Keywords
Citation
(1999), "Launch of affordable system for BGA inspection", Soldering & Surface Mount Technology, Vol. 11 No. 3. https://doi.org/10.1108/ssmt.1999.21911cad.013
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
Launch of affordable system for BGA inspection
Launch of affordable system for BGA inspection
Keywords X-TEK, Inspection, Ball grid array, X-ray
The Model CPX x-ray inspection system launched by X-TEK at Nepcon UK represents a new direction for the company. Well known and respected for their range of fully automated x-ray inspection systems, the company feels strongly that less expensive manual systems offered by competitors do not fully meet the needs of BGA inspection.
With more companies now using ball grid arrays, flip chip and MicroBGAs, there is a need for inspection that offers more than locating short circuits and voiding conditions these are fairly easy to find. The CPX will find the more difficult or intermittent open circuits and determine between balls on BGAs. The system will automatically scan and calculate, to give a failure analysis.
The CPX offers better resolution and the ability to manipulate the sample, even at right angles, to view the ball wetted through the board. It has some of the capabilities of the all encompassing systems.
For further information contact Stuart Wright or Steve Hursey, X-TEK Systems Ltd, 64-66 Akeman Street, Tring, Herts HP23 6AF, UK. Tel: +44 (0)1442 828700; Fax: +44 (0)1442 828118. www.xtec.co.uk