Chemical mechanical polishing of steel substrate using aluminum nanoparticles abrasive slurry

Abstract

Purpose

Chemical mechanical polishing (CMP) has attracted much attention recently because of its importance as a nano-scale finishing process for high value-added large components that are used in the aerospace industry. The paper aims to discuss these issues.

Design/methodology/approach

The characteristics of aluminum nanoparticles slurry including oxidizer, oxidizer contents, abrasive contents, slurry flow rate, and polishing time on aluminum nanoparticles CMP performance, including material removal amount and surface morphology were studied.

Findings

Experimental results indicate that the CMP performance depends strongly on the oxidizer, oxidizer contents, and abrasive contents. Surface polished by slurries that contain nano-Al abrasives had a lower surface average roughness (Ra), lower topographical variations and less scratching. The material removal amount and the Ra were 124 and 7.61 nm with appropriate values of the process parameters of the oxidizer, oxidizer content, abrasive content, slurry flow rate and polishing time which were H₂O₂, 2 wt.%, 1 wt.%, 10 ml/min, 5 min, respectively.

Originality/value

Based on SEM determinations of the process parameters for the polishing of the surfaces, the CMP mechanism was deduced preliminarily.

Citation

Peng, D.-X. (2014), "Chemical mechanical polishing of steel substrate using aluminum nanoparticles abrasive slurry", Industrial Lubrication and Tribology, Vol. 66 No. 1, pp. 124-130. https://doi.org/10.1108/ILT-10-2011-0078