Production Validation of SERA Solderability Test Method

Abstract

The sequential electrochemical reduction analysis (SERA) method was evaluated in production and demonstrated to provide a non‐destructive, objective measure of the solderability of production printed wiring boards. Approximately 1000 boards were analysed just before wave soldering and the SERA parameters were correlated with the soldering defect occurrence rates. The data show that PWB solderability is determined primarily by the nature of the surface tin oxide, as reflected in the corresponding SERA plateau voltage, rather than by the oxide thickness. By proper choice of the value of the plateau voltage used as the criterion for solderability, the most advantageous trade‐off between the costs of rejected boards and the rework of defects can be made.

Citation

Tench, D.M., Kendig, M.W., Anderson, D.P., Hillman, D.D., Lucey, G.K. and Gher, T.J. (1993), "Production Validation of SERA Solderability Test Method", Soldering & Surface Mount Technology, Vol. 5 No. 1, pp. 46-50. https://doi.org/10.1108/eb037813