Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage

Abstract

Purpose

The purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS).

Design/methodology/approach

In this study, HTS at 250 °C was carried out to investigate the reliability of nano-silver sintered joints. Combining the evolution of the microstructure and shear strength of the joints, the degradation mechanisms of joints performance were characterized.

Findings

The results indicated that the degradation of the shear properties of sintered nano-silver joints on copper substrates was attributed to copper oxidation at the silver/copper interface and interdiffusion of interfacial elements. The joints decreased by approximately 57.4% compared to the original joints after aging for 500 h. In addition, severe coarsening of the silver structure was also an important cause for joints failure during HTS.

Originality/value

This paper provides a comparison of quantitative and mechanistic evaluation of sintered silver joints on bare copper substrates during HTS, which is of great importance in promoting the development of sintered silver technology.

Citation

Jiang, M., Liu, Y., Li, K., Pan, Z., Sun, Q., Xu, Y. and Tao, Y. (2024), "Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage", Soldering & Surface Mount Technology, Vol. 36 No. 1, pp. 1-7. https://doi.org/10.1108/SSMT-12-2022-0061