brighton 2000: opportunities and challenges into the future for electronics manufacturing", Soldering & Surface Mount Technology, Vol. 12 No. 3. https://doi.org/10.1108/ssmt.2000.21912cab.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2000, MCB UP Limited
Brighton 2000: opportunities and challenges into the future for electronics manufacturing
Brighton 2000: opportunities and challenges into the future for electronics manufacturing
Old Ship Hotel, Brighton, UK,21-23 November 2000
An event organised by The SMART GroupThis conference is a must for companies associated with electronics assembly wanting to keep abreast of the latest manufacturing developments, and requiring to improve the efficiency of their processes and the reliability of their products.
This is an opportunity for you to spend time with others in electronics manufacturing, to network with your peers, to get the pulse of the industry, and to learn things that will have an immediate impact on your company's business.
Includes:
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12 half-day technical workshops;
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debate: "lead-free … where now?";
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keynote address;
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a technology roadmap for the industry;
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workshop on contract manufacturing;
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discussion on marketing & knowledge transfer;
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table-top exhibition;
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conference gala dinner for your guests;
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book stall, videos, CDs, and lots more;
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opportunities to meet with experts, industry leaders, and friends.
To lead-free or not to lead-free, that is the question1800h Tuesday 21 NovemberKnowledgeable speakers from the industry will debate the reasons for change to lead-free soldering, from both commercial and environmental viewpoints. What will the legislation and commercial pressures really require of you in the future? Financial and technical issues will be addressed.
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Why are we all considering changing a soldering alloy that has worked successfully for hundreds of years when the reasons for change are not clear?
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Are the new lead-free alloys really as reliable as reports have indicated?
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Will small companies be able to absorb the increased cost of manufacture?
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Where is the evidence that lead is leaching into the water table from dumped electronics?
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Will components be capable of withstanding the elevated soldering temperatures?
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Why can military products and electronics for space applications be exempt?
This is a debate. You can have your say. Come prepared to be controversial, stimulating, provocative, outrageous …
The National Physical Laboratory is donating five "Lead-free soldering" interactive CD-ROMs for the best questions asked or points made from the floor of the debate.
You can pose your question prior to the conference, online at: www.smartgroup.org
The debate will be chaired by Bob Willis, Vice President of the SMART Group.
Learn more about the technical omplementation of lead-free assembly by registering for workshop W9.
The great debate1800-1930h Tuesday 21 NovemberThe 2000 conference will start with a debate on a technical issue, just as the last conference in 1998 did. This year it will be the "Great lead-free debate".
This is a wonderful opportunity to make your views known and have all your questions answered by a team of knowledgeable speakers. Join all the conference delegates and exhibitors at the start of the opening night of the 4th European Surface Mount Conference organised by the SMART Group.
The debate and discussion will then continue informally during a splendid buffet for all delegates.
12 technical workshopsThese half-day workshops, all given by people with real practical experience and good communication skills, are FREE to conference delegates, but numbers will be strictly limited. Participation is by ticket only: apply on the registration form. You may select up to three of the workshops: one on Wednesday morning (22 November), one on Thursday morning (23 November), one on Thursday afternoon (23 November).
W1 – troubleshooting the SMT soldering process0900h Wednesday 22 NovemberRoss Berntson, Indium Corporation of America.
Workshop objectivesThis course will provide solder paste users with solutions to common SMT process problems and soldering defects by analysing the interaction between solder paste, assembly processes, machine types, and equipment settings. Most importantly, the course will develop strategies for optimising each step in the SMT soldering process.
Workshop content
You will gain the ability to:
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Understand the composition and functional properties of solder paste.
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Utilise standard tests to ensure product quality.
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Comprehend various types of problems encountered during soldering.
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Understand the reasons for, and mechanisms of, these problems.
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Determine the types of stresses placed on solder paste during conditioning, printing, placement, and reflow.
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Evaluate solder paste needs and expectations for new technology.
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Develop practical problem solving approaches to SMT defects.
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Optimise output by understanding the capabilities and limitations of solder paste.
Who should attendThis course is intended for engineers, supervisors, managers, scientists, technologists, and technicians who are responsible for eliminating the soldering defects common to many SMT processes. This course is essential for those responsible for designing assemblies, selecting solder paste and soldering equipment, and optimising the soldering process.
InstructorRoss B. Berntson is the Manager of Technical Services at Indium Corporation of America. He has extensive experience optimising soldering processes at SMT manufacturing locations around the world.
W2 – Design for manufacture of complex circuit boards0900h Wednesday 22 NovemberDennis Price, Kemitron.
Workshop objectivesTo highlight the effects that design decisions can have on batch yields, costs and circuit integrity.
Workshop content
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multilayer manufacturing sequences;
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surface finishes;
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batch yields and costs, versus technology;
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impedance control criteria;
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micro-via and build-up technologies;
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chip-on-board techniques.
Who should attendPrinted circuit board designers. Process, production and quality engineers.
InstructorDennis Price is the Technical & Quality Director of Kemitron plc, in North Wales. His workshop instructor team will include well-known industry figures in the above subjects as well as Kemitron applications engineering personnel.
W3 – X-ray inspection of surface mount solder joints0900h Wednesday 22 NovemberMartin Wickham, Surface Mount Club.
Workshop objectivesAfter completing this workshop you will be able to:
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assess your own company's requirements for X-ray inspection;
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understand how to carry out an evaluation of X-ray equipment;
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ensure cost effective X-ray solder joint inspection within your production facilities;
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understand the benefits and limitations of X-ray inspection for ball grid arrays.
Workshop contentThis tutorial will explain to participants the techniques and the criteria which can be used to inspect surface mount solder joints using X-rays. It will include guidance on the effectiveness of these techniques and how they can best be incorporated with in-process inspections to give maximum and cost effective defect identification. The tutorial will utilise a wide range of photographs and X-ray images.
The course will include a discussion of X-ray inspection types, costs and capabilities, as well as consideration of contract X-ray inspection services. It will cover transmission X-ray, automatic transmission X-ray, angled transmission X-ray, and X-ray laminography techniques. Particular emphasis will be given to X-ray inspection of ball grid arrays.
The course will cover production issues: where and when in-process solder joint inspection is feasible, as well as the benefits and disadvantages for a wide range of manufacturing environments. Also included will be the combinations of in-process and visual inspection techniques that can be used to maximise defect coverage. Methods of inspecting and avoiding common surface mount defects will be addressed.
Who should attendManagers, quality engineers, production and process engineers, senior support staff and all those wishing to assess options for X-ray inspection of solder joints.
InstructorMartin Wickham is the Principal Consultant of the UK Surface Mount Club. He has a vast experience as a consultant to industry and in running courses and practical workshops for engineers in the electronics manufacturing industry.
W4 – Solder paste evaluation, fine pitch and BGA stencil printing0900h Wednesday 22 NovemberMalcolm Warwick, Multicore Solders; Alan Hobby, DEK Printing Machines.
Workshop objectivesTo give solder paste users an appreciation of:
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the benefits and limitations of off-line solder paste testing as a way of assessing its suitability for a process;
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the optimisation and evaluation of the stencil printing process in fine pitch and BGA applications.
Workshop contentThe common tests for powders, solder paste fluxes and solder pastes described in standards and specifications will be discussed. Gauge capability test results will be given where appropriate. The implications in using these tests to monitor process capability will be considered. Additional tests that have been used at Multicore will also be described.
The workshop will then move on to the printing process itself. Ways in which the printing machine can be set up and optimised for top quality fine pitch printing, will be addressed. To achieve zero defect printing, the role of each parameter in the process must be understood. This workshop will enable you to have that understanding.
Who should attendPurchasing and engineering staff responsible for solder paste specification and approval. Process line engineers and production managers and staff.
InstructorsMalcolm Warwick is International Director-Product Development, at Multicore Solders. Alan Hobby is an Applications Specialist with DEK Printing Machines.
W5 – BGA and CSP rework0900h Thursday 23 NovemberSimon Hawkins, Metcal.
Workshop objectivesThis workshop will enable you to understand the theory and practice of fine-pitch, BGA and CSP rework. It will also enable you to gain hands-on experience with the latest rework techniques.
Workshop content
The workshop will cover:
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conduction and convection techniques;
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an introduction to fine-pitch, ball grid array (BGA) and chip-scale package (CSP) components;
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component removal and pad cleaning;
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solder paste deposition techniques;
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component placement;
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thermal profiling requirements for rework;
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a rework clinic on delegates specific circuit boards.
You are invited to bring your rework examples for discussion.
Who should attendProduction and process engineers as well as rework technicians who want to gain experience in the latest rework techniques. The workshop is particularly aimed at companies who face the challenges of BGA and CSP rework.
InstructorSimon Hawkins is a metallurgist who has specialised in hand soldering and rework technologies with Metcal. His research and development experience with the International Tin Research Institute and his production engineering experience with Dolby Laboratories have given him a wealth of understanding of rework techniques.
W6 – VOC-free soldering. Can you solder with water?0900h Thursday 23 NovemberKoen Hollevoet, Interflux Electronics.
Workshop objectivesThis workshop will enable you to implement, successfully, soldering processes using VOC free fluxes. Volatile organic compounds (VOCs) are coming under greater and greater scrutiny and environmental regulation throughout the world. This may seem a far-away issue for electronics manufacturers, but environmental taxes in some countries have already had an impact on the use of organic chemicals. This workshop will help companies address this up-coming environmental issue and position themselves for a potentially necessary process change.
Workshop contentThe workshop will answer the following:
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What is a VOC?
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How can I solder with water?
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What are the advantages?
It will also address the following:
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The distinction between "water based" and "water soluble".
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Safe no-clean VOC-free fluxes.
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The advantages of VOC-free fluxes: avoidance of contact problems with in-circuit test, soldermask incompatibility, smells and toxic fumes, ionic contamination, poor solderability.
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Cost savings.
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Process modifications and optimisation.
In this workshop you will learn how to make even the oldest soldering machine ready for this new flux technology, without huge investment. The workshop will teach you about the hidden process bottlenecks, how to overcome them, and widen the process window.
Who should attendProduction and process engineers and managers in electronics manufacturing companies. Those responsible for meeting environmental, health & safety requirements within the company.
InstructorKoen Hollevoet is the Technical Director of Interflux Electronics. For many years he has been involved in the implementation of no residue soldering processes around the world. He was responsible for gaining MIL-Spec approval for no-clean soldering and has innovatively introduced OSP finishes to the no-clean process. In recent years he has gained a lot of practical experience with the introduction of VOC-free no-clean processes.
W7 - Solder joint reliability0900h Thursday 23 NovemberBill Plumbridge, Open University; Angus Westwater, Rohm Electronics.
Workshop objectivesThe workshop will provide an overview of the factors which affect solder joint reliability. Emphasis will be placed upon the performance of sound well-prepared joints and methods of inspection, both before and during service. Common modes of failure will be discussed. The mechanical properties influencing service performance will be reviewed, and the requirements for accurate life prediction, and better reliability, will be highlighted.
Participants in the workshop will:
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appreciate the sources and modes of failure in solder joints;
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be aware of the methods of examination and their applicability;
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understand the common mechanisms of failure in service;
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have a "feel" for the relative merits of common lead-free alloys and eutectic tin-lead solder, in terms of their mechanical properties;
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become familiar with the requirements for reliable life prediction.
Workshop content
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causes of failure in processing and performance;
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inspection before and after service;
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examples of common failure modes;
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appropriate mechanical properties of lead-free and tin-lead alloys;
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reliable life prediction.
Who should attendAnyone involved in electronics manufacture, design, production and quality management. It should be of particular interest to those undertaking board and joint testing, or contemplating the implementation of lead-free technology.
InstructorsBill Plumbridge is Professor of Materials Engineering at the Open University. He has been involved in evaluating the mechanical behaviour of engineering materials for over 30 years and established a Solder Research Team seven years ago.
Angus Westwater is General Manager for LSI products at Rohm Electronics UK. He is responsible for the management of the Rohm quality assurance "Component Failure Analysis Centre" involving him in the introduction and reliability assessment of lead-free solder joints.
W8 – Pin-in-Hole Reflow0900h Thursday 23 NovemberHartmuth Schmidt, Harting KGA; Bob Willis, Electronic Presentation Services.
Workshop objectivesAlmost all market sectors benefit from the use of surface mount technology. One problem in optimising the manufacturing process has been the incorporation of through-hole components when no direct equivalent surface mount components are available. It is possible to hand solder conventional through-hole components after the surface mount soldering is completed, but this is a time consuming operation and may leave more flux residues on the joint causing a problem with in-circuit test. During test, residues can quickly clog test pins in a no-clean process. A range of selective soldering equipment is available to semi or fully solder automatically, through-hole leads. This does however require capital expenditure on equipment. This workshop will show you how to avoid this by soldering all surface mount and throughhole components in one operation, using pin-in-hole-reflow (PIHR), or "intrusive reflow" which greatly simplifies the manufacturing process.
Workshop content
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PCB design and component requirements;
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possible assembly stages;
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PIHR advantages and disadvantages;
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paste application by stencil printing, double stencil printing, or by dispensing;
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stencil aperture calculations;
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soldering pallet support;
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reflow soldering profiles;
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inspection requirements;
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microsection analysis;
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evaluation;
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process defects.
Who should attendThe course is suited to all those involved in conventional and surface mount products, particularly designers, process engineers, purchasing departments and supervisors. Also those engineers tasked with the elimination of wave soldering or with cost reduction. The course is also valuable for suppliers, to understand better the needs of the customer.
InstructorsHartmuth Schmidt is a technical adviser with Harting KGA, in Germany. Bob Willis runs a training and consultancy business, Electronic Presentation Services.
W9 – Lead-free assembly and soldering1330h Thursday 23 NovemberChristopher Hunt, National Physical Laboratory.
Workshop objectives
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become informed on the current move to lead-free manufacturing around the world, with a perspective on the legislation and commercial pressures;
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gain an awareness of the technology challenges and solutions;
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have an awareness of the equipment issues;
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have know/edge of the process issues for achieving lead-free soldering;
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know where to seek expert advice;
Workshop content
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the latest legislative and commercial pressures;
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the technology challenges for implementing lead-free;
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the availability of alloys, components, and equipment;
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selecting the correct reflow profile;
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solderability: the wetting power of lead-free alloys, the benefits of nitrogen inerting, and the influence of flux efficacy;
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component durability during the process;
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how viable is lead-free today?
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awareness of action groups in the lead-free arena, and sources of help.
Who should attendManagers and engineers will find this workshop essential in familiarising themselves with, and appreciating the various issues that have to be addressed in meeting the challenge of lead-free assembly.
InstructorChris Hunt heads up the electronics interconnection work at the National Physical Laboratory. The research at NPL enjoys significant government support but includes many industry-funded projects. Chris was a member of the team that authored the two DTI reports on lead-free soldering. He chairs the ISO committee on solders and fluxes, and is a member of IEC TC91 which formulates international standards, as well as/PC committees for soldering standards. Chris has presented papers and workshops at numerous international conferences, and has authored papers in the scientific and the trade press.
W10 – Design for manufacture, design for assembly1330h Thursday 23 NovemberRichard Lassen, Intel Denmark.
Workshop objectivesIn the electronics industry today the term "Design for manufacture" (DFM) is applied in many different levels of concurrent product development. What is DFM and when can a design team truly state that they are in fact designing for manufacture? This workshop will go through different approaches to DFM both from the factory perspective and the engineering perspective. This workshop will enable you to implement successfully DFM in future product design to make the assembly/manufacturing process run flawlessly from the initial launch of the product through to production.
Workshop contentThis workshop will cover the following topics:
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factory process baseline;
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is the factory able to meet and support DFM?;
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critical function parameters;
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documented process control leading to process definition;
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failure mode analysis;
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concurrent development;
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when should DFM considerations commence?;
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who is responsible for DFM?;
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different organisational structures that support DFM;
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motivators for DFM;
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pros and cons for management, for marketing and for manufacturing when applying DFM;
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best business compromises;
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what justifies overruling and what justifies compliance?;
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how to measure the success and product health;
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why DFM?
Who should attendThis workshop is suited to all involved in electronics manufacture, especially designers, process engineers, quality managers and purchasing staff.
InstructorRichard Lassen is the Manufacturing Engineering Manager of Intel at Heriev in Denmark.
W11 – Simultaneous double-sided reflow soldering1330h Thursday 23 NovemberKeith Bryant, Loctite.
Workshop objectives
In any manufacturing process there are always opportunities to improve its efficiency, reduce the number of process stages, or reduce the cost of manufacture. Simultaneous double side reflow soldering is a new process for consideration, which has been demonstrated to work successfully and offer benefits to users. The process involves screen printing solder paste and placing components on both sides of the board with the option of using throughhole components. The whole assembly is then run through a single reflow soldering process to solder both sides simultaneously, including the through-hole components. The process is being trialed by two Japanese companies and several European companies. It was also featured on the Nepcon TAC line in April this year. This workshop will give you the process steps, demonstrate the benefits and leave you being able to understand and consider adopting the process.
Workshop content
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process sequence;
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advantages and disadvantages of the process;
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solder pastes;
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adhesive requirements;
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adhesive dispensing;
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component placement;
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adhesive curing;
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reflow soldering;
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conveyorisation;
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final inspection;
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process issues;
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process results;
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justification of moving to a new process.
An interactive CD-ROM will be given to each of the delegates on this workshop.
Who should attendThis workshop is for production, process and quality managers, as well as those who influence technical and commercial decisions within your company.
InstructorKeith Bryant is the Electronics Industry Manager for Loctite. At the workshop he will be assisted by a team of Loctite technical staff.
W12 – Flip-chip assembly and underfill1330h Thursday 23 NovemberBruce Seaton, Speedline Technologies.
Workshop objectivesThe use of flip-chips, ball grid arrays (BGA), and chip-scale packaging (CSP) is growing in importance to design and assembly engineers. The use of these advanced packaging techniques is being driven by the need to miniaturise, for example in hand-held products. Reliability concerns have focussed attention on the possible failure modes in BGA and CSP joints, increasing the interest in the use of underfill materials to extend the fife of solder interconnections. The workshop will provide you with a better understanding of chip-scale design, assembly, soldering, encapsulation, and reliability. It will illustrate many practical examples of products using advanced packaging techniques, and demonstrate their benefits.
Workshop content
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flip-chip assembly overview;
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alternative package types;
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package production;
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CSP bailing;
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design rules for board layout;
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placement requirements;
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soldering processes;
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under-fill requirements;
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cycle time enhancements;
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materials for encapsulation;
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dispensing processes;
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fundamentals for under-fill and encapsulation;
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curing processes;
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process quality monitoring;
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reliability enhancement.
Who should attendDesigners, production staff and those tasked with product reliability maintenance.
InstructorBruce Seaton has responsibility within Speedline for developing the technologies and markets for new assembly processes.
Remember
Your conference registration includes up to three of these 12 workshops. Participation is by ticket only and you must apply on the registration form. Choose only one workshop from each group:
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22 November (morning): W1 W2 W3 W4
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23 November (morning): W5 W6 W7 W8
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23 November (afternoon): W9 W10 W11 W12
Conference delegates will receive the workshop notes for all 12 workshops.
Keynote address1400h Wednesday 22 November 2000The SMART Group is pleased and honoured to welcome Dieter Bergman, Director of Technology Transfer at IPC, the US-based trade association for the electronics interconnection industry.
The IPC has a worldwide membership which it encourages into active participation in technology programmes, management improvement, creation of standards, protection of the environment, and industrial/government relationships.
Dieter Bergman is an entertaining and enlightening speaker, known in the industry around the world. His Keynote Address "The electronics industry … into the future" will reflect on the industry at the dawn of a new century and move on to the emerging technologies likely to become commonplace in the future. The Address will lead quite naturally into the next discussion, on developing a technology roadmap.
A technology roadmap for the industry1440h Wednesday 22 November 2000The Keynote Address will be followed by a workshop for everybody at the Brighton event, aimed at developing a technology roadmap, charting the way forward for the UK and European electronics industry. We need this foresight to identify and meet the arising challenges and the opportunities, enabling robust competitiveness in the global market.
The discussion will be led and stimulated by a number of invited technical directors and research managers who are, and will be, the key players in identifying and driving forward the technologies of the future.
Table-top exhibitionThe event benefits from a small tabletop exhibition, in the conference hotel, where our refreshments will be served. Each conference delegate will receive an exhibition catalogue.
Conference gala dinnerThe gala dinner on Wednesday evening, 22 November is open to guests of conference delegates. Why not reserve a whole table? (ten seats at a round table). Call Tony Gordon at the SMART Group office.
SMART Group BookstallThere will be a stall selling books and SMART Group products such as training videos and CDs. MCB, the publisher of the SMART Group technical journal Soldering & Surface Mount Technology will also be exhibiting at the hotel.
Missed past opportunities?This is the fourth biennial European Surface Mount Conference organised by the SMART Group. Did you miss the previous splendid events at the Old Ship Hotel in Brighton? Make sure that you don't make the same mistake this year.
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15-17 November 1994;
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12-14 November 1996;
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10-12 November 1998;
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21-23 November 2000.
A special workshop: choosing and developing a sub-contractWednesday 22 November 1545-1700hLawrence Faulkner, Prism Electronics; Speaker t.b.a, Jabil Circuits.
ObjectivesContract electronics manufacture is a huge and rapidly growing business. Why do companies choose to contract out their manufacturing? If the benefits are so clear, perhaps your company should consider the option.
Who should attendDecision-makers within electronic manufacturing companies, plus those that offer technical and financial advice to influence the decisions. Also welcome are other contract manufacturers.
InstructorsThe workshop and discussion will be led by representatives from two contract manufacturing companies; Jabil Circuits, a large high volume contract house and Prism Electronics, a manufacturer of modest volumes of complex products.
A discussion – marketing and knowledge transfer in the electronics industryWednesday 22 November 1545-1700hMike Judd, PR Director of The SMART Group chairs this session at which you will get advice on the best ways to market your products or promulgate your knowledge in the technical press.
A distinguished panel includes:
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Stephen Keeping, former publisher of Electronic Production and The Good PCB Guide who has authored a series of articles on how to promote your company and products.
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Trevor Galbraith, Associate Editor of the SMART Group technical journal Soldering & Surface Mount Technology, will suggest ways to improve writing and submitting technical articles, and how such articles can form part of a company's marketing strategy.
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Cathy Turner, MCB University Press, and Managing Editor of Soldering & Surface Mount Technology, will raise the issues concerned with electronic means of information dissemination.
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Denal McDonald, publisher of AMT magazine, will offer words of wisdom on how to market in the Irish electronics industry.
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Jon Barrett, of E.M.P., will discuss the power of quality images for use in magazines.
Each will give a short presentation leading into a debate and questions from the floor. Other members of the press are warmly invited to join a lively but relaxing discussion.
Delegate registrationPlease note that during the conference, admission to the Old Ship Hotel will be by Registration Ticket only.
There is a choice of registration options:
- 1.
Standard package:
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two nights in the conference hotel;
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all meals and refreshments from dinner on evening of Tuesday 21 November to afternoon tea on Thursday 23 November (including the conference gala dinner);
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participation in up to three half-day technical workshops (subject to ticket availability), chosen from a list of 12 workshop titles;
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workshop notes from all 12 workshops;
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delegates contact details;
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conference booklet and exhibition catalogue;
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keynote address;
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special workshops and discussions;
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table-top exhibition.
£450+VAT (£550 + VAT for non-SMART-members).
- 1.
No-accommodation package:
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As for the standard package, but no bed-and-breakfast is included.
£325 + VAT (£425 + VAT for non-SMART-members).
Arrangements for partnersThe extra cost for a partner sharing a room in the conference hotel for the two nights is £60 + VAT. This covers two nights bed-and-breakfast only.
It does NOT include any other meals, refreshments or receptions. Meal tickets for partners can be purchased: contact Tony Gordon at the SMART Group office.
Conference gala dinnerThe conference registration fee includes one ticket for the conference gala dinner on 22 November. The gala dinner is open to the guests of conference delegates and exhibitors. Guest tickets can be bought at £35 + VAT.
Conference hotelAvailable accommodation at the conference hotel will be assigned strictly on a first-come basis. When accommodation at the Old Ship Hotel becomes unavailable you will be registered on the "'No-accommodation package", and must make your own hotel arrangements.
Brighton's oldest hotel, the Old Ship abounds with charm and enjoys a reputation for comfort and personal service. Occupying prime position on the sea front, the Old Ship has been part of Brighton for over 400 years. It has hosted royal gatherings and it was from the Old Ship that King Charles II escaped to France in 1651. It has also been the hiding place of smugglers over the centuries.
The Old Ship Hotel has recently been acquired by the Paramount Hotel Group. During 1999 and 2000 the whole hotel has undergone extensive refurbishment and upgrading.
Brighton's popularity as a seaside resort arose in regency times in the late 17th century when it first became fashionable to "take the waters". The hotel is a few minutes stroll from the magnificent Regency Pavilion, the Victorian Palace Pier, the town centre, and the specialist shops in the famous Brighton Lanes.
Old Ship Hotel, Kings Road, Brighton BN11NR, Tel: + 44 (0) 1273 329 001, Fax: + 44 (0) 1273 820 718.
Car parkingAll 70 places in the hotel car park are reserved for conference delegates, but you must make your own reservation. The cost is £10 per day (no cheaper but more secure and more convenient than the public car park). Please telephone or fax hotel requesting a car parking place. Be sure to mention you are a conference delegate. Pay the hotel upon your departure. There is a public underground car park alongside the hotel (Lanes Car Park) that has a time-dependent scale of charges.
The SMART GroupA guiding influence in the electronics industry
The SMART Group (Surface Mount & Related Technologies) was inaugurated in 1984 specifically to promote leading-edge manufacturing technologies in electronics assembly. Today we have grown to become the foremost association of its kind in Europe with over 500 member companies, and offices in England, Ireland and Scotland.
The SMART Group promotes the advancement of the electronics manufacturing industry through education, training and notification of its members, and by the promotion of a community of electronics manufacturing professionals. This is accomplished by active encouragement of member inter-activity, through meetings, seminars, conferences and publication of technical information.
Contact: Tony Gordon, The SMART Group, 94 Easton Street High Wycombe Buckinghamshire HP11 1LT, UK. Tel: + 44 (0) 1494 465 217; Fax: + 44 (0) 1494 473 975; E-mail: info@smartgroup.org; Web Site: www.smartgroup.org