Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model

Abstract

Purpose

The simulated temperature profile of the printed circuit board assembly (PCBA) during reflow soldering process deviates from the actual profile. To reduce this relative deviation, a new strategy based on the Kriging response surface and the Multi-Objective Genetic Algorithm (MOGA) optimizing method is proposed.

Design/methodology/approach

The simulated temperature profile of the PCBA during reflow soldering process deviates from the actual profile. To reduce this relative deviation, a new strategy based on the Kriging response surface and the MOGA optimizing method is proposed.

Findings

Several critical influencing parameters such as temperature and the convective heat transfer coefficient of the specific temperature zones are selected as the correction parameters. The hyper Latins sampling method is implemented to distribute the design points, and the Kriging response surface model of the soldering process is constructed. The updated model is achieved and validated by the test. The relative derivation is reduced from the initial value of 43.4%–11.8% in terms of the time above the liquidus line.

Originality/value

A new strategy based on the Kriging response surface and the MOGA optimizing method is proposed.

Citation

Yin, Y., Zhou, H., Chen, C., Zheng, Y., Shen, H. and Gong, Y. (2022), "Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model", Soldering & Surface Mount Technology, Vol. 34 No. 1, pp. 45-57. https://doi.org/10.1108/SSMT-01-2021-0002