Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 14 October 2020
Issue publication date: 4 January 2021
Abstract
Purpose
This study aims to investigate the vibration effects on ball grid array lifetime.
Design/methodology/approach
Several finite element method simulations and experiments were performed.
Findings
An optimized circuit configuration was found.
Originality/value
The originality of paper is confirmed by authors.
Keywords
Acknowledgements
This project is supported by National Natural Science Foundation of China (Grant No. 51765001, 11764002) and Key research projects of North Minzu University in 2019 (Grant No. 2019KJ35, 2019KJ34).
Citation
Gao, Y., Wang, F., Ding, S., Yang, B., Liu, L. and Salmani, M. (2021), "Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies", Soldering & Surface Mount Technology, Vol. 33 No. 1, pp. 1-7. https://doi.org/10.1108/SSMT-05-2020-0020
Publisher
:Emerald Publishing Limited
Copyright © 2020, Emerald Publishing Limited