The Influence of Metal Plating of Chip Carriers on Reliability of SMT Solder Joints under Thermal Cycling

Abstract

An experimental set‐up and a simulated ceramic chip carrier to study SMT solder joint reliability under thermal cycling have been developed. The influence of metal plating of the chip carrier on the reliability of the SMT solder joints under thermal cycling has been studied statistically.

Citation

Huang, J.H. and Li, H.Z. (1993), "The Influence of Metal Plating of Chip Carriers on Reliability of SMT Solder Joints under Thermal Cycling", Soldering & Surface Mount Technology, Vol. 5 No. 3, pp. 18-20. https://doi.org/10.1108/eb037836