Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 8 July 2020
Issue publication date: 4 January 2021
Abstract
Purpose
The purpose of this paper is to investigate the effect of carbon nanotube (CNT) addition on microstructure, interfacial intermetallic compound (IMC) layer and micromechanical properties of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint under blast wave condition. This work is an extension from the previous study of microstructural evolution and hardness properties of Sn-Ag-Cu (SAC) solder under blast wave condition.
Design/methodology/approach
SAC/CNT solder pastes were manufactured by mixing of SAC solder powder, fluxes and CNT with 0.02 and 0.04 by weight percentage (Wt.%) separately. This solder paste then printed on the printed circuit board (PCB) with the copper surface finish. Printed samples underwent reflow soldering to form the solder joint. Soldered samples then exposed to the open field air blast test with different weight charges of explosives. Microstructure, interfacial IMC layer and micromechanical behavior of SAC/CNT solder joints after blast test were observed and analyzed via optical microscope, field emission scanning microscope and nanoindentation.
Findings
Exposure to the blast wave induced the microstructure instability of SAC305/Cu and SAC/CNT/Cu solder joint. Interfacial IMC layer thickness and hardness properties increases with increase in explosive weight. The existence of CNT in the SAC305 solder system is increasing the resistance of solder joint to the blast wave.
Originality/value
Response of micromechanical properties of SAC305/CNT/Cu solder joint has been identified and provided a fundamental understanding of reliability solder joint, especially in extreme conditions such as for military applications.
Keywords
Acknowledgements
The authors are gratefully acknowledged the financial support from Universiti Kebangsaan Malaysia (UKM) under MI-2018-019 grant and Universiti Pertahanan Nasional Malaysia (UPNM) under grant FRGS/1/2015/SG06/UPNM/03/1, and Redring Solder (M) Sdn. Bhd. for research materials and collaboration work.
Citation
Ismail, N., Jalar, A., Abu Bakar, M., Safee, N.S., Wan Yusoff, W.Y. and Ismail, A. (2021), "Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition", Soldering & Surface Mount Technology, Vol. 33 No. 1, pp. 47-56. https://doi.org/10.1108/SSMT-11-2019-0035
Publisher
:Emerald Publishing Limited
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