Gate Array Packaging—The Forgotten Problem
Abstract
As semi‐custom devices increase in complexity, much time is being devoted to solving the problems of automating their design. The associated problems of packaging are being overlooked. The increasing pin count is becoming a major problem. Surface mount components and hybrid circuits are proposed as a solution.
Citation
Silver, N. (1983), "Gate Array Packaging—The Forgotten Problem", Microelectronics International, Vol. 1 No. 2, pp. 35-36. https://doi.org/10.1108/eb044131
Publisher
:MCB UP Ltd
Copyright © 1983, MCB UP Limited