Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 19 September 2023
Issue publication date: 10 January 2024
Abstract
Purpose
The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP), which contains Cu-3.28 wt.% Ti, on its interfacial reaction with Sn-9.0 wt.% Zn (SnZn) solder, using the liquid/solid reaction couple technique.
Design/methodology/approach
The SnZn/C1990 HP couples were subjected to a reaction temperature of 240–270°C for a duration of 0.5–5 h. The resulting reaction couple was characterized using a scanning electron microscope, energy dispersive spectrometer, electron probe microanalyzer and X-ray diffractometer.
Findings
It was observed that the scallop-shaped CuZn5 and planar Cu5Zn8 phases were formed in almost all SnZn/C1990 HP couples. With increased reaction duration and temperature, the Cu-rich intermetallic compound (IMC)-Cu5Zn8 phase became a dominant IMC formed at the interface. The total thickness of the IMCs was increased with the increase in the reaction duration and temperature. The IMC growth obeyed the parabolic law, and the IMC growth mechanism was diffusion controlled. The activation energy of the SnZn/C1990 HP couple was 64.71 kJ/mol.
Originality/value
This article presents an analysis of the IMC thickness in each sample using ImageJ software, followed by kinetic analysis using Origin software at various reaction temperatures of SnZn/C1990 HP in liquid/solid couples. The study also includes detailed reports on the morphology, interface composition and X-ray diffraction analysis, as well as the activation energy. The findings can serve as a valuable reference for electronic packaging companies that utilize C1990 HP substrates.
Keywords
Acknowledgements
The authors acknowledge financial support from the Applied Research Center for Thin-Film Metallic Glass from The Featured Areas Research Center Program and the Ministry of Science and Technology, Taiwan, R.O.C. (Grant No. MOST 109-2221-E-011-092 and MOST 111-221-E-011-110-MY3). The authors are also thankful for the help from Mr S.C. Laiw who works at the National Taiwan University of Science and Technology for SEM-EDS operation, Mr C.Y. Kao who works at the National Taiwan University and Mrs S.Y. Tsai who works at the National Tsing Hua University for carrying out the EPMA analysis.
Funding: The authors acknowledge the financial support from the National Science and Technology Council, Taiwan, R.O.C. (Grant No. MOST 109-2221-E-011-092 and MOST 111-221-E-011-110-MY3).
Author contribution: All authors have helped in research design, data collection and analysis, writing and improving the overall quality of the manuscript.
Data availability: All data generated or analyzed during this study are provided in this manuscript.
Declarations: All authors have also declared the following: (1). The article is original. (2). The article has been written by the stated authors who are ALL aware of its content and approve its submission. (3). The article has not been published previously. (4). The article is not under consideration for publication elsewhere. (5). No conflict of interest exists, or if such conflict exists, the exact nature must be declared. (6). If accepted, the article will not be published elsewhere in the same form, in any language, without the written consent of the publisher.
Citation
Laksono, A.D., Chen, C.-M. and Yen, Y.-W. (2024), "Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple", Soldering & Surface Mount Technology, Vol. 36 No. 1, pp. 30-38. https://doi.org/10.1108/SSMT-05-2023-0027
Publisher
:Emerald Publishing Limited
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