Quantitative Solderability Measurement of Electronic Components: Part 2: An Index of Solderability

Abstract

The wetting balance is used for the measurement of solderability of electronic components. The wetting force is measured dynamically and the technique gives information about both the degree and the speed of wetting. For practical quality assessment of electronic components, a simple‐to‐use index is required that incorporates the data on both degree and speed of wetting. The index must also have a uniform discrimination between different wetting properties, across the full range encountered in practical soldering. This paper reviews critically the numerous indices suggested in the literature, and supports with quantitative data the choices previously made subjectively in some soldering standards.

Citation

Lea, C. and Dench, W.A. (1990), "Quantitative Solderability Measurement of Electronic Components: Part 2: An Index of Solderability", Soldering & Surface Mount Technology, Vol. 2 No. 1, pp. 14-22. https://doi.org/10.1108/eb037702