Process Modelling Maps for Solder Paste Printing

Abstract

This paper presents a technique for mapping the modelling of manufacturing processes, in which process maps are used to represent information on the models and modelling technique (including assumptions used), process and equipment parameters, physical sub‐processes, process variables, and the process performance in terms of quality and/or defects. The mapping approach uses the top‐down methodology, in which any manufacturing process can be represented in a structured, multi‐layered manner, with each layer representing a different level of the modelling spectrum. This structure is designed to provide a clear overview of the process and sub‐processes, and their interactions, while the finer details of the modelling process are still presented at the lower levels of the map. This mapping approach is illustrated with the modelling of the Printing of Solder Paste for the reflow soldering of SMT devices. This case study shows how the mapping process can be used to identify the key research issues, specify the experimental work required, and also identify the analytical modelling techniques which are appropriate for each process (and sub‐process).

Citation

Ekere, N.N., Lo, E.K. and Mannan, S.H. (1994), "Process Modelling Maps for Solder Paste Printing", Soldering & Surface Mount Technology, Vol. 6 No. 2, pp. 4-11. https://doi.org/10.1108/eb037861