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Fine Pitch Solder Creams

A.C. Chilton, K.W. Gaugler

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 March 1990

23

Abstract

There is continuous pressure in the electronics industry towards miniaturisation. This has led to the development of fine pitch soldered devices, and this paper considers the concept of solder creams which use a restrictive flux system as suitable for this work, rather than those that employ finer powder. It is shown that the latter type of solder cream must use metal powders with a higher oxide content which will require the cream to contain a more active flux.

Citation

Chilton, A.C. and Gaugler, K.W. (1990), "Fine Pitch Solder Creams", Soldering & Surface Mount Technology, Vol. 2 No. 3, pp. 58-60. https://doi.org/10.1108/eb037733

Publisher

:

MCB UP Ltd

Copyright © 1990, MCB UP Limited

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