Processing Polymer Thick Film Circuitry with Radiation Curing
Abstract
Polymer thick film, as an additive process for making circuitry, is not new but has recently received considerable attention. The process has a number of attractive features to offer and when radiation curing is used to accelerate the curing process the technology becomes even more attractive. To be accepted by industry on a large scale, however, these materials must be certified by independent circuit board testing laboratories. Using infra‐red as the curing process, Methode prepared a polymer thick film version of a test pattern used for testing to Mil 55110 and produced some very promising results.
Citation
Green, W.J. (1983), "Processing Polymer Thick Film Circuitry with Radiation Curing", Microelectronics International, Vol. 1 No. 2, pp. 12-13. https://doi.org/10.1108/eb044124
Publisher
:MCB UP Ltd
Copyright © 1983, MCB UP Limited