SM Placement Technology: Part 2

Abstract

This paper, which will be published in two parts in consecutive issues of Soldering & Surface Mount Technology, reproduces a chapter of the recently published book ‘Handbook of Printed Circuit Technology: New Processes, New Technologies’, edited by G. Herrmann and K. Egerer and published by Electrochemical Publications Ltd, Port Erin, Isle of Man.

Citation

Pawlischek, H. (1993), "SM Placement Technology: Part 2", Soldering & Surface Mount Technology, Vol. 5 No. 3, pp. 53-58. https://doi.org/10.1108/eb037841