A study on the thermomechanical response of various die attach metallic materials of power electronics
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 9 May 2024
Issue publication date: 15 May 2024
Abstract
Purpose
In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis.
Design/methodology/approach
During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.
Findings
The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations.
Originality/value
This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.
Keywords
Acknowledgements
This research was financed by the German Academic Exchange Service (Deutscher Akademischer Austauschdienst – DAAD) under the reference number 91873913. The authors also wish to deeply thank the IMTEK – University of Freiburg for providing the necessary tools to conduct this study.
Citation
Gharaibeh, M.A. and Wilde, J. (2024), "A study on the thermomechanical response of various die attach metallic materials of power electronics", Soldering & Surface Mount Technology, Vol. 36 No. 3, pp. 192-199. https://doi.org/10.1108/SSMT-12-2023-0068
Publisher
:Emerald Publishing Limited
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