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Temperature Variations in Soldering and Their Influence on Microstructure and Strength of Solder Joints

M. Nylén, S. Norgren

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 February 1990

38

Abstract

Since the introduction of surface mounting technology (SMT), interest in solder joints has increased greatly. In this work soldered joints were examined for different kinds of components. Factors which influenced the temperature cycle most strongly were the component size and its placing on the circuit board. These factors led to significant differences in maximum temperature and cooling rate between different solder joints on one and the same circuit board. The microstructure of the solder joints could then be related to their individual cooling rates. The near ternary eutectic Sn‐Pb‐Ag solder presented large variations in microstructure for the interval of cooling rates which was investigated. Strengths of the joints are therefore expected to vary because of the relation between microstructure and strength. Dissolution of elements from metallised coatings can also influence markedly the structures and properties in the solder joints.

Citation

Nylén, M. and Norgren, S. (1990), "Temperature Variations in Soldering and Their Influence on Microstructure and Strength of Solder Joints", Soldering & Surface Mount Technology, Vol. 2 No. 2, pp. 15-20. https://doi.org/10.1108/eb037714

Publisher

:

MCB UP Ltd

Copyright © 1990, MCB UP Limited

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